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HX1509D-3.3RG
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HANSCHIP semiconductor DC-DC Converters, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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HX1509D-3.3RG
HANSCHIP semiconductor · DC-DC Converters · SOP-8
HX1509D-3.3RG from HANSCHIP semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Supply voltage input operating from 4.5V to 42V DC; bypass VIN to GND with a suitably large capacitor to eliminate input noise. |
| 2 | OUTPUT | output | Power switch output (SW) that is the switch node supplying power to the output; the datasheet's absolute maximum output switch pin voltage is -0.3 V to VIN. |
| 3 | FEEDBACK | input | Feedback input (FB) that senses the output through an external resistor divider and regulates it, with a feedback threshold voltage of 1.23V. |
| 4 | ON/OFF | input | Enable input that is driven low to turn the device on and driven high to turn it off; floating is default low, and the absolute maximum pin voltage is -0.3 V to VIN. |
| 5 | GND | power_in | Ground pin that must be laid out outside the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing noise into the device. |
| 6 | GND | power_in | Ground pin that must be laid out outside the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing noise into the device. |
| 7 | GND | power_in | Ground pin that must be laid out outside the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing noise into the device. |
| 8 | GND | power_in | Ground pin that must be laid out outside the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing noise into the device. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HANSCHIP semiconductor |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage | VOUT | 3.168 | 3.3 | 3.432 | V | Vin = 4.75V to 42V, Iload=0.2A to 2A | 5 |
| Input operation voltage | Vin | 4.5 | 42 | V | 6 | ||
| Shutdown Supply Current | ISTBY | 80 | 200 | uA | VON/OFF=5V | 6 | |
| Quiescent Supply Current | Iq | 2 | 10 | mA | VON/OFF =0V, VFB =Vin | 6 | |
| Oscillator Frequency | Fosc | 127 | 150 | 173 | Khz | 6 | |
| ON/OFF Pin Threshold High (Regulator OFF) | VON/OFF | 1.4 | V | High (Regulator OFF) | 6 | ||
| ON/OFF Pin Threshold Low (Regulator ON) | VON/OFF | 0.8 | V | Low (Regulator ON) | 6 | ||
| ON/OFF Pin Input Leakage Current (high) | IH | 5 | 15 | uA | VON/OFF =2.5V (OFF) | 6 | |
| ON/OFF Pin Input Leakage Current (low) | IL | 0.2 | 5 | uA | VON/OFF =0.5V (ON) | 6 | |
| Output Saturation Voltage | VCE | 1.2 | 1.4 | V | VFB=0V, Iout=2A | 6 | |
| Efficiency | ŋ | 75 | % | Vin=12V ,Vout=3.3V,Iout=2A | 5 | ||
| Input Voltage | Vin | -0.3 | 42 | V | 5 | ||
| Feedback Pin Voltage | VFB | -0.3 | V | Printed upper limit is Vin | 5 | ||
| ON/OFF Pin Voltage | VON/OFF | -0.3 | V | Printed upper limit is Vin | 5 | ||
| Output Switch Pin Voltage | VOutput | -0.3 | V | Printed upper limit is Vin | 5 | ||
| ESD (HBM) | 2000 | V | HBM | 5 | |||
| Thermal Resistance (SOP8), Junction to Ambient | RJA | 100 | ºC/W | No heatsink, free air | 5 | ||
| Operating Junction Temperature | TJ | -40 | 125 | ºC | 5 | ||
| Storage Temperature | TSTG | -65 | 150 | ºC | 5 | ||
| Lead Temperature (Soldering, 10 sec) | TLEAD | 245 | ºC | Soldering, 10 sec | 5 |
CAD (KiCad official)
- Symbol:
HX1509D-3.3RG - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
hx1509d-3-3rg-etched.step/hx1509d-3-3rg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hx1509d-3-3rg.step/hx1509d-3-3rg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HANSCHIP semiconductor datasheet (13 pp, sha256
