component
HT62003ARZ
Public Made by Adomby adom
HTCSEMI Darlington Transistor Arrays, SOP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHT62003ARZ
HTCSEMI · Darlington Transistor Arrays · SOP-16
HT62003ARZ from HTCSEMI, in a SOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I1 | input | Input pin for channel 1; input voltage is limited to -0.5 to 30 V absolute maximum (page 3). |
| 2 | I2 | input | Input pin for channel 2; input voltage is limited to -0.5 to 30 V absolute maximum (page 3). |
| 3 | I3 | input | Input pin for channel 3; input voltage is limited to -0.5 to 30 V absolute maximum (page 3). |
| 4 | I4 | input | Input pin for channel 4; input voltage is limited to -0.5 to 30 V absolute maximum (page 3). |
| 5 | I5 | input | Input pin for channel 5; input voltage is limited to -0.5 to 30 V absolute maximum (page 3). |
| 6 | I6 | input | Input pin for channel 6; input voltage is limited to -0.5 to 30 V absolute maximum (page 3). |
| 7 | I7 | input | Input pin for channel 7; input voltage is limited to -0.5 to 30 V absolute maximum (page 3). |
| 8 | GND | power_in | Ground pin for the driver array. |
| 9 | COMMON | passive | Common pin tied to the internal clamp diodes; COMMON voltage is rated -0.5 to 50 V (page 3). |
| 10 | O7 | output | Open-drain sink output for channel 7; output voltage max 50 V and output current max 500 mA/ch (page 3). |
| 11 | O6 | output | Open-drain sink output for channel 6; output voltage max 50 V and output current max 500 mA/ch (page 3). |
| 12 | O5 | output | Open-drain sink output for channel 5; output voltage max 50 V and output current max 500 mA/ch (page 3). |
| 13 | O4 | output | Open-drain sink output for channel 4; output voltage max 50 V and output current max 500 mA/ch (page 3). |
| 14 | O3 | output | Open-drain sink output for channel 3; output voltage max 50 V and output current max 500 mA/ch (page 3). |
| 15 | O2 | output | Open-drain sink output for channel 2; output voltage max 50 V and output current max 500 mA/ch (page 3). |
| 16 | O1 | output | Open-drain sink output for channel 1; output voltage max 50 V and output current max 500 mA/ch (page 3). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HTCSEMI |
| Package | SOP-16 |
| Category | Transistors/Thyristors |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output voltage | VOUT | 50 | V | 3 | |||
| COMMON pin voltage | VCOM | -0.5 | 50 | V | 3 | ||
| Output current | IOUT | 500 | mA/ch | 3 | |||
| Input voltage | VIN | -0.5 | 30 | V | 3 | ||
| Clamp diode reverse voltage | VR | 50 | V | 3 | |||
| Clamp diode forward current | IF | 500 | mA | 3 | |||
| Power dissipation | PD | 1.47 | W | PG (Note 1), device alone; derate 11.8 mW/°C above Ta 25°C | 3 | ||
| Power dissipation | PD | 0.625 | W | FG (Note 2), on PCB 30 mm x 30 mm x 1.6 mm, Cu 50%; derate 5 mW/°C above Ta 25°C | 3 | ||
| Power dissipation | PD | 0.78 | W | FNG (Note 3), on PCB 50 mm x 50 mm x 1.6 mm, Cu 40%; derate 6.24 mW/°C above Ta 25°C | 3 | ||
| Power dissipation | PD | 1.25 | W | FWG (Note 4), on PCB (JEDEC 2s2p); derate 10 mW/°C above Ta 25°C | 3 | ||
| Operating temperature | Topr | -40 | 85 | °C | 3 | ||
| Storage temperature | Tstg | -55 | 150 | °C | 3 | ||
| Output voltage | VOUT | 50 | V | 4 | |||
| COMMON pin voltage | VCOM | 0 | 50 | V | 4 | ||
| Output current | IOUT | 0 | 400 | mA/ch | PG (Note 1), 1 circuit ON, Ta = 25°C | 4 | |
| Output current | IOUT | 0 | 190 | mA/ch | PG (Note 1), 7 circuits ON, Ta = 85°C, Duty = 50%, Tj = 120°C | 4 | |
| Output current | IOUT | 0 | 270 | mA/ch | FG (Note 2), tpw = 25 ms, Duty = 10% | 4 | |
| Output current | IOUT | 0 | 120 | mA/ch | FG (Note 2), 7 circuits ON, Ta = 85°C, Duty = 50%, Tj = 120°C | 4 | |
| Output current | IOUT | 0 | 300 | mA/ch | FNG (Note 3), tpw = 25 ms, Duty = 10% | 4 | |
| Output current | IOUT | 0 | 130 | mA/ch | FNG (Note 3), 7 circuits ON, Ta = 85°C, Duty = 50%, Tj = 120°C | 4 | |
| Output current | IOUT | 0 | 390 | mA/ch | FWG (Note 4), tpw = 25 ms, Duty = 10% | 4 | |
| Output current | IOUT | 0 | 170 | mA/ch | FWG (Note 4), 7 circuits ON, Ta = 85°C, Duty = 50%, Tj = 120°C | 4 | |
| Input voltage (output on) | VIN(ON) | 2.5 | 25 | V | IOUT = 100 mA or upper, VOUT = 2 V | 4 | |
| Input voltage (output off) | VIN(OFF) | 0 | 0.6 | V | IOUT = 100 μA or less, VOUT = 2 V | 4 | |
| Clamp diode forward current | IF | 400 | mA | 4 | |||
| Output leakage current | Ileak | 1 | μA | VOUT = 50 V, Ta = 85 °C, VIN = 0 V | 5 | ||
| Output voltage (VDS) | VDS | 0.7 | 1.14 | V | IOUT = 350 mA, VIN = 5.0 V | 5 | |
| Output voltage (VDS) | VDS | 0.4 | 0.65 | V | IOUT = 200 mA, VIN = 5.0 V | 5 | |
| Output voltage (VDS) | VDS | 0.2 | 0.325 | V | IOUT = 100 mA, VIN = 5.0 V | 5 | |
| Output ON-resistance | RON | 2 | 3.25 | Ω | IOUT = 350 mA, VIN = 5.0 V | 5 | |
| Input current (output on) | IIN(ON) | 0.1 | mA | VIN = 2.5 V | 5 | ||
| Input current (output off) | IIN(OFF) | 1 | μA | VIN = 0 V, Ta = 85°C | 5 | ||
| Input voltage (output on) | VIN(ON) | 2.5 | V | IOUT = 100 mA, VOUT = 2 V | 5 | ||
| Clamp diode reverse current | IR | 1 | μA | VR = 50 V, Ta = 85°C | 5 | ||
| Clamp diode forward voltage | VF | 2 | V | IF = 350 mA | 5 | ||
| Turn-on delay | tON | 0.4 | μs | VOUT = 50 V, RL = 125 Ω | 5 | ||
| Turn-off delay | tOFF | 0.8 | μs | CL = 15 pF | 5 |
CAD (KiCad official)
- Symbol:
HT62003ARZ - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOP-16 (KiCad packages3D, STEP)
- 3D model files:
ht62003arz-etched.step/ht62003arz-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ht62003arz.step/ht62003arz.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HTCSEMI datasheet (9 pp, sha256
882e5622e0858700, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).