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Ray Publish 0.1.0 1fafb3a 24d ago

HSZ1SMA40CAT3G

HXY MOSFET · ESD And Surge Protection (TVS/ESD) · SMA

HSZ1SMA40CAT3G from HXY MOSFET, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SMA
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak pulse power dissipation (10/1000µs waveform) PPPM 6.2 W 10/1000µs waveform, non-repetitive, Note1, Note2, Fig.1 1
Steady state power dissipation PM(AV) 3.3 W TA=50℃ (Fig.5) 1
Peak forward surge current IFSM 60 A 8.3ms single half sine-wave, superimposed on rated load (JEDEC Method), Note3, Fig.6 1
Operating junction and storage temperature range TJ,TSTG -65 150 °C 1
Reverse stand-off voltage VRWM 40 V 1
Breakdown voltage BR 44.4 49.1 V @IT test current 1 mA 1
Maximum clamping voltage VC 64.5 V @IPP peak pulse current 6.2 A 1
Typical thermal resistance junction to lead RθJL 30 °C/W 1
Typical thermal resistance junction to ambient RθJA 120 °C/W Mounted on 5.0mm×5.0mm (0.03mm thick) copper pads to each terminal (Note2) 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper 2. Mounted on 5.0mm×5.0mm (0.03mm thick) copper pads to each terminal. 1

CAD (KiCad official)

  • Symbol: HSZ1SMA40CAT3G
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA (KiCad packages3D, STEP)
  • 3D model files: hsz1sma40cat3g-etched.step / hsz1sma40cat3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hsz1sma40cat3g.step / hsz1sma40cat3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (4 pp, sha256 e9f3c88b39430fc1, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF