component
HT5027
Public Made by Adomby adom
HiTrend Tech (Shanghai) Microcontroller Units (MCUs/MPUs/SOCs), LQFP-64(10x10). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHT5027
HiTrend Tech (Shanghai) · Microcontroller Units (MCUs/MPUs/SOCs) · LQFP-64(10x10)
HT5027 from HiTrend Tech (Shanghai), in a LQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OSCI | input | 32KHz clock (crystal) input. |
| 2 | PE.9/LVDIN1 | bidirectional | GPIO or external power-detect input LVDIN1 (compared against the 1.21V threshold). |
| 3 | PA.12/SEG35/ADCIN0 | bidirectional | GPIO, LCD SEG35 driver output, or external voltage sampling input 0 (ADCIN0). |
| 4 | PF.2/SFOUT/SEG48 | bidirectional | GPIO, energy pulse output (default apparent-energy pulse, configurable via EMCON) or LCD SEG48; output drive 5mA. |
| 5 | PF.1/QFOUT | bidirectional | GPIO or energy pulse output (default reactive-energy pulse, configurable via EMCON); output drive 5mA. |
| 6 | PF.0/PFOUT/TOUT3 | bidirectional | GPIO, energy pulse output (default active-energy pulse, configurable via EMCON) or second-pulse output TOUT3; output drive 5mA. |
| 7 | VREF | power_out | 1.185V metering reference voltage output; requires external 0.1uF and 1uF filter capacitors. |
| 8 | AVREG | power_out | 2.8V internal analog supply output; requires external 0.1uF and 10uF filter capacitors. |
| 9 | V1P | input | Current channel 1 analog input (positive), internal ESD protection, maximum signal ±800mVp. |
| 10 | V1N | input | Current channel 1 analog input (negative), internal ESD protection, maximum signal ±800mVp. |
| 11 | V2P | input | Current channel 2 analog input (positive), internal ESD protection, maximum signal ±800mVp. |
| 12 | V2N | input | Current channel 2 analog input (negative), internal ESD protection, maximum signal ±800mVp. |
| 13 | V3P | input | Voltage channel analog input (positive), internal ESD protection, maximum signal ±800mVp. |
| 14 | V3N | input | Voltage channel analog input (negative), internal ESD protection, maximum signal ±800mVp. |
| 15 | AVSS | power_in | Analog ground. |
| 16 | PA.7/INT2/SEG33 | bidirectional | High-current GPIO (30mA drive), external interrupt input INT2 (2us filter) or LCD SEG33 output. |
| 17 | PB.0/SEG0 | bidirectional | GPIO or LCD SEG0 driver output. |
| 18 | PB.1/SEG1 | bidirectional | GPIO or LCD SEG1 driver output. |
| 19 | PB.2/SEG2/VLCD0 | bidirectional | GPIO, LCD SEG2 output, or LCD resistor-divider bias voltage output VLCD0 (needs external 0.47uF capacitor). |
| 20 | PB.3/SEG3/VLCD1 | bidirectional | GPIO, LCD SEG3 output, or LCD resistor-divider bias voltage output VLCD1 (needs external 0.47uF capacitor). |
| 21 | PB.4/SEG4/VLCD2 | bidirectional | GPIO, LCD SEG4 output, or LCD resistor-divider bias voltage output VLCD2 (needs external 0.47uF capacitor). |
| 22 | PB.5/SEG5/VLCD3 | bidirectional | GPIO, LCD SEG5 output, or LCD resistor-divider bias voltage output VLCD3 (needs external 0.47uF capacitor). |
| 23 | PB.6/SEG6 | bidirectional | GPIO or LCD SEG6 driver output. |
| 24 | VDD1P5 | power_out | Internal 1.5V output; requires external 0.1uF filter capacitor. |
| 25 | GND | power_in | Ground (listed as analog ground). |
| 26 | PB.7/SEG7 | bidirectional | GPIO or LCD SEG7 driver output. |
| 27 | PA.6/INT1/SCANIN1/JTAGWDTEN | bidirectional | High-current GPIO (30mA drive), external interrupt INT1 (2us filter), keyscan column input SCANIN1; as JTAGWDTEN, debug mode is entered when TEST and this pin are both low. |
| 28 | TEST | input | Test pin with 2us filter; test mode is entered if it goes low before JTAGWDTEN. |
| 29 | PB.12/SEG12/INT8 | bidirectional | GPIO, LCD SEG12 output, or external interrupt input INT8. |
| 30 | PB.13/SEG13/SWIO | bidirectional | GPIO, LCD SEG13 output, or debug-mode SW data signal SWIO (default function after power-up). |
| 31 | PB.14/SEG14/INT9 | bidirectional | GPIO, LCD SEG14 output, or external interrupt input INT9. |
| 32 | PB.15/SEG15/SWCLK | bidirectional | GPIO, LCD SEG15 output, or debug-mode SW clock signal SWCLK (default function after power-up). |
| 33 | PD.14/COM6/SEG26 | bidirectional | GPIO, LCD COM6, or LCD SEG26 driver output. |
| 34 | PD.15/COM7/SEG27 | bidirectional | GPIO, LCD COM7, or LCD SEG27 driver output. |
| 35 | PE.1/TX4/TOUT2 | bidirectional | GPIO, UART4 transmit, or second-pulse output TOUT2; output drive 5mA. |
| 36 | PE.2/RX4/7816_0 | bidirectional | GPIO, UART4 receive, or 7816 port 0. |
| 37 | PE.3/CLKOUT/SEG53 | bidirectional | GPIO, internal divided clock output (ESAM/CARD clock), or LCD SEG53 output. |
| 38 | PE.4/RX3/7816_1 | bidirectional | GPIO, UART3 receive, or 7816 port 1. |
| 39 | PE.5/TX3/SEG49 | bidirectional | GPIO, UART3 transmit, or LCD SEG49 output. |
| 40 | PC.8/TOUT1/INT7 | bidirectional | GPIO, second-pulse output 1 (TOUT1), or external interrupt input INT7. |
| 41 | DGND | power_in | Chip digital ground. |
| 42 | VDD | power_in | Internal power input supplying the internal digital supply; must be externally connected to the other VDD pin. |
| 43 | PA.3/SEG31 | bidirectional | GPIO or LCD SEG31 driver output. |
| 44 | PD.5/SEG21/SCANOUT3 | bidirectional | GPIO, LCD SEG21 output, or keyscan row output SCANOUT3; output drive 5mA. |
| 45 | PD.4/SEG20/SCANOUT2 | bidirectional | GPIO, LCD SEG20 output, or keyscan row output SCANOUT2; output drive 5mA. |
| 46 | PD.3/SEG19/SCANOUT1 | bidirectional | GPIO, LCD SEG19 output, or keyscan row output SCANOUT1; output drive 5mA. |
| 47 | PD.2/SEG18/SCANOUT0 | bidirectional | GPIO, LCD SEG18 output, or keyscan row output SCANOUT0; output drive 5mA. |
| 48 | /RST | input | Active-low reset input with 2us filter; a low pulse wider than 2us resets the chip. |
| 49 | PA.8/INT3/SEG34 | bidirectional | High-current GPIO (30mA drive), external interrupt input INT3 (2us filter) or LCD SEG34 output. |
| 50 | PC.3/TX0/SEG46 | bidirectional | GPIO, UART0 transmit, or LCD SEG46 output. |
| 51 | PC.2/RX0/SEG45 | bidirectional | GPIO, UART0 receive, or LCD SEG45 output. |
| 52 | PD.13/COM5/SEG25 | bidirectional | GPIO, LCD COM5, or LCD SEG25 driver output. |
| 53 | PD.12/COM4/SEG24 | bidirectional | GPIO, LCD COM4, or LCD SEG24 driver output. |
| 54 | PD.11/COM3 | bidirectional | GPIO or LCD COM3 driver output. |
| 55 | PD.10/COM2 | bidirectional | GPIO or LCD COM2 driver output. |
| 56 | PD.9/COM1 | bidirectional | GPIO or LCD COM1 driver output. |
| 57 | PD.8/COM0 | bidirectional | GPIO or LCD COM0 driver output. |
| 58 | PA.5/INT0/SCANIN0 | bidirectional | GPIO, external interrupt input INT0 (2us filter), or keyscan column input SCANIN0. |
| 59 | VBAT | power_in | Battery supply input. |
| 60 | VSYS | power_in | System power supply input. |
