component
HSMF30ATP
Public Made by Adomby adom
HXY MOSFET ESD And Surge Protection (TVS/ESD), SOD-123FL. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 24d ago |
| viewers | 4d ago |
| hsmf30atp-etched.glb | 24d ago |
| hsmf30atp-etched.step | 24d ago |
| hsmf30atp-hero.glb | 24d ago |
| hsmf30atp-hero.overlay.json | 24d ago |
| hsmf30atp.glb | 24d ago |
| hsmf30atp.kicad_mod | 24d ago |
| hsmf30atp.kicad_sym | 4d ago |
| hsmf30atp.lbr | 4d ago |
| hsmf30atp.step | 24d ago |
| package.json | 24d ago |
| page.json | 24d ago |
| README.md | 24d ago |
HSMF30ATP
HXY MOSFET · ESD And Surge Protection (TVS/ESD) · SOD-123FL
HSMF30ATP from HXY MOSFET, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SOD-123FL |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power dissipation (10/1000μs waveform) | PPPM | 4.1 | W | 10/1000μs waveform, Note1, Note2, Fig.1; non-repetitive, derated above TA=25℃ per Fig.2 | 1 | ||
| Steady state power dissipation | PM(AV) | 1 | W | TA=50℃ (Fig.5) | 1 | ||
| Peak forward surge current | IFSM | 30 | A | 8.3ms single half sine-wave superimposed on rated load, JEDEC method (Note3, Fig.6) | 1 | ||
| Operating junction and storage temperature range | TJ,TSTG | -65 | 150 | °C | 1 | ||
| Reverse stand-off voltage (unidirectional) | VRWM | 30 | V | 1 | |||
| Breakdown voltage | BR | 33.3 | 36.8 | V | @IT test current 1 mA | 1 | |
| Maximum clamping voltage | VC | 48.4 | V | @IPP peak pulse current 4.1 A | 1 | ||
| Peak pulse current | IPP | 4.1 | A | 1 | |||
| Reverse leakage current | IR | 1 | μA | @VRWM | 1 | ||
| Typical thermal resistance junction to lead | RθJL | 38 | °C/W | 1 | |||
| Typical thermal resistance junction to ambient | RθJA | 180 | °C/W | Mounted on 5.0mm×5.0mm (0.03mm thick) copper pads to each terminal (Note 2) | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | 2. Mounted on 5.0mm×5.0mm (0.03mm thick) copper pads to each terminal. | 1 |
CAD (KiCad official)
- Symbol:
HSMF30ATP - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123FL (KiCad packages3D, STEP)
- 3D model files:
hsmf30atp-etched.step/hsmf30atp-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hsmf30atp.step/hsmf30atp.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (4 pp, sha256
27f3573186b1ac65, retrieved 2026-10-16, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).