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Contents

README

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HT7533H23

HX hengjiaxing · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-3

HT7533H23 from HX hengjiaxing, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin, the common reference for the regulator (listed as 地 in the datasheet pin function table).
2 VIN power_in Input pin; the input voltage must stay within the absolute maximum rating of -0.3 V to +30 V, and input capacitors should be placed close to this pin.
3 VOUT power_out Regulated output pin; an output capacitor greater than 2.2 µF must be connected from this pin to ground, with tantalum capacitors recommended.

Key specifications

Parameter Value
Manufacturer HX hengjiaxing
Package SOT-23-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
输出电压 (Output voltage) VOUT 3.234 3.3 3.366 V VIN=VOUT+2.0V, IOUT=10mA 4
输出电压精度 (Output voltage accuracy) VOUT -2 2 % 1
输出电流 (Output current) IOUT 70 100 mA VIN=VOUT+2.0V 4
负载调整率 (Load regulation) △VOUT 25 60 mV VIN=VOUT+2.0V, 1mA≤IOUT≤50mA 4
低压差 (Dropout voltage) VDIF 25 55 mV IOUT=1mA,△VOUT=2% 4
静态电流 (Quiescent current) ISS 1.5 3 μA 无负载 4
线性调整率 (Line regulation) △VOUT/VOUT*△VIN 0.2 %/V VOUT+1.0V≤VIN≤30V, IOUT=1mA 4
输入电压 (Input voltage) VIN 30 V 4
工作电压 (Operating/input voltage, absolute maximum) VIN -0.3 30 V 2
贮存温度 (Storage temperature) TSTG -50 125 ℃ 2
工作温度 (Operating temperature) TA -40 85 ℃ 2
输出电容 (Output capacitor requirement) 2.2 μF 输出到地, tantalum recommended 7
功耗 (Power dissipation, SOT23-3) PD 200 mW SOT23-3 2
温度系数 (Temperature coefficient of VOUT) △VOUT/△TA*VOUT 100 ppm/℃ VIN=VOUT+2.0V, IOUT=10mA, -40℃≤TA≤85℃ 4
热阻 (Thermal resistance junction-to-ambient, SOT23-3) θJA 500 ℃/W SOT23-3 2

CAD (KiCad official)

  • Symbol: HT7533H23
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: ht7533h23-etched.step / ht7533h23-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ht7533h23.step / ht7533h23.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HX hengjiaxing datasheet (11 pp, sha256 ae9dd2f36371575a, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF