# HT336AR-25

**HTCSEMI** · Voltage Reference · SOP-8

HT336AR-25 from HTCSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection. |
| 2 | NC | unconnected | No connection. |
| 3 | NC | unconnected | No connection. |
| 4 | ANODE | passive | Anode of the 2.5V shunt regulator, the ground-side terminal (reverse current IR max 15 mA, forward current IF max 10 mA). |
| 5 | ADJ | passive | Adjust terminal used to trim the reference voltage and temperature coefficient. |
| 6 | NC | unconnected | No connection. |
| 7 | NC | unconnected | No connection. |
| 8 | CATHODE | passive | Cathode of the 2.5V shunt regulator, the reference voltage output terminal (reverse current IR max 15 mA). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HTCSEMI |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage | VR | 2.44 | 2.49 | 2.54 | V | TA = +25C, IR = 1mA | 3 |
| Reverse Breakdown Change with Current | VR/IR |  | 2.6 | 10 | mV | TA = +25C, 400A IR 10mA | 3 |
| Reverse Dynamic Impedance | ZD |  | 0.2 | 1 |  | TA = +25C, IR = 1mA | 3 |
| Temperature Stability | STT |  | 1.8 | 6 | mV | IR = 1mA | 3 |
| Reverse Breakdown Change with Current | VR/IR |  | 3 | 12 | mV | 400A IR 10mA | 3 |
| Reverse Dynamic Impedance | ZD |  | 0.4 | 1.4 |  | IR = 1mA | 3 |
| Reverse Current | IR |  |  | 15 | mA |  | 3 |
| Forward Current | IF |  |  | 10 | mA |  | 3 |
| Operating Temperature Range (HT336A-25) | TOPR | -45 |  | 85 | C |  | 3 |
| Storage Temperature Range (printed as HT236A-25) | TSTG |  |  | 150 | C |  | 3 |

## CAD (KiCad official)

- Symbol: `HT336AR-25`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `ht336ar-25-etched.step` / `ht336ar-25-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ht336ar-25.step` / `ht336ar-25.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HTCSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588947496626229248) (6 pp, sha256 `a7b90e7e026d26e4`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ht336ar-25-datasheet.pdf)