47c4f6e9edcebb1a, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HX1509D-3.3RG
**HANSCHIP semiconductor** · DC-DC Converters · SOP-8
HX1509D-3.3RG from HANSCHIP semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Supply voltage input operating from 4.5V to 42V DC; bypass VIN to GND with a suitably large capacitor to eliminate input noise. |
| 2 | OUTPUT | output | Power switch output (SW) that is the switch node supplying power to the output; the datasheet's absolute maximum output switch pin voltage is -0.3 V to VIN. |
| 3 | FEEDBACK | input | Feedback input (FB) that senses the output through an external resistor divider and regulates it, with a feedback threshold voltage of 1.23V. |
| 4 | ON/OFF | input | Enable input that is driven low to turn the device on and driven high to turn it off; floating is default low, and the absolute maximum pin voltage is -0.3 V to VIN. |
| 5 | GND | power_in | Ground pin that must be laid out outside the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing noise into the device. |
| 6 | GND | power_in | Ground pin that must be laid out outside the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing noise into the device. |
| 7 | GND | power_in | Ground pin that must be laid out outside the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing noise into the device. |
| 8 | GND | power_in | Ground pin that must be laid out outside the Schottky diode to output capacitor ground path to prevent switching current spikes from inducing noise into the device. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HANSCHIP semiconductor |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage | VOUT | 3.168 | 3.3 | 3.432 | V | Vin = 4.75V to 42V, Iload=0.2A to 2A | 5 |
| Input operation voltage | Vin | 4.5 | | 42 | V | | 6 |
| Shutdown Supply Current | ISTBY | | 80 | 200 | uA | VON/OFF=5V | 6 |
| Quiescent Supply Current | Iq | | 2 | 10 | mA | VON/OFF =0V, VFB =Vin | 6 |
| Oscillator Frequency | Fosc | 127 | 150 | 173 | Khz | | 6 |
| ON/OFF Pin Threshold High (Regulator OFF) | VON/OFF | 1.4 | | | V | High (Regulator OFF) | 6 |
| ON/OFF Pin Threshold Low (Regulator ON) | VON/OFF | | | 0.8 | V | Low (Regulator ON) | 6 |
| ON/OFF Pin Input Leakage Current (high) | IH | | 5 | 15 | uA | VON/OFF =2.5V (OFF) | 6 |
| ON/OFF Pin Input Leakage Current (low) | IL | | 0.2 | 5 | uA | VON/OFF =0.5V (ON) | 6 |
| Output Saturation Voltage | VCE | | 1.2 | 1.4 | V | VFB=0V, Iout=2A | 6 |
| Efficiency | ŋ | | 75 | | % | Vin=12V ,Vout=3.3V,Iout=2A | 5 |
| Input Voltage | Vin | -0.3 | | 42 | V | | 5 |
| Feedback Pin Voltage | VFB | -0.3 | | | V | Printed upper limit is Vin | 5 |
| ON/OFF Pin Voltage | VON/OFF | -0.3 | | | V | Printed upper limit is Vin | 5 |
| Output Switch Pin Voltage | VOutput | -0.3 | | | V | Printed upper limit is Vin | 5 |
| ESD (HBM) | | | | 2000 | V | HBM | 5 |
| Thermal Resistance (SOP8), Junction to Ambient | RJA | | | 100 | ºC/W | No heatsink, free air | 5 |
| Operating Junction Temperature | TJ | -40 | | 125 | ºC | | 5 |
| Storage Temperature | TSTG | -65 | | 150 | ºC | | 5 |
| Lead Temperature (Soldering, 10 sec) | TLEAD | | | 245 | ºC | Soldering, 10 sec | 5 |
## CAD (KiCad official)
- Symbol: `HX1509D-3.3RG`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `hx1509d-3-3rg-etched.step` / `hx1509d-3-3rg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hx1509d-3-3rg.step` / `hx1509d-3-3rg.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HANSCHIP semiconductor datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757796939612610560) (13 pp, sha256 `47c4f6e9edcebb1a`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hx1509d-3-3rg-datasheet.pdf)