component
HSU12P10
Public Made by Adomby adom
HUASHUO MOSFETs, TO-252-2. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
HSU12P10
HUASHUO · MOSFETs · TO-252-2
HSU12P10 from HUASHUO, in a TO-252-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; the pin config drawing labels G on the left lead, with gate-source voltage limited to ±20 V and threshold -1.2 to -3.0 V. |
| 2 | D | passive | Drain, the center stub and the metal tab, with drain-source voltage rated at -100 V and continuous current of -12 A at TC=25℃. |
| 3 | S | passive | Source; the pin config drawing labels S on the right lead. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HUASHUO |
| Package | TO-252-2 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -100 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | -12 | A | ID@TC=25℃; VGS @ -10V | 1 | ||
| Continuous Drain Current | ID | -6.8 | A | ID@TC=100℃; VGS @ -10V | 1 | ||
| Pulsed Drain Current | IDM | -25 | A | 1 | |||
| Single Pulse Avalanche Energy | EAS | 49 | mJ | 1 | |||
| Total Power Dissipation | PD | 35 | W | TC=25℃ | 1 | ||
| Storage Temperature Range | TSTG | -55 | 150 | ℃ | 1 | ||
| Operating Junction Temperature Range | TJ | -55 | 150 | ℃ | 1 | ||
| Thermal Resistance Junction-Ambient | RθJA | 62 | ℃/W | Note 1: surface mounted on 1 inch FR-4 board, 2OZ copper | 1 | ||
| Thermal Resistance Junction-Case | RθJC | 3.8 | ℃/W | Note 1: surface mounted on 1 inch FR-4 board, 2OZ copper | 1 | ||
| Drain-Source Breakdown Voltage | BVDSS | -100 | V | VGS=0V , ID=-250uA | 2 | ||
| Static Drain-Source On-Resistance | RDS(ON) | 240 | 270 | mΩ | VGS=-10V , ID=-5A | 2 | |
| Static Drain-Source On-Resistance | RDS(ON) | 260 | 340 | mΩ | VGS=-4.5V , ID=-5A | 2 | |
| Gate Threshold Voltage | VGS(th) | -1.2 | -1.7 | -3 | V | VGS=VDS , ID=-250uA | 2 |
| Drain-Source Leakage Current | IDSS | -50 | uA | VDS=-100V , VGS=0V , TJ=25℃ | 2 | ||
| Gate-Source Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V , VDS=0V | 2 | |
| Diode Forward Voltage | VSD | -1.2 | V | VGS=0V , IS=-1A , TJ=25℃ | 2 | ||
| Total Gate Charge | Qg | 17 | nC | VDS=-50V , VGS=-10V , ID=-5A | 2 | ||
| Gate-Source Charge | Qgs | 3.13 | nC | 2 | |||
| Gate-Drain Charge | Qgd | 2.7 | nC | 2 | |||
| Turn-On Delay Time | Td(on) | 11 | ns | VDD=-30V , VGS=-10V , RG=3.3, ID=-1A | 2 | ||
| Rise Time | Tr | 7.4 | ns | 2 | |||
| Turn-Off Delay Time | Td(off) | 39 | ns | 2 | |||
| Fall Time | Tf | 28 | ns | 2 | |||
| Input Capacitance | Ciss | 900 | pF | VDS=-30V , VGS=0V , f=1MHz | 2 | ||
| Output Capacitance | Coss | 40 | pF | 2 | |||
| Reverse Transfer Capacitance | Crss | 26 | pF | 2 |
CAD (KiCad official)
- Symbol:
HSU12P10 - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252-2 (KiCad packages3D, STEP)
- 3D model files:
hsu12p10-etched.step/hsu12p10-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hsu12p10.step/hsu12p10.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HUASHUO datasheet (6 pp, sha256
52720c030c22ba88, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HSU12P10
**HUASHUO** · MOSFETs · TO-252-2
HSU12P10 from HUASHUO, in a TO-252-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; the pin config drawing labels G on the left lead, with gate-source voltage limited to ±20 V and threshold -1.2 to -3.0 V. |
| 2 | D | passive | Drain, the center stub and the metal tab, with drain-source voltage rated at -100 V and continuous current of -12 A at TC=25℃. |
| 3 | S | passive | Source; the pin config drawing labels S on the right lead. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HUASHUO |
| Package | TO-252-2 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -100 | | | V | | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | | 1 |
| Continuous Drain Current | ID | -12 | | | A | ID@TC=25℃; VGS @ -10V | 1 |
| Continuous Drain Current | ID | -6.8 | | | A | ID@TC=100℃; VGS @ -10V | 1 |
| Pulsed Drain Current | IDM | -25 | | | A | | 1 |
| Single Pulse Avalanche Energy | EAS | | | 49 | mJ | | 1 |
| Total Power Dissipation | PD | | | 35 | W | TC=25℃ | 1 |
| Storage Temperature Range | TSTG | -55 | | 150 | ℃ | | 1 |
| Operating Junction Temperature Range | TJ | -55 | | 150 | ℃ | | 1 |
| Thermal Resistance Junction-Ambient | RθJA | | | 62 | ℃/W | Note 1: surface mounted on 1 inch FR-4 board, 2OZ copper | 1 |
| Thermal Resistance Junction-Case | RθJC | | | 3.8 | ℃/W | Note 1: surface mounted on 1 inch FR-4 board, 2OZ copper | 1 |
| Drain-Source Breakdown Voltage | BVDSS | -100 | | | V | VGS=0V , ID=-250uA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | | 240 | 270 | mΩ | VGS=-10V , ID=-5A | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | | 260 | 340 | mΩ | VGS=-4.5V , ID=-5A | 2 |
| Gate Threshold Voltage | VGS(th) | -1.2 | -1.7 | -3 | V | VGS=VDS , ID=-250uA | 2 |
| Drain-Source Leakage Current | IDSS | | | -50 | uA | VDS=-100V , VGS=0V , TJ=25℃ | 2 |
| Gate-Source Leakage Current | IGSS | -100 | | 100 | nA | VGS=±20V , VDS=0V | 2 |
| Diode Forward Voltage | VSD | | | -1.2 | V | VGS=0V , IS=-1A , TJ=25℃ | 2 |
| Total Gate Charge | Qg | | 17 | | nC | VDS=-50V , VGS=-10V , ID=-5A | 2 |
| Gate-Source Charge | Qgs | | 3.13 | | nC | | 2 |
| Gate-Drain Charge | Qgd | | 2.7 | | nC | | 2 |
| Turn-On Delay Time | Td(on) | | 11 | | ns | VDD=-30V , VGS=-10V , RG=3.3, ID=-1A | 2 |
| Rise Time | Tr | | 7.4 | | ns | | 2 |
| Turn-Off Delay Time | Td(off) | | 39 | | ns | | 2 |
| Fall Time | Tf | | 28 | | ns | | 2 |
| Input Capacitance | Ciss | | 900 | | pF | VDS=-30V , VGS=0V , f=1MHz | 2 |
| Output Capacitance | Coss | | 40 | | pF | | 2 |
| Reverse Transfer Capacitance | Crss | | 26 | | pF | | 2 |
## CAD (KiCad official)
- Symbol: `HSU12P10`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252-2 (KiCad packages3D, STEP)
- 3D model files: `hsu12p10-etched.step` / `hsu12p10-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hsu12p10.step` / `hsu12p10.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HUASHUO datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757800886372847616) (6 pp, sha256 `52720c030c22ba88`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hsu12p10-datasheet.pdf)