component
HSMF16AE3
Public Made by Adomby adom
HXY MOSFET ESD And Surge Protection (TVS/ESD), SOD-123FL. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownHSMF16AE3
HXY MOSFET · ESD And Surge Protection (TVS/ESD) · SOD-123FL
HSMF16AE3 from HXY MOSFET, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode terminal marked by the cathode band on the unidirectional HSMF16AE3, connected to the protected line, with 16.0 V reverse stand-off, 17.8-19.7 V breakdown at 1 mA and 26 V maximum clamping at 7.7 A peak pulse current. |
| 2 | A | passive | Anode terminal opposite the cathode band, normally tied to ground for the unidirectional HSMF16AE3 (the bidirectional C version has no polarity). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SOD-123FL |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | VBR | 17.8 | 19.7 | V | @IT = 1 mA, Ta=25°C | 1 | |
| Reverse Stand-Off Voltage | VRWM | 16 | V | Ta=25°C | 1 | ||
| Maximum Clamping Voltage | VC | 26 | V | @IPP = 7.7 A | 1 | ||
| Reverse Leakage | IR | 1 | μA | @VRWM | 1 | ||
| Peak Pulse Current | IPP | 7.7 | A | 10/1000μs waveform | 1 | ||
| Steady state power dissipation | PM(AV) | 1 | W | TA=50℃ | 1 | ||
| Peak forward surge current | IFSM | 30 | A | 8.3ms single half sine-wave superimposed on rated load | 1 | ||
| Operating junction and storage temperature range | TJ,TSTG | -65 | 150 | °C | 1 | ||
| Thermal resistance junction to lead | RθJL | 38 | °C/W | Typical | 1 | ||
| Thermal resistance junction to ambient | RθJA | 180 | °C/W | Typical | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | 2. Mounted on 5.0mm×5.0mm (0.03mm thick) copper pads to each terminal. | 1 |
CAD (KiCad official)
- Symbol:
HSMF16AE3 - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123FL (KiCad packages3D, STEP)
- 3D model files:
hsmf16ae3-etched.step/hsmf16ae3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hsmf16ae3.step/hsmf16ae3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (4 pp, sha256
72da0a0f28761c60, retrieved 2026-10-31, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).