# HSMF30AT1G

**HXY MOSFET** · ESD And Surge Protection (TVS/ESD) · SOD-123FL

HSMF30AT1G from HXY MOSFET, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, the terminal marked by the cathode band on the SOD-123FL body; the unidirectional HSMF30AT1G has VRWM 30 V, breakdown 33.3-36.8 V at 1 mA and maximum clamping voltage 48.4 V at 4.1 A. |
| 2 | A | passive | Anode, the terminal opposite the cathode band; it connects to the protected line's return, usually ground, for the unidirectional HSMF30AT1G. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SOD-123FL |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | VBR | 33.3 |  | 36.8 | V | @IT=1mA | 1 |
| Reverse Stand-Off Voltage | VRWM |  | 30 |  | V |  | 1 |
| Maximum Clamping Voltage | VC |  |  | 48.4 | V | @IPP=4.1A | 1 |
| Reverse Leakage | IR |  |  | 1 | μA | @VRWM | 1 |
| Steady state power dissipation | PM(AV) |  |  | 1 | W | TA=50℃ | 1 |
| Peak forward surge current | IFSM |  |  | 30 | A | 8.3ms single half sine-wave superimposed on rated load | 1 |
| Operating junction and storage temperature range | TJ,TSTG | -65 |  | 150 | °C |  | 1 |
| Thermal resistance junction to lead | RθJL |  | 38 |  | °C/W | Typical | 1 |
| Thermal resistance junction to ambient | RθJA |  | 180 |  | °C/W | Typical | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper |  | 2. Mounted on 5.0mm×5.0mm (0.03mm thick) copper pads to each terminal. | 1 |

## CAD (KiCad official)

- Symbol: `HSMF30AT1G`
- Footprint: `Diode_SMD:D_SOD-123F`
- 3D model: SOD-123FL (KiCad packages3D, STEP)
- 3D model files: `hsmf30at1g-etched.step` / `hsmf30at1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hsmf30at1g.step` / `hsmf30at1g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HXY MOSFET datasheet](docs/hsmf30at1g-datasheet.pdf) (4 pp, sha256 `cb9fc2d082226b55`, retrieved 2026-10-30, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hsmf30at1g-datasheet.pdf)