component
HTPSMB7.0AVR
Public Made by Adomby adom
HXY MOSFET ESD And Surge Protection (TVS/ESD), SMB(DO-214AA). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
main
HTPSMB7.0AVR
HXY MOSFET · ESD And Surge Protection (TVS/ESD) · SMB(DO-214AA)
HTPSMB7.0AVR from HXY MOSFET, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SMB(DO-214AA) |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage | BR | 7.78 | 8.6 | V | @IT test current | 1 | |
| Maximum clamping voltage | VC | 12 | V | @IPP peak pulse current | 1 | ||
| Peak pulse current | IPP | 50 | A | 1 | |||
| Peak forward surge current | IFSM | 100 | A | 8.3ms single half sine-wave, JEDEC method | 1 | ||
| Steady state power dissipation | PM(AV) | 1 | W | TA=50℃ (Fig.5) | 1 | ||
| Operating junction and storage temperature range | TJ,TSTG | -55 | 150 | °C | 1 | ||
| Typical thermal resistance junction to lead | RθJL | 30 | °C/W | 1 | |||
| Typical thermal resistance junction to ambient | RθJA | 100 | °C/W | 1 | |||
| Reverse stand-off voltage | VRWM | 7 | V | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | 2. Mounted on 5.0mm×5.0mm (0.03mm thick) copper pads to each terminal. | 1 |
CAD (KiCad official)
- Symbol:
HTPSMB7.0AVR - Footprint:
Diode_SMD:D_SMB - 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files:
htpsmb7-0avr-etched.step/htpsmb7-0avr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);htpsmb7-0avr.step/htpsmb7-0avr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (4 pp, sha256
6b6462f58e891541, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HTPSMB7.0AVR
**HXY MOSFET** · ESD And Surge Protection (TVS/ESD) · SMB(DO-214AA)
HTPSMB7.0AVR from HXY MOSFET, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SMB(DO-214AA) |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown voltage | BR | 7.78 | | 8.6 | V | @IT test current | 1 |
| Maximum clamping voltage | VC | | | 12 | V | @IPP peak pulse current | 1 |
| Peak pulse current | IPP | | | 50 | A | | 1 |
| Peak forward surge current | IFSM | | | 100 | A | 8.3ms single half sine-wave, JEDEC method | 1 |
| Steady state power dissipation | PM(AV) | | | 1 | W | TA=50℃ (Fig.5) | 1 |
| Operating junction and storage temperature range | TJ,TSTG | -55 | | 150 | °C | | 1 |
| Typical thermal resistance junction to lead | RθJL | | 30 | | °C/W | | 1 |
| Typical thermal resistance junction to ambient | RθJA | | 100 | | °C/W | | 1 |
| Reverse stand-off voltage | VRWM | | 7 | | V | | 1 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | | 2. Mounted on 5.0mm×5.0mm (0.03mm thick) copper pads to each terminal. | 1 |
## CAD (KiCad official)
- Symbol: `HTPSMB7.0AVR`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
- 3D model files: `htpsmb7-0avr-etched.step` / `htpsmb7-0avr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `htpsmb7-0avr.step` / `htpsmb7-0avr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HXY MOSFET datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8604438230427049984) (4 pp, sha256 `6b6462f58e891541`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/htpsmb7-0avr-datasheet.pdf)