component
HSH110P04
Public Made by Adomby adom
HUASHUO MOSFETs, TO-263. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
HSH110P04
HUASHUO · MOSFETs · TO-263
HSH110P04 from HUASHUO, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limit is ±20 V, with threshold VGS(th) of -1.2 V min to -2.5 V max at ID=-250uA. |
| 2 | D | passive | Drain (middle lead, also the exposed tab); drain-source voltage -40 V, continuous drain current -110 A at TC=25℃ and pulsed -295 A. |
| 3 | S | passive | Source; continuous source (body diode) current is -100 A max, with diode forward voltage -1.2 V max at IS=-1A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HUASHUO |
| Package | TO-263 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | -40 | V | VGS=0V, ID=-250uA | 2 | ||
| Static Drain-Source On-Resistance | RDS(ON) | 5.3 | 5.8 | mΩ | VGS=-10V, ID=-20A | 2 | |
| Static Drain-Source On-Resistance | RDS(ON) | 7 | 9.1 | mΩ | VGS=-4.5V, ID=-10A | 2 | |
| Gate Threshold Voltage | VGS(th) | -1.2 | -1.8 | -2.5 | V | VGS=VDS, ID=-250uA | 2 |
| Drain-Source Leakage Current | IDSS | 1 | uA | VDS=-32V, VGS=0V, TJ=25℃ | 2 | ||
| Drain-Source Leakage Current | IDSS | 5 | uA | VDS=-32V, VGS=0V, TJ=55℃ | 2 | ||
| Gate-Source Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V, VDS=0V | 2 | |
| Gate Resistance | Rg | 7 | 14 | VDS=0V, VGS=0V, f=1MHz | 2 | ||
| Continuous Source Current | IS | -100 | A | VG=VD=0V, Force Current | 2 | ||
| Diode Forward Voltage | VSD | -1.2 | V | VGS=0V, IS=-1A, TJ=25℃ | 2 | ||
| Drain-Source Voltage | VDS | -40 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | -110 | A | TC=25℃, VGS @ -10V | 1 | ||
| Continuous Drain Current | ID | -70 | A | TC=100℃, VGS @ -10V | 1 | ||
| Pulsed Drain Current | IDM | -295 | A | 1 | |||
| Single Pulse Avalanche Energy | EAS | 380 | mJ | Note 3: VDD=-32V, VGS=-10V, L=0.1mH, IAS=-50A | 1 | ||
| Avalanche Current | IAS | -50 | A | 1 | |||
| Total Power Dissipation | PD | 200 | W | TC=25℃ | 1 | ||
| Storage Temperature Range | TSTG | -55 | 150 | ℃ | 1 | ||
| Operating Junction Temperature Range | TJ | -55 | 150 | ℃ | 1 | ||
| Thermal Resistance Junction-Ambient | RθJA | 62 | ℃/W | Surface mounted on 1 inch² FR-4 board with 2OZ copper (Note 1) | 1 | ||
| Thermal Resistance Junction-Case | RθJC | 0.81 | ℃/W | 1 |
CAD (KiCad official)
- Symbol:
HSH110P04 - Footprint:
Package_TO_SOT_SMD:TO-263-2 - 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files:
hsh110p04-etched.step/hsh110p04-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hsh110p04.step/hsh110p04.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HUASHUO datasheet (6 pp, sha256
5490ac7038f32ab8, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HSH110P04
**HUASHUO** · MOSFETs · TO-263
HSH110P04 from HUASHUO, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limit is ±20 V, with threshold VGS(th) of -1.2 V min to -2.5 V max at ID=-250uA. |
| 2 | D | passive | Drain (middle lead, also the exposed tab); drain-source voltage -40 V, continuous drain current -110 A at TC=25℃ and pulsed -295 A. |
| 3 | S | passive | Source; continuous source (body diode) current is -100 A max, with diode forward voltage -1.2 V max at IS=-1A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HUASHUO |
| Package | TO-263 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | -40 | | | V | VGS=0V, ID=-250uA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | | 5.3 | 5.8 | mΩ | VGS=-10V, ID=-20A | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | | 7 | 9.1 | mΩ | VGS=-4.5V, ID=-10A | 2 |
| Gate Threshold Voltage | VGS(th) | -1.2 | -1.8 | -2.5 | V | VGS=VDS, ID=-250uA | 2 |
| Drain-Source Leakage Current | IDSS | | | 1 | uA | VDS=-32V, VGS=0V, TJ=25℃ | 2 |
| Drain-Source Leakage Current | IDSS | | | 5 | uA | VDS=-32V, VGS=0V, TJ=55℃ | 2 |
| Gate-Source Leakage Current | IGSS | -100 | | 100 | nA | VGS=±20V, VDS=0V | 2 |
| Gate Resistance | Rg | | 7 | 14 | | VDS=0V, VGS=0V, f=1MHz | 2 |
| Continuous Source Current | IS | | | -100 | A | VG=VD=0V, Force Current | 2 |
| Diode Forward Voltage | VSD | | | -1.2 | V | VGS=0V, IS=-1A, TJ=25℃ | 2 |
| Drain-Source Voltage | VDS | | | -40 | V | | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | | 1 |
| Continuous Drain Current | ID | | | -110 | A | TC=25℃, VGS @ -10V | 1 |
| Continuous Drain Current | ID | | | -70 | A | TC=100℃, VGS @ -10V | 1 |
| Pulsed Drain Current | IDM | | | -295 | A | | 1 |
| Single Pulse Avalanche Energy | EAS | | | 380 | mJ | Note 3: VDD=-32V, VGS=-10V, L=0.1mH, IAS=-50A | 1 |
| Avalanche Current | IAS | | | -50 | A | | 1 |
| Total Power Dissipation | PD | | | 200 | W | TC=25℃ | 1 |
| Storage Temperature Range | TSTG | -55 | | 150 | ℃ | | 1 |
| Operating Junction Temperature Range | TJ | -55 | | 150 | ℃ | | 1 |
| Thermal Resistance Junction-Ambient | RθJA | | | 62 | ℃/W | Surface mounted on 1 inch² FR-4 board with 2OZ copper (Note 1) | 1 |
| Thermal Resistance Junction-Case | RθJC | | | 0.81 | ℃/W | | 1 |
## CAD (KiCad official)
- Symbol: `HSH110P04`
- Footprint: `Package_TO_SOT_SMD:TO-263-2`
- 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files: `hsh110p04-etched.step` / `hsh110p04-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hsh110p04.step` / `hsh110p04.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HUASHUO datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757803744874369024) (6 pp, sha256 `5490ac7038f32ab8`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hsh110p04-datasheet.pdf)