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HX24C16DRG

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HANSCHIP semiconductor EEPROM, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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HX24C16DRG

HANSCHIP semiconductor · EEPROM · SOP-8

HX24C16DRG from HANSCHIP semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Device address input A0, hard-wired on the HX24C02 only; a no-connect on the HX24C04/08/16 that can be connected to ground.
2 A1 input Device address input A1, used on the HX24C02 and HX24C04; a no-connect on the HX24C08/16 that can be connected to ground.
3 A2 input Device address input A2, used on the HX24C02/04/08; a no-connect on the HX24C16 (which uses no device address pins) that can be connected to ground.
4 GND power_in Ground.
5 SDA bidirectional Serial data, bidirectional and open-drain, may be wire-ORed with other open-drain devices and needs an external pull-up.
6 SCL input Serial clock input; positive edge clocks data into the EEPROM and negative edge clocks data out.
7 WP input Write protect; connected to GND allows normal read/write, connected to VCC protects the full array.
8 VCC power_in Power supply, 1.7V to 5.5V operating range.

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Ambient Temperature -40 85 ℃ 10
Storage Temperature -65 150 ℃ 10
Lead Temperature (Soldering) 260 ℃ Soldering, 10 seconds 10
DC Supply Voltage -0.3 6.5 V 10
Supply Voltage Vcc 1.7 5.5 V 10
Operating Ambient Temperature TA -40 85 ℃ Recommended operating range (DC and AC table header) 10
Supply Current, Read Icc1 0.4 1 mA Vcc=5.0V; Read @100KHz 10
Supply Current, Write Icc2 2 3 mA Vcc=5.0V; Write @100KHz 10
Standby Current ISB 2 uA Vin=Vcc or GND 10
Input Leakage Current ILI 3 uA Vin=Vcc or GND 10
Output Leakage Current ILO 0.05 3 uA Vout=Vcc or GND 10
Input Low Level VIL -0.6 V 10
Output Low Level, Vcc=5.0V VOL3 0.4 V Vcc=5.0V; IOL=3.0mA 10
Output Low Level, Vcc=3.0V VOL2 0.4 V Vcc=3.0V; IOL=2.1mA 10
Output Low Level, Vcc=1.8V VOL1 0.2 V Vcc=1.8V; IOL=0.15mA 10
Input/Output Capacitance (SDA) CI/O 8 pF VI/O = 0V 10
Input Capacitance (A0, A1, A2, SCL) CIN 6 pF VIN = 0V 10
Clock Frequency, SCL (1.8-volt) fSCL 400 KHz 11
Clock Frequency, SCL (5.0-volt) fSCL 1000 KHz 11
Clock Pulse Width Low (1.8-volt) tLOW 1.2 us 11
Clock Pulse Width Low (5.0-volt) tLOW 0.6 us 11
Clock Pulse Width High (1.8-volt) tHIGH 0.6 us 11
Clock Pulse Width High (5.0-volt) tHIGH 0.4 us 11
Noise Suppression Time (1.8-volt) tI 50 us 11
Noise Suppression Time (5.0-volt) tI 40 us 11
Clock Low to Data Out Valid (1.8-volt) tAA 0.05 0.9 us 11
Clock Low to Data Out Valid (5.0-volt) tAA 0.05 0.55 us 11
Bus Free Time before New Transmission (1.8-volt) tBUF 1.2 us 11
Bus Free Time before New Transmission (5.0-volt) tBUF 0.5 us 11
Start Hold Time (1.8-volt) tHD.STA 0.6 us 11
Start Hold Time (5.0-volt) tHD.STA 0.25 us 11
Start Setup Time (1.8-volt) tSU.STA 0.6 us 11
Start Setup Time (5.0-volt) tSU.STA 0.25 us 11
Data In Hold Time (1.8-volt) tHD.DAT 0 us 11
Data In Hold Time (5.0-volt) tHD.DAT 0 us 11
Data In Setup Time (1.8-volt) tSU.DAT 100 ns 11
Data In Setup Time (5.0-volt) tSU.DAT 100 ns 11
Inputs Rise Time (1.8-volt) tR 0.3 us 11
Inputs Rise Time (5.0-volt) tR 0.3 us 11
Inputs Fall Time (1.8-volt) tF 300 ns 11
Inputs Fall Time (5.0-volt) tF 100 ns 11
Stop Setup Time (1.8-volt) tSU.STO 0.6 us 11
Stop Setup Time (5.0-volt) tSU.STO 0.25 us 11
Data Out Hold Time (1.8-volt) tDH 50 ns 11
Data Out Hold Time (5.0-volt) tDH 50 ns 11
Write Cycle Time (1.8-volt) tWR 5 ms 11
Write Cycle Time (5.0-volt) tWR 5 ms 11

CAD (KiCad official)

  • Symbol: HX24C16DRG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hx24c16drg-etched.step / hx24c16drg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hx24c16drg.step / hx24c16drg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (17 pp, sha256 8b39cc16ac1b07de, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF