component
HT4093ARZ
Public Made by Adomby adom
HTCSEMI Flip Flops, SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHT4093ARZ
HTCSEMI · Flip Flops · SOIC-14
HT4093ARZ from HTCSEMI, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN 1A | input | Input 1 of Schmitt-trigger NAND gate A; unused inputs must be tied to an appropriate logic level (VSS or VDD), never left floating. |
| 2 | IN 2A | input | Input 2 of Schmitt-trigger NAND gate A; unused inputs must be tied to an appropriate logic level (VSS or VDD), never left floating. |
| 3 | OUTA | output | Output of NAND gate A; Vout must stay within VSS to VDD, and unused outputs must be left open. |
| 4 | OUTB | output | Output of NAND gate B; Vout must stay within VSS to VDD, and unused outputs must be left open. |
| 5 | IN 1B | input | Input 1 of Schmitt-trigger NAND gate B; unused inputs must be tied to an appropriate logic level (VSS or VDD), never left floating. |
| 6 | IN 2B | input | Input 2 of Schmitt-trigger NAND gate B; unused inputs must be tied to an appropriate logic level (VSS or VDD), never left floating. |
| 7 | VSS | power_in | Ground/negative supply reference; all voltages are referenced to VSS. |
| 8 | IN 1C | input | Input 1 of Schmitt-trigger NAND gate C; unused inputs must be tied to an appropriate logic level (VSS or VDD), never left floating. |
| 9 | IN 2C | input | Input 2 of Schmitt-trigger NAND gate C; unused inputs must be tied to an appropriate logic level (VSS or VDD), never left floating. |
| 10 | OUTC | output | Output of NAND gate C; Vout must stay within VSS to VDD, and unused outputs must be left open. |
| 11 | OUTD | output | Output of NAND gate D; Vout must stay within VSS to VDD, and unused outputs must be left open. |
| 12 | IN 1D | input | Input 1 of Schmitt-trigger NAND gate D; unused inputs must be tied to an appropriate logic level (VSS or VDD), never left floating. |
| 13 | IN 2D | input | Input 2 of Schmitt-trigger NAND gate D; unused inputs must be tied to an appropriate logic level (VSS or VDD), never left floating. |
| 14 | VDD | power_in | Positive supply; the datasheet rates VDD at 3.0 Vdc to 18 Vdc (absolute maximum −0.5 to +18.0 V with respect to VSS). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HTCSEMI |
| Package | SOIC-14 |
| Category | Logic |
| Pins | 14 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage '0' Level | VOL | 0.05 | Vdc | VDD 5.0 Vdc; Vin = VDD or 0; TA 25°C | 3 | ||
| Output Voltage '1' Level | VOH | 4.95 | Vdc | VDD 5.0 Vdc; Vin = 0 or VDD; TA 25°C | 3 | ||
| Output Voltage '1' Level | VOH | 9.95 | Vdc | VDD 10 Vdc; Vin = 0 or VDD; TA 25°C | 3 | ||
| Output Voltage '1' Level | VOH | 14.95 | Vdc | VDD 15 Vdc; Vin = 0 or VDD; TA 25°C | 3 | ||
| Output Drive Current, Source | IOH | -2.4 | mAdc | VDD 5.0 Vdc; VOH = 2.5 Vdc; TA 25°C | 3 | ||
| Output Drive Current, Source | IOH | -0.51 | mAdc | VDD 5.0 Vdc; VOH = 4.6 Vdc; TA 25°C | 3 | ||
| Output Drive Current, Source | IOH | -1.3 | mAdc | VDD 10 Vdc; VOH = 9.5 Vdc; TA 25°C | 3 | ||
| Output Drive Current, Source | IOH | -3.4 | mAdc | VDD 15 Vdc; VOH = 13.5 Vdc; TA 25°C | 3 | ||
| Output Drive Current, Sink | IOL | 0.51 | mAdc | VDD 5.0 Vdc; VOL = 0.4 Vdc; TA 25°C | 3 | ||
| Output Drive Current, Sink | IOL | 1.3 | mAdc | VDD 10 Vdc; VOL = 0.5 Vdc; TA 25°C | 3 | ||
| Output Drive Current, Sink | IOL | 3.4 | mAdc | VDD 15 Vdc; VOL = 1.5 Vdc; TA 25°C | 3 | ||
| Input Current | Iin | 0.1 | µAdc | VDD 15 Vdc; TA −55°C | 3 | ||
| Input Current | Iin | 1 | µAdc | VDD 15 Vdc; TA 125°C | 3 | ||
| Input Capacitance | Cin | 7.5 | pF | Vin = 0 | 3 | ||
| Quiescent Current (Per Package) | IDD | 0.25 | µAdc | VDD 5.0 Vdc; TA 25°C | 3 | ||
| Quiescent Current (Per Package) | IDD | 0.5 | µAdc | VDD 10 Vdc; TA 25°C | 3 | ||
| Quiescent Current (Per Package) | IDD | 1 | µAdc | VDD 15 Vdc; TA 25°C | 3 | ||
| Quiescent Current (Per Package) | IDD | 7.5 | µAdc | VDD 5.0 Vdc; TA 125°C | 3 | ||
| Quiescent Current (Per Package) | IDD | 15 | µAdc | VDD 10 Vdc; TA 125°C | 3 | ||
| Quiescent Current (Per Package) | IDD | 30 | µAdc | VDD 15 Vdc; TA 125°C | 3 | ||
| Hysteresis Voltage | VH | 0.3 | Vdc | VDD 5.0 Vdc; TA 25°C | 3 | ||
| Hysteresis Voltage | VH | 1.2 | Vdc | VDD 10 Vdc; TA 25°C | 3 | ||
| Hysteresis Voltage | VH | 1.6 | Vdc | VDD 15 Vdc; TA 25°C | 3 | ||
| Hysteresis Voltage | VH | 2 | Vdc | VDD 5.0 Vdc; TA 25°C | 3 | ||
| Hysteresis Voltage | VH | 3.4 | Vdc | VDD 10 Vdc; TA 25°C | 3 | ||
| Hysteresis Voltage | VH | 5 | Vdc | VDD 15 Vdc; TA 25°C | 3 | ||
| Threshold Voltage, Positive-Going | VT+ | 2.2 | Vdc | VDD 5.0 Vdc; TA 25°C | 3 | ||
| Threshold Voltage, Positive-Going | VT+ | 4.6 | Vdc | VDD 10 Vdc; TA 25°C | 3 | ||
| Threshold Voltage, Positive-Going | VT+ | 6.8 | Vdc | VDD 15 Vdc; TA 25°C | 3 | ||
| Threshold Voltage, Positive-Going | VT+ | 3.6 | Vdc | VDD 5.0 Vdc; TA 25°C | 3 | ||
| Threshold Voltage, Positive-Going | VT+ | 7.1 | Vdc | VDD 10 Vdc; TA 25°C | 3 | ||
| Threshold Voltage, Positive-Going | VT+ | 10.8 | Vdc | VDD 15 Vdc; TA 25°C | 3 | ||
| Threshold Voltage, Negative-Going | VT- | 0.9 | Vdc | VDD 5.0 Vdc; TA 25°C | 3 | ||
| Threshold Voltage, Negative-Going | VT- | 2.5 | Vdc | VDD 10 Vdc; TA 25°C | 3 | ||
| Threshold Voltage, Negative-Going | VT- | 4 | Vdc | VDD 15 Vdc; TA 25°C | 3 | ||
| Threshold Voltage, Negative-Going | VT- | 2.8 | Vdc | VDD 5.0 Vdc; TA 25°C | 3 | ||
| Threshold Voltage, Negative-Going | VT- | 5.2 | Vdc | VDD 10 Vdc; TA 25°C | 3 | ||
| Threshold Voltage, Negative-Going | VT- | 7.4 | Vdc | VDD 15 Vdc; TA 25°C | 3 | ||
| Output Rise Time | tTLH | 200 | ns | CL = 50 pF, TA = 25°C; VDD 5.0 Vdc | 4 | ||
| Output Rise Time | tTLH | 100 | ns | CL = 50 pF, TA = 25°C; VDD 10 Vdc | 4 | ||
| Output Rise Time | tTLH | 80 | ns | CL = 50 pF, TA = 25°C; VDD 15 Vdc | 4 | ||
| Output Fall Time | tTHL | 200 | ns | CL = 50 pF, TA = 25°C; VDD 5.0 Vdc | 4 | ||
| Output Fall Time | tTHL | 100 | ns | CL = 50 pF, TA = 25°C; VDD 10 Vdc | 4 | ||
| Output Fall Time | tTHL | 80 | ns | CL = 50 pF, TA = 25°C; VDD 15 Vdc | 4 | ||
| Propagation Delay Time | tPLH, tPHL | 250 | ns | CL = 50 pF, TA = 25°C; VDD 5.0 Vdc | 4 | ||
| Propagation Delay Time | tPLH, tPHL | 100 | ns | CL = 50 pF, TA = 25°C; VDD 10 Vdc | 4 | ||
| Propagation Delay Time | tPLH, tPHL | 80 | ns | CL = 50 pF, TA = 25°C; VDD 15 Vdc | 4 | ||
| DC Supply Voltage Range | VDD | -0.5 | 18 | V | 1 | ||
| Input or Output Voltage Range (DC or Transient); maximum is VDD + 0.5 V | Vin, Vout | -0.5 | V | DC or Transient | 1 | ||
| Input or Output Current (DC or Transient) per pin | Iin, Iout | 10 | mA | DC or Transient, per pin | 1 | ||
| Power Dissipation, per Package | PD | 500 | mW | per package (Note 1) | 1 | ||
| Ambient Temperature Range | TA | -55 | 125 | °C | 1 | ||
| Storage Temperature Range | Tstg | -65 | 150 | °C | 1 | ||
| Lead Temperature | TL | 260 | °C | 8-second soldering | 1 | ||
| Supply Voltage Range | VDD | 3 | 18 | Vdc | 1 | ||
| Temperature Derating, Power Dissipation (D/DW packages) | -7 | mW/°C | From 65°C to 125°C (Note 1) | 1 |
CAD (KiCad official)
- Symbol:
HT4093ARZ - Footprint:
Package_SO:SOIC-14_3.9x8.7mm_P1.27mm - 3D model: SOIC-14 (KiCad packages3D, STEP)
- 3D model files:
ht4093arz-etched.step/ht4093arz-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ht4093arz.step/ht4093arz.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HTCSEMI datasheet (7 pp, sha256
b7aa7407b6636c01, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).