# HSZESD7351HT1G

**HXY MOSFET** · ESD And Surge Protection (TVS/ESD) · SOD-323

HSZESD7351HT1G from HXY MOSFET, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| IEC61000-4-2 ESD air discharge |  | -15 |  | 15 | kV | IEC61000-4-2 (ESD), air discharge | 1 |
| IEC61000-4-2 ESD contact discharge |  | -8 |  | 8 | kV | IEC61000-4-2 (ESD), contact discharge | 1 |
| IEC61000-4-4 EFT |  |  |  | 40 | A | IEC61000-4-4 (EFT), 5/50 ns per Features | 1 |
| Peak Pulse Power | PPP |  |  | 60 | W | tp = 8/20 μs | 1 |
| Storage Temperature Range | Tstg | -55 |  | 155 | °C |  | 1 |
| Operating Temperature Range | Top | -40 |  | 125 | °C |  | 1 |
| Maximum junction temperature | Tj |  |  | 150 | °C |  | 1 |
| Maximum lead temperature for soldering | TL |  |  | 260 | °C | during 10s | 1 |
| Reverse Breakdown Voltage | VBR | 4.2 |  |  | V | IT = 1mA | 2 |
| Reverse Leakage Current | IR |  |  | 0.1 | μA | VRWM = 3.3V | 2 |
| Clamping Voltage | VC |  |  | 10 | V | IRWM = 1A, tp = 8/20μs | 2 |
| Clamping Voltage | VC |  |  | 15 | V | IRWM = 4A, tp = 8/20μs | 2 |
| Junction Capacitance | CJ |  | 0.6 | 0.7 | pF | VR = 0V, f = 1MHz | 2 |

## CAD (KiCad official)

- Symbol: `HSZESD7351HT1G`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `hszesd7351ht1g-etched.step` / `hszesd7351ht1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hszesd7351ht1g.step` / `hszesd7351ht1g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HXY MOSFET datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603008865982435328) (5 pp, sha256 `c55fea6b81b178d7`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hszesd7351ht1g-datasheet.pdf)