| 61 | VDD | power_out | System power output; must be externally connected to the other VDD pin. |
| 62 | GND | power_in | Ground (listed as analog ground). |
| 63 | PE.7/LVDIN0/SEG47 | bidirectional | GPIO, external power-detect input LVDIN0, or LCD SEG47 output. |
| 64 | OSCO | output | External low-frequency clock (crystal) drive output. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HiTrend Tech (Shanghai) |
| Package | LQFP-64(10x10) |
| Category | Embedded Processors & Controllers |
| Pins | 64 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input supply voltage | VCC | 2.2 | 3.3 | 5.5 | V | Voltage on input supply pin | 299 |
| High-level input voltage (Reset, TEST) | Vih1 | 0.8 | VCC | Reset pin, TEST pin | 299 | ||
| High-level input voltage (PC9,PC10,PE0,PE3,PE6) | Vih2 | 0.6 | VCC | PC9,PC10,PE0,PE3,PE6 | 299 | ||
| High-level input voltage (other pins) | Vih3 | 0.7 | VCC | All pins except power, ground, Reset, TEST, PC9, PC10, PE0, PE3, PE6 | 299 | ||
| Low-level input voltage | Vil | 0.2 | VCC | All pins except power and ground | 299 | ||
| Supply voltage (limit table) | VCC | 2.2 | 5.5 | V | Voltage on input supply pin | 300 | |
| Digital input voltage | Vi | 0 | 5.5 | V | All digital pins | 300 | |
| ADC input limit voltage | Via | 0 | 3 | V | ADC pin input voltage; above this the pin may be damaged | 300 | |
| VBAT input limit voltage | Vib | 0 | 5 | V | VBAT pin input voltage; above this the pin may be damaged | 300 | |
| Input current | Idd | 50 | mA | VCC supply pin | 300 | ||
| Ground current | Iss | 50 | mA | All GND pins | 300 | ||
| Storage temperature | Tstg | -65 | 150 | ℃ | Chip limit storage temperature | 300 | |
| ESD (HBM), ADC input pins | Vesd | -6000 | 6000 | V | ADC input pins | 300 | |
| ESD (HBM), all pins | Vesd | -8000 | 8000 | V | All chip pins | 300 | |
| Operating voltage range | 2.2 | 5.5 | V | 10 | |||
| Operating temperature range | -40 | 85 | ℃ | 10 | |||
| Internal reference voltage temperature coefficient | -10 | 10 | ppm/℃ | On-chip reference 1.2V | 11 | ||
| Hold mode power consumption at -45℃ | 2.2 | uA | 3.3V supply, Hold mode, -45℃ | 300 | |||
| Hold mode power consumption at room temperature | 3.9 | uA | 3.3V supply, Hold mode, room temperature | 300 | |||
| Hold mode power consumption at 85℃ | 34.3 | uA | 3.3V supply, Hold mode, 85℃ | 300 | |||
| Sleep mode power consumption at -45℃ | 1.9 | uA | 3.3V supply, Sleep mode, -45℃ | 301 | |||
| Sleep mode power consumption at room temperature | 2.9 | uA | 3.3V supply, Sleep mode, room temperature | 301 | |||
| Sleep mode power consumption at 85℃ | 16 | uA | 3.3V supply, Sleep mode, 85℃ | 301 | |||
| HRC module power consumption | 116 | uA | 3.3V supply | 301 | |||
| LRC module power consumption | 0.9 | uA | 3.3V supply | 301 | |||
| PLL module power consumption | 205 | uA | 3.3V supply | 301 |
CAD (KiCad official)
- Symbol:
HT5027 - Footprint:
Package_QFP:LQFP-64_10x10mm_P0.5mm - 3D model: LQFP-64(10x10) (KiCad packages3D, STEP)
- 3D model files:
ht5027-etched.step/ht5027-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ht5027.step/ht5027.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HiTrend Tech (Shanghai) datasheet (307 pp, sha256
1116db0452f89da9, retrieved 2026-10-23, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).