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HSU3119

HUASHUO · MOSFETs · TO-252-2L

HSU3119 from HUASHUO, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the P-channel MOSFET, with VGS rated ±20 V and threshold of -1.0 to -2.5 V at ID=-250uA.
2 D passive Drain, connected to the exposed tab; VDS rated -30 V and continuous drain current -130 A (package limited) at TC=25℃.
3 S passive Source; body-diode continuous source current rated -130 A with forward voltage max -1.2 V at IS=-20A.

Key specifications

Parameter Value
Manufacturer HUASHUO
Package TO-252-2L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -30 V VGS=0V, ID=-250uA 2
Static Drain-Source On-Resistance RDS(ON) 3 mΩ VGS=-10V, ID=-30A 2
Static Drain-Source On-Resistance RDS(ON) 4.2 mΩ VGS=-4.5V, ID=-20A 2
Gate Threshold Voltage VGS(th) -1 -2.5 V VGS=VDS, ID=-250uA 2
Drain-Source Leakage Current IDSS -1 uA VDS=-30V, VGS=0V, TJ=25℃ 2
Drain-Source Leakage Current IDSS -100 uA VDS=-30V, VGS=0V, TJ=125℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Diode Forward Voltage VSD -1.2 V VGS=0V, IS=-20A, TJ=25℃ 2
Continuous Source Current IS -130 A VG=VD=0V, Force Current 2
Drain-Source Voltage VDS -30 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID -130 A VGS @ -10V, TC=25℃ 1
Continuous Drain Current ID -81 A VGS @ -10V, TC=100℃ 1
Pulsed Drain Current IDM -510 A 1
Single Pulse Avalanche Energy EAS 1050 mJ 1
Avalanche Current IAS -75 A 1
Total Power Dissipation PD 135 W TC=25℃ 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Thermal Resistance Junction-ambient RθJA 20 ℃/W t≦10S 1
Thermal Resistance Junction-ambient RθJA 60 ℃/W Steady State 1
Thermal Resistance Junction-case RθJC 1.8 ℃/W 1

CAD (KiCad official)

  • Symbol: HSU3119
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: hsu3119-etched.step / hsu3119-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hsu3119.step / hsu3119.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HUASHUO datasheet (5 pp, sha256 5922e330f7937210, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF