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Contents

Pinout
Key specifications
Electrical characteristics
CAD (KiCad official)
Provenance

README

markdown

HT1117AM-3.3

HTCSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · TO-252

HT1117AM-3.3 from HTCSEMI, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	ADJ/GND	power_in	Adjust/ground pin, which is the ground reference for the fixed-output HT1117AM-3.3 (shown as the ground connection in the fixed output regulator figure); the datasheet gives no separate electrical limit for this pin.
2	VOUT	power_out	Regulated output, and the heatsink tab is connected to this pin; output current must not exceed 1.0 A when Vin is greater than 12 V, and the output short-circuit duration is stated as infinite.
3	VIN	power_in	Unregulated input supply, with a maximum input voltage of 20 V and a 1.4 V minimum input-to-output differential for regulation; a 10 µF input bypass capacitor is recommended.

Key specifications

Parameter	Value
Manufacturer	HTCSEMI
Package	TO-252
Category	Power Management (PMIC)
Pins	3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Output Voltage, Fixed 3.3 V (Iout = 10 mA, TA = 25 °C)	Vout	3.267	3.3	3.333	V	Vin = 5.3 V, Iout = 10 mA, TA = 25 °C	3
Output Voltage, Fixed 3.3 V (over line and load)	Vout	3.235		3.365	V	Vin = 4.75 V to 10 V, Iout = 0 mA to 800 mA (Note 4)	3
Line Regulation, Fixed 3.3 V	Regline		0.8	4.5	mV	Vin = 4.75 V to 15 V, Iout = 0 mA	3
Load Regulation, Fixed 3.3 V	Regline		4.3	10	mV	Iout = 0 mA to 800 mA, Vin = 4.75 V	3
Dropout Voltage at Iout = 100 mA	Vin-Vout		0.95	1.1	V	Measured at Vout − 100 mV, Iout = 100 mA	3
Dropout Voltage at Iout = 500 mA	Vin-Vout		1.01	1.15	V	Measured at Vout − 100 mV, Iout = 500 mA	3
Dropout Voltage at Iout = 800 mA	Vin-Vout		1.07	1.2	V	Measured at Vout − 100 mV, Iout = 800 mA	3
Output Current Limit	Iout	1000	1500	2200	mA	Vin−Vout = 5.0 V, TA = 25°C (Note 6)	3
Quiescent Current, 3.3 V	IQ		6	10	mA	Vin = 15 V	4
Thermal Regulation			0.01	0.1	%/W	TA = 25°C, 30 ms pulse	4
Input Voltage	Vin			20	V	Note 1	2
Maximum Die Junction Temperature Range	TJ	-55		150	°C		2
Storage Temperature Range	Tstg	-65		150	°C		2
Operating Ambient Temperature Range	TA	-40		125	°C		2
Thermal Resistance, Junction-to-Ambient (DPAK)	RJA		67		°C/W	DPAK (Case 369A), minimum size pad, 2.0 oz copper	2
Thermal Resistance, Junction-to-Case (DPAK)	RJC		6		°C/W	DPAK (Case 369A)	2

CAD (KiCad official)

Symbol: HT1117AM-3.3
Footprint: Package_TO_SOT_SMD:TO-252-2
3D model: TO-252 (KiCad packages3D, STEP)
3D model files: ht1117am-3-3-etched.step / ht1117am-3-3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ht1117am-3-3.step / ht1117am-3-3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: HTCSEMI datasheet (16 pp, sha256 2326163a9bda347d, retrieved 2026-10-19, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF