# HT8542ARZ

**HTCSEMI** · Operational Amplifier · SOP-8

HT8542ARZ from HTCSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT A | output | Output of amplifier A, which has rail-to-rail output swing. |
| 2 | -IN A | input | Inverting input of amplifier A; input voltage must stay between GND and VS (absolute maximum ratings). |
| 3 | +IN A | input | Noninverting input of amplifier A; input voltage must stay between GND and VS (absolute maximum ratings). |
| 4 | V- | power_in | Negative supply pin; the part is specified for single-supply operation from 2.7 V to 5.5 V. |
| 5 | +IN B | input | Noninverting input of amplifier B; input voltage must stay between GND and VS (absolute maximum ratings). |
| 6 | -IN B | input | Inverting input of amplifier B; input voltage must stay between GND and VS (absolute maximum ratings). |
| 7 | OUT B | output | Output of amplifier B, which has rail-to-rail output swing. |
| 8 | V+ | power_in | Positive supply pin; the part is specified from 2.7 V to 5.5 V, with a 6 V absolute maximum supply voltage. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HTCSEMI |
| Package | SOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Offset Voltage | VOS |  | 1 | 6 | mV |  | 2 |
| Offset Voltage over temperature | VOS |  |  | 7 | mV | -40°C ≤ TA ≤ +125°C | 2 |
| Input Bias Current | IB |  | 4 | 60 | pA |  | 2 |
| Input Bias Current | IB |  |  | 100 | pA | -40°C ≤ TA ≤ +85°C | 2 |
| Input Bias Current | IB |  |  | 1000 | pA | -40°C ≤ TA ≤ +125°C | 2 |
| Input Offset Current | IOS |  | 0.1 | 30 | pA |  | 2 |
| Input Offset Current | IOS |  |  | 50 | pA | -40°C ≤ TA ≤ +85°C | 2 |
| Input Offset Current | IOS |  |  | 500 | pA | -40°C ≤ TA ≤ +125°C | 2 |
| Input Voltage Range |  | 0 |  | 2.7 | V |  | 2 |
| Common-Mode Rejection Ratio | CMRR | 40 | 45 |  | dB | VCM = 0 V to 2.7 V | 2 |
| Common-Mode Rejection Ratio | CMRR | 38 |  |  | dB | -40°C ≤ TA ≤ +125°C | 2 |
| Large Signal Voltage Gain | AVO | 100 | 500 |  | V/mV | RL = 100 kΩ , VO = 0.5 V to 2.2 V | 2 |
| Large Signal Voltage Gain | AVO | 50 |  |  | V/mV | -40°C ≤ TA ≤ +85°C | 2 |
| Large Signal Voltage Gain | AVO | 2 |  |  | V/mV | -40°C ≤ TA ≤ +125°C | 2 |
| Offset Voltage Drift | ΔVOS/ΔT |  |  | 4 | μV/°C | -40°C ≤ TA ≤ +125°C | 2 |
| Bias Current Drift | ΔIB/ΔT |  |  | 100 | fA/°C | -40°C ≤ TA ≤ +85°C | 2 |
| Bias Current Drift | ΔIB/ΔT |  |  | 2000 | fA/°C | -40°C ≤ TA ≤ +125°C | 2 |
| Offset Current Drift | ΔIOS/ΔT |  |  | 25 | fA/°C | -40°C ≤ TA ≤ +125°C | 2 |
| Output Voltage High | VOH | 2.575 | 2.65 |  | V | IL = 1 mA | 2 |
| Output Voltage High | VOH | 2.55 |  |  | V | -40°C ≤ TA ≤ +125°C | 2 |
| Output Voltage Low | VOL |  | 35 | 100 | mV | IL = 1 mA | 2 |
| Output Voltage Low | VOL |  |  | 125 | mV | -40°C ≤ TA ≤ +125°C | 2 |
| Power Supply Rejection Ratio | PSRR | 65 | 76 |  | dB | VS = 2.5 V to 6 V | 2 |
| Power Supply Rejection Ratio | PSRR | 60 |  |  | dB | -40°C ≤ TA ≤ +125°C | 2 |
| Supply Current/Amplifier | ISY |  | 38 | 55 | μA | VO = 0 V | 2 |
| Supply Current/Amplifier | ISY |  |  | 75 | μA | -40°C ≤ TA ≤ +125°C | 2 |
| Slew Rate | SR | 0.4 | 0.75 |  | V/μs | RL = 100 kΩ | 2 |
| Supply Voltage | VS |  |  | 6 | V |  | 5 |
| Differential Input Voltage |  | -6 |  | 6 | V | Printed ±6 V; for supplies less than 6 V equal to ±VS (footnote 1) | 5 |
| Storage Temperature Range |  | -65 |  | 150 | °C |  | 5 |
| Operating Temperature Range |  | -40 |  | 125 | °C |  | 5 |
| Junction Temperature Range |  | -65 |  | 150 | °C |  | 5 |
| Lead Temperature (Soldering) |  |  |  | 300 | °C | Soldering, 60 sec | 5 |
| Thermal resistance junction-to-ambient, 8-Lead SOIC (R) | θJA |  | 158 |  | °C/W | Worst case, device soldered in circuit board (surface-mount) | 5 |
| Thermal resistance junction-to-case, 8-Lead SOIC (R) | θJC |  | 43 |  | °C/W | Worst case, device soldered in circuit board (surface-mount) | 5 |

## CAD (KiCad official)

- Symbol: `HT8542ARZ`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `ht8542arz-etched.step` / `ht8542arz-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ht8542arz.step` / `ht8542arz.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HTCSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590353796888100864) (14 pp, sha256 `2ad752a0a38aee2d`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ht8542arz-datasheet.pdf)