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Contents

README

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HX2301

HX hengjiaxing · MOSFETs · SOT-23-3

HX2301 from HX hengjiaxing, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GATE input Gate of the P-channel MOSFET; gate-source voltage limit is ±12 V, with threshold Vth(GS) of -0.4 V min, -0.7 V typ and -1.2 V max at ID=-250 uA.
2 SOURCE passive Source of the P-channel MOSFET; drain-source voltage is -20 V max and continuous drain current is -2.8 A.
3 DRAIN passive Drain of the P-channel MOSFET; VDS is -20 V max, ID is -2.8 A and power dissipation is 1 W.

Key specifications

Parameter Value
Manufacturer HX hengjiaxing
Package SOT-23-3
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source voltage VDS -20 V 1
Gate-Source voltage VGS -12 12 V 1
Power Dissipation PD 1 W 1
Junction Temperature Tj 150 ℃ 1
Storage Temperature Tstg -55 150 ℃ 1
Drain-Source Breakdown Voltage V(BR)DSS -20 V VGS=0V, ID=-250uA 1
Gate-Threshold Voltage Vth(GS) -0.4 -0.7 -1.2 V VDS= VGS, ID=-250 uA 1
Gate-body Leakage IGSS -100 100 nA VDS=0V, VGS=±12V 1
Zero Gate Voltage Drain Current IDSS -1 uA VDS=-20V, VGS=0V 1
Drain-Source On-Resistance rDS(ON) 55 85 mΩ VGS=-4.5V, ID=-2.8A 1
Drain-Source On-Resistance rDS(ON) 60 110 mΩ VGS=-2.5V, ID=-2A 1
Diode Forward Current Is -1.3 A 1
Diode Forward Voltage VSD -1.2 V VGS=0V, ID=-1.3A 1
Forward Trans conductance gfs 5 S VDS=-5V, ID=-5A 1
Input Capacitance Ciss 560 pF VDS=-10V, VGS=0V, f=1MHz 1
Output Capacitance Coss 61 pF VDS=-10V, VGS=0V, f=1MHz 1
Reverse Transfer Capacitance Crss 55 pF VDS=-10V, VGS=0V, f=1MHz 1
Turn-on Delay Time td(on) 11 nS VDD=-10V, VGS=-4.5V, RGEN=-60ohm, RL=10ohm 1

CAD (KiCad official)

  • Symbol: HX2301
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: hx2301-etched.step / hx2301-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hx2301.step / hx2301.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HX hengjiaxing datasheet (1 pp, sha256 4715a001ad252ccf, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF