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HSP3031-01ETG

Public Made by Adom

by adom

HXY MOSFET ESD And Surge Protection (TVS/ESD), DFN1006-2L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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HSP3031-01ETG

HXY MOSFET · ESD And Surge Protection (TVS/ESD) · DFN1006-2L

HSP3031-01ETG from HXY MOSFET, in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Pin 1 passive One of the two terminals of the unidirectional ESD protection diode that protects one data or control line; the datasheet does not state its function or polarity beyond the circuit diagram.
2 A passive The other terminal of the unidirectional ESD protection diode that protects one data or control line; the datasheet does not state its function or polarity beyond the circuit diagram.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package DFN1006-2L
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Pulse Power PPP 60 W tp = 8/20 µs 1
IEC 61000-4-2 ESD contact discharge -20 20 kV IEC 61000-4-2 contact discharge 1
IEC 61000-4-2 ESD air discharge -20 20 kV IEC 61000-4-2 air discharge 1
IEC 61000-4-4 EFT current 40 A IEC 61000-4-4, 5/50 ns 1
Storage Temperature Range Tstg -55 150 °C 1
Maximum lead temperature for soldering TL 260 °C 10 s 1
Operating Temperature Range Top -55 150 °C 1
Maximum junction temperature Tj 150 °C 1
Reverse Working Voltage VRWM 5 V 2
Reverse Breakdown Voltage VBR 6 V IT = 1 mA 2
Reverse Leakage Current IR 100 nA VRWM = 5 V 2
Clamping Voltage VC 10 V IRWM = 1 A, tp = 8/20 µs 2
Clamping Voltage VC 15 V IRWM = 4 A, tp = 8/20 µs 2
Junction Capacitance CJ 0.6 0.8 pF VR = 0 V, f = 1 MHz 2

CAD (KiCad official)

  • Symbol: HSP3031-01ETG
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2L (KiCad packages3D, STEP)
  • 3D model files: hsp3031-01etg-etched.step / hsp3031-01etg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hsp3031-01etg.step / hsp3031-01etg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (5 pp, sha256 41a87224ec939758, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF