component
HT24C64ARZ
Public Made by Adomby adom
HTCSEMI EEPROM, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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HT24C64ARZ
HTCSEMI · EEPROM · SOP-8
HT24C64ARZ from HTCSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A0 | input | Device address input hardwired to set the device address; if left floating it is internally pulled down to GND (connect to GND if board VCC-plane coupling exceeds 3pF). |
| 2 | A1 | input | Device address input hardwired to set the device address; if left floating it is internally pulled down to GND (connect to GND if board VCC-plane coupling exceeds 3pF). |
| 3 | A2 | input | Device address input hardwired to set the device address, allowing up to eight devices on one bus; if left floating it is internally pulled down to GND. |
| 4 | GND | power_in | Ground. |
| 5 | SDA | bidirectional | Serial data input/output; open-drain driven and may be wire-ORed with other open-drain or open-collector devices, requiring an external pull-up. |
| 6 | SCL | input | Serial clock input; positive edge clocks data into the device and negative edge clocks data out. |
| 7 | WP | input | Write protect: connected to GND allows normal read/write, connected to VCC inhibits all writes to the memory; internally pulled down to GND if left floating. |
| 8 | VCC | power_in | Power supply, 1.7V to 5.5V operating range. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HTCSEMI |
| Package | SOP-8 |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 1.7 | 5.5 | V | 4 | ||
| Supply Current (read) | ICC1 | 0.4 | 1 | mA | VCC = 5.0V, Read at 400KHz | 4 | |
| Supply Current (write) | ICC2 | 2 | 3 | mA | VCC = 5.0V, Write at 400KHz | 4 | |
| Standby Current | ISB1 | 1 | µA | VCC = 1.7V, VIN = VCC/ VSS | 4 | ||
| Standby Current | ISB2 | 6 | µA | VCC = 5.5V, VIN = VCC/ VSS | 4 | ||
| Input Leakage Current | ILI | 0.1 | 3 | µA | VIN = VCC/VSS | 4 | |
| Output Leakage Current | ILO | 0.05 | 3 | µA | VOUT = VCC/ VSS | 4 | |
| Input Low Level | VIL | -0.6 | V | 4 | |||
| Output Low Level 2 | VOL2 | 0.4 | V | VCC = 3.0V, IOL = 2.1 mA | 4 | ||
| Output Low Level 1 | VOL1 | 0.2 | V | VCC =1.7V, IOL = 0.15 mA | 4 | ||
| Input Capacitance | CIN | 6 | pF | VIN = 0V, f = 1MHz | 4 | ||
| Output Capacitance | COUT | 8 | pF | VOUT = 0V, f = 1MHz | 4 | ||
| Clock Frequency, SCL | fSCL | 400 | kHz | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 | ||
| Clock Pulse Width Low | tLOW | 1.3 | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 | ||
| Clock Pulse Width High | tHIGH | 0.6 | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 | ||
| Noise Suppression Time | tI | 80 | ns | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 | ||
| Clock Low to Data Out Valid | tAA | 0.1 | 0.9 | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 | |
| Bus Free Time | tBUF | 1.3 | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 | ||
| Start Hold Time | tHD.STA | 0.6 | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 | ||
| Start Setup Time | tSU.STA | 0.6 | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 | ||
| Data In Hold Time | tHD.DAT | 0 | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 | ||
| Data In Setup Time | tSU.DAT | 100 | ns | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 | ||
| Inputs Rise Time | tR | 300 | ns | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 | ||
| Inputs Fall Time | tF | 300 | ns | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 | ||
| Stop Setup Time | tSU.STO | 0.6 | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 | ||
| Data Out Hold Time | tDH | 100 | ns | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 | ||
| Write Cycle Time | tWR | 5 | ms | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 | ||
| Endurance | 1e+06 | Write Cycles | 3.3V, 25°C, Page Mode | 5 | |||
| Clock Frequency, SCL | fSCL | 1 | MHz | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 | ||
| Clock Pulse Width Low | tLOW | 500 | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 | ||
| Clock Pulse Width High | tHIGH | 320 | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 | ||
| Clock Low to Data Out Valid | tAA | 450 | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 | ||
| Bus Free Time | tBUF | 500 | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 | ||
| Start Hold Time | tHD.STA | 250 | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 | ||
| Start Setup Time | tSU.STA | 250 | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 | ||
| Data In Hold Time | tHD.DAT | 0 | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 | ||
| Data In Setup Time | tSU.DAT | 50 | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 | ||
| Inputs Rise Time | tR | 120 | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 | ||
| Inputs Fall Time | tF | 120 | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 | ||
| Stop Setup Time | tSU.STO | 250 | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 | ||
| Voltage on Any Pin with Respect to Ground | -1 | 7 | V | 1 | |||
| Maximum Operating Voltage | 6.25 | V | 1 | ||||
| DC Output Current | 5 | mA | 1 | ||||
| Operating Temperature (Plastic Package) | -55 | 125 | °C | Plastic package | 1 | ||
| Storage Temperature (Plastic Package) | -65 | 150 | °C | Plastic package | 1 | ||
| Operating Temperature (recommended range) | TA | -40 | 85 | °C | VCC = +1.7V to +5.5V | 4 |
CAD (KiCad official)
- Symbol:
HT24C64ARZ - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
ht24c64arz-etched.step/ht24c64arz-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ht24c64arz.step/ht24c64arz.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HTCSEMI datasheet (19 pp, sha256
6477104016106e67, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HT24C64ARZ
**HTCSEMI** · EEPROM · SOP-8
HT24C64ARZ from HTCSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A0 | input | Device address input hardwired to set the device address; if left floating it is internally pulled down to GND (connect to GND if board VCC-plane coupling exceeds 3pF). |
| 2 | A1 | input | Device address input hardwired to set the device address; if left floating it is internally pulled down to GND (connect to GND if board VCC-plane coupling exceeds 3pF). |
| 3 | A2 | input | Device address input hardwired to set the device address, allowing up to eight devices on one bus; if left floating it is internally pulled down to GND. |
| 4 | GND | power_in | Ground. |
| 5 | SDA | bidirectional | Serial data input/output; open-drain driven and may be wire-ORed with other open-drain or open-collector devices, requiring an external pull-up. |
| 6 | SCL | input | Serial clock input; positive edge clocks data into the device and negative edge clocks data out. |
| 7 | WP | input | Write protect: connected to GND allows normal read/write, connected to VCC inhibits all writes to the memory; internally pulled down to GND if left floating. |
| 8 | VCC | power_in | Power supply, 1.7V to 5.5V operating range. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HTCSEMI |
| Package | SOP-8 |
| Category | Memory |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 1.7 | | 5.5 | V | | 4 |
| Supply Current (read) | ICC1 | | 0.4 | 1 | mA | VCC = 5.0V, Read at 400KHz | 4 |
| Supply Current (write) | ICC2 | | 2 | 3 | mA | VCC = 5.0V, Write at 400KHz | 4 |
| Standby Current | ISB1 | | | 1 | µA | VCC = 1.7V, VIN = VCC/ VSS | 4 |
| Standby Current | ISB2 | | | 6 | µA | VCC = 5.5V, VIN = VCC/ VSS | 4 |
| Input Leakage Current | ILI | | 0.1 | 3 | µA | VIN = VCC/VSS | 4 |
| Output Leakage Current | ILO | | 0.05 | 3 | µA | VOUT = VCC/ VSS | 4 |
| Input Low Level | VIL | -0.6 | | | V | | 4 |
| Output Low Level 2 | VOL2 | | | 0.4 | V | VCC = 3.0V, IOL = 2.1 mA | 4 |
| Output Low Level 1 | VOL1 | | | 0.2 | V | VCC =1.7V, IOL = 0.15 mA | 4 |
| Input Capacitance | CIN | | | 6 | pF | VIN = 0V, f = 1MHz | 4 |
| Output Capacitance | COUT | | | 8 | pF | VOUT = 0V, f = 1MHz | 4 |
| Clock Frequency, SCL | fSCL | | | 400 | kHz | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 |
| Clock Pulse Width Low | tLOW | 1.3 | | | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 |
| Clock Pulse Width High | tHIGH | 0.6 | | | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 |
| Noise Suppression Time | tI | | | 80 | ns | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 |
| Clock Low to Data Out Valid | tAA | 0.1 | | 0.9 | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 |
| Bus Free Time | tBUF | 1.3 | | | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 |
| Start Hold Time | tHD.STA | 0.6 | | | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 |
| Start Setup Time | tSU.STA | 0.6 | | | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 |
| Data In Hold Time | tHD.DAT | 0 | | | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 |
| Data In Setup Time | tSU.DAT | 100 | | | ns | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 |
| Inputs Rise Time | tR | | | 300 | ns | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 |
| Inputs Fall Time | tF | | | 300 | ns | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 |
| Stop Setup Time | tSU.STO | 0.6 | | | µs | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 |
| Data Out Hold Time | tDH | 100 | | | ns | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 |
| Write Cycle Time | tWR | | | 5 | ms | TA = -40°C to +85°C, VCC = +1.7V to +5.5V, CL = 100 pF | 5 |
| Endurance | | 1e+06 | | | Write Cycles | 3.3V, 25°C, Page Mode | 5 |
| Clock Frequency, SCL | fSCL | | | 1 | MHz | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 |
| Clock Pulse Width Low | tLOW | 500 | | | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 |
| Clock Pulse Width High | tHIGH | 320 | | | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 |
| Clock Low to Data Out Valid | tAA | | | 450 | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 |
| Bus Free Time | tBUF | 500 | | | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 |
| Start Hold Time | tHD.STA | 250 | | | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 |
| Start Setup Time | tSU.STA | 250 | | | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 |
| Data In Hold Time | tHD.DAT | 0 | | | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 |
| Data In Setup Time | tSU.DAT | 50 | | | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 |
| Inputs Rise Time | tR | | | 120 | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 |
| Inputs Fall Time | tF | | | 120 | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 |
| Stop Setup Time | tSU.STO | 250 | | | ns | TA = -40°C to +85°C, VCC = +2.5V to +5.5V, CL = 100 pF | 5 |
| Voltage on Any Pin with Respect to Ground | | -1 | | 7 | V | | 1 |
| Maximum Operating Voltage | | | | 6.25 | V | | 1 |
| DC Output Current | | | | 5 | mA | | 1 |
| Operating Temperature (Plastic Package) | | -55 | | 125 | °C | Plastic package | 1 |
| Storage Temperature (Plastic Package) | | -65 | | 150 | °C | Plastic package | 1 |
| Operating Temperature (recommended range) | TA | -40 | | 85 | °C | VCC = +1.7V to +5.5V | 4 |
## CAD (KiCad official)
- Symbol: `HT24C64ARZ`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `ht24c64arz-etched.step` / `ht24c64arz-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ht24c64arz.step` / `ht24c64arz.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HTCSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590233345331531776) (19 pp, sha256 `6477104016106e67`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ht24c64arz-datasheet.pdf)