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Contents

README

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HT7533MK-1

HGSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-89

HT7533MK-1 from HGSEMI, in a SOT-89. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin (地); the datasheet gives no separate electrical limit for this pin, and the absolute maximum supply rating is -0.3 to +30 V.
2 VIN power_in Input pin; the supply voltage must not exceed 30 V (absolute maximum range -0.3 to +30 V), and VIN should be at least VOUT+2 V for the stated electrical characteristics.
3 VOUT power_out Regulated output pin; it supplies up to 100 mA typical (70 mA minimum at VIN=VOUT+2V), and the datasheet requires an output-to-ground capacitor greater than 2.2 uF.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOT-89
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage VIN 30 V 4
Output voltage VOUT 3.234 3.3 3.366 V VIN=VOUT+2V; IOUT=10mA 4
Output current IOUT 70 100 mA VIN=VOUT+2V 4
Load regulation ΔVOUT 25 60 mV VIN=VOUT+2V; 1mA ≤ IOUT ≤ 50mA 4
Dropout voltage VDIF 2 4 mV IOUT=1mA; △Vo=2% 4
Quiescent current ISS 2 3 uA 无负载 (no load) 4
Input voltage regulation 0.2 %/V Vo+1V≤VIN≤30V; IOUT=1mA 4
Output voltage temperature coefficient 100 ppm/℃ IOUT=10mA; -40℃<Ta<85℃ 4
Supply voltage (absolute maximum) -0.3 30 V 3
Operating ambient temperature -40 85 ℃ 3
Storage temperature range -45 140 ℃ 3
Lead temperature (soldering) 260 ℃ 10 s soldering 3
Maximum power dissipation (SOT-89) PD 0.5 W SOT-89 package, as stated in application note example (7550-1, VIN=12V, IOUT=100mA) 6

CAD (KiCad official)

  • Symbol: HT7533MK-1
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89 (KiCad packages3D, STEP)
  • 3D model files: ht7533mk-1-etched.step / ht7533mk-1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ht7533mk-1.step / ht7533mk-1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (10 pp, sha256 e61e803b03a47d78, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF