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Contents

README

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HSH0139

HUASHUO · MOSFETs · TO-263

HSH0139 from HUASHUO, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limited to ±20 V, with threshold VGS(th) of -1.2 V min to -2.5 V max at ID=-250uA.
2 D passive Drain (middle stub lead, connected to the drain tab); VDS rated -100 V and continuous drain current -35 A at TC=25℃.
3 S passive Source; continuous source (body diode) current is -35 A max.

Key specifications

Parameter Value
Manufacturer HUASHUO
Package TO-263
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS -100 V VGS=0V, ID=-250uA 2
Static Drain-Source On-Resistance RDS(ON) 35 42 mΩ VGS=-10V, ID=-10A 2
Static Drain-Source On-Resistance RDS(ON) 40 50 mΩ VGS=-4.5V, ID=-8A 2
Gate Threshold Voltage VGS(th) -1.2 -1.8 -2.5 V VGS=VDS, ID=-250uA 2
Drain-Source Leakage Current IDSS -50 uA VDS=-100V, VGS=0V, TJ=25℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Continuous Source Current IS -35 A VG=VD=0V, Force Current 2
Diode Forward Voltage VSD 1.2 V VGS=0V, IS=-1A, TJ=25℃ 2
Drain-Source Voltage VDS -100 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID@TC=25℃ -35 A VGS @ -10V 1
Continuous Drain Current ID@TC=100℃ -23 A VGS @ -10V 1
Pulsed Drain Current IDM -100 A pulse width ≤300us, duty cycle ≤2% (note 2) 1
Single Pulse Avalanche Energy EAS 345 mJ VDD=-25V, VGS=-10V, L=0.88mH, IAS=-28A (note 3) 1
Avalanche Current IAS 28 A 1
Total Power Dissipation PD@TC=25℃ 104 W 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Thermal Resistance Junction-Ambient RθJA 62 ℃/W Surface mounted on 1 inch² FR-4 board, 2OZ copper (note 1) 1
Thermal Resistance Junction-Case RθJC 1.2 ℃/W Surface mounted on 1 inch² FR-4 board, 2OZ copper (note 1) 1

CAD (KiCad official)

  • Symbol: HSH0139
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: hsh0139-etched.step / hsh0139-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hsh0139.step / hsh0139.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HUASHUO datasheet (6 pp, sha256 5670eb2c9d797433, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF