component
HT-3H4-ATP1
Public Made by Adomby adom
HENGTUO ELECTRONICS Transistor, Photovoltaic Output Optoisolators, SSOP-4. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 7d ago |
| viewers | 7d ago |
| ht-3h4-atp1-etched.glb | 7d ago |
| ht-3h4-atp1-etched.step | 7d ago |
| ht-3h4-atp1-hero.glb | 7d ago |
| ht-3h4-atp1-hero.overlay.json | 7d ago |
| ht-3h4-atp1.glb | 7d ago |
| ht-3h4-atp1.kicad_mod | 7d ago |
| ht-3h4-atp1.kicad_sym | 7d ago |
| ht-3h4-atp1.lbr | 7d ago |
| ht-3h4-atp1.step | 7d ago |
| package.json | 7d ago |
| page.json | 7d ago |
| README.md | 7d ago |
HT-3H4-ATP1
HENGTUO ELECTRONICS · Transistor, Photovoltaic Output Optoisolators · SSOP-4
HT-3H4-ATP1 from HENGTUO ELECTRONICS, in a SSOP-4. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Anode | input | Anode of the input LED pair (antiparallel LEDs, forward current up to ±50 mA, VF 1.2 V typ at IF=±20 mA). |
| 2 | Cathode | input | Cathode of the input LED pair (antiparallel LEDs, reverse voltage max 6 V, forward current up to ±50 mA). |
| 3 | Emitter | passive | Phototransistor emitter; VECO max 7 V, collector current max 50 mA. |
| 4 | Collector | passive | Phototransistor collector; VCEO max 80 V, collector current max 50 mA, collector power dissipation 150 mW. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HENGTUO ELECTRONICS |
| Package | SSOP-4 |
| Category | Optoisolators |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Current Transfer Ratio, rank A | CTR | 50 | 150 | % | IF=±1mA, VCE=5V, Ta=25°C | 5 | |
| Forward Voltage | VF | 1.2 | 1.4 | V | IF=±20mA | 5 | |
| Reverse Current | IR | 10 | μA | VR=4V | 5 | ||
| Terminal Capacitance | Ct | 30 | 250 | pF | V=0, f=1KHz | 5 | |
| Collector Dark Current | ICEO | 100 | nA | VCE=20V, IF=0 | 5 | ||
| Collector-Emitter Breakdown Voltage | BVCEO | 80 | V | IC=0.1mA, IF=0 | 5 | ||
| Emitter-Collector Breakdown Voltage | BVECO | 7 | V | IE=10µA, IF=0 | 5 | ||
| Collector-Emitter Saturation Voltage | VCE(sat) | 0.1 | 0.2 | V | IF=±20mA, IC=1mA | 5 | |
| Floating Capacitance | Cf | 0.6 | 1 | pF | V=0, f=1MHz | 5 | |
| Cut-off Frequency | fc | 80 | kHz | VCE=5V, IC=2mA, RL=100Ω, -3dB | 5 | ||
| Response Time (Rise) | tr | 4 | 18 | μs | VCE=2V, IC=2mA, RL=100Ω | 5 | |
| Response Time (Fall) | tf | 3 | 18 | μs | VCE=2V, IC=2mA, RL=100Ω | 5 | |
| Forward Current | IF | -50 | 50 | mA | 4 | ||
| Reverse Voltage | VR | 6 | V | 4 | |||
| Power Dissipation | PD | 70 | mW | 4 | |||
| Derating factor (power dissipation) | 2 | mW/°C | above Ta = 90°C | 4 | |||
| Collector - Emitter Voltage | VCEO | 80 | V | 4 | |||
| Emitter - Collector Voltage | VECO | 7 | V | 4 | |||
| Collector Current | IC | 50 | mA | 4 | |||
| Collector Power Dissipation | PC | 150 | mW | 4 | |||
| Derating factor (collector power dissipation) | 3.1 | mW/°C | above Ta = 70°C | 4 | |||
| Operating temperature range | Top | -55 | 110 | °C | 4 | ||
| Storage temperature range | Tstg | -55 | 125 | °C | 4 | ||
| Total Power consumption | P(W) | 200 | mW | 4 | |||
| Isolation Voltage | VISO | 3750 | Vrms | AC for 1 minute, R.H. 40~60%, pins 1,2 shorted; pins 3,4 shorted | 4 | ||
| Soldering Temperature | TSOL | 260 | °C | for 10 seconds | 4 |
CAD (KiCad official)
- Symbol:
HT-3H4-ATP1 - Footprint:
Package_SO:SSOP-4_4.4x2.6mm_P1.27mm - 3D model: SSOP-4, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.75 mm nominal SSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
ht-3h4-atp1-etched.step/ht-3h4-atp1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ht-3h4-atp1.step/ht-3h4-atp1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HENGTUO ELECTRONICS datasheet (12 pp, sha256
846d95afcba41053, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).