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HUCLAMP0511P

HXY MOSFET · ESD And Surge Protection (TVS/ESD) · DFN1006-2L

HUCLAMP0511P from HXY MOSFET, in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive One terminal of the bidirectional transient protection path for the single protected I/O line, rated for a 5.0 V reverse working voltage (VRWM) per the electrical characteristics table; the datasheet does not label this pin or state its individual polarity or function.
2 2 passive The other terminal of the bidirectional transient protection path for the single protected I/O line, rated for a 5.0 V reverse working voltage (VRWM) per the electrical characteristics table; the datasheet does not label this pin or state its individual polarity or function.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package DFN1006-2L
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse breakdown voltage VBR 5.8 V IT = 1mA 2
Reverse leakage current IR 1 μA VRWM = 5.0V 2
Clamping voltage VC 9.8 V IRWM = 1A, tp = 8/20μs 2
Clamping voltage VC 20 V IRWM = 20A, tp = 8/20μs 2
Junction capacitance CJ 40 50 pF VR = 0V, f = 1MHz 2
Peak pulse power PPP 400 W tp = 8/20μs 1
Maximum lead temperature for soldering TL 260 °C during 10s 1
Storage temperature range Tstg -55 150 °C 1
Maximum junction temperature Tj 150 °C 1
Operating temperature range Top -55 150 °C 1
ESD immunity, IEC61000-4-2 contact discharge -30 30 kV IEC61000-4-2 contact discharge 1
ESD immunity, IEC61000-4-2 air discharge -30 30 kV IEC61000-4-2 air discharge 1
EFT immunity, IEC61000-4-4 peak current 40 A IEC61000-4-4, 5/50 ns 1
Reverse working voltage VRWM 5 V 2

CAD (KiCad official)

  • Symbol: HUCLAMP0511P
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2L (KiCad packages3D, STEP)
  • 3D model files: huclamp0511p-etched.step / huclamp0511p-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); huclamp0511p.step / huclamp0511p.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (4 pp, sha256 880aa55348ba2140, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF