component
HSCT040W65G34
Public Made by Adomby adom
HXY MOSFET Silicon Carbide Field Effect Transistor (MOSFET), TO-247-4L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHSCT040W65G34
HXY MOSFET · Silicon Carbide Field Effect Transistor (MOSFET) · TO-247-4L
HSCT040W65G34 from HXY MOSFET, in a TO-247-4L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Drain | passive | Drain terminal of the N-channel SiC MOSFET, also connected to the mounting tab of the TO-247-4L package. |
| 2 | Power Source | passive | Power source terminal of the MOSFET, carrying the main drain current return path. |
| 3 | Driver Source | passive | Separate driver source pin provided by the optimized package so that the gate drive return is kept apart from the power source pin. |
| 4 | Gate | input | Gate terminal used to switch the device; the datasheet gives gate-source limits of -5/+20 V (VGS) and -10/+25 V for dynamic absolute maximum values. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | TO-247-4L |
| Category | Silicon Carbide (SiC) Devices |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating junction and storage temperature | Tj, Tstg | -55 | 175 | °C | 1 | ||
| Gate-Source voltage | VGS | -5 | 20 | V | 1 | ||
| Gate-Source voltage (dynamic, absolute maximum values) | VGSmax | -10 | 25 | V | 1 | ||
| Drain-source voltage | VDS | 650 | V | 1 | |||
| Pulsed drain current | ID pulse | 123 | A | TC = 25°C, tp limited by Tjmax | 1 | ||
| Power dissipation | Ptot | 242 | W | TC = 25°C | 1 | ||
| Thermal resistance, junction to case | RthJC | 0.62 | °C/W | 1 | |||
| Thermal resistance, junction to ambient | RthJA | 40 | °C/W | 1 | |||
| Drain-source breakdown voltage | BVDSS | 650 | V | VGS=0V, ID=250uA | 2 |
CAD (KiCad official)
- Symbol:
HSCT040W65G34 - Footprint:
Package_TO_SOT_THT:TO-247-4_Vertical - 3D model: TO-247-4L (KiCad packages3D, STEP)
- 3D model files:
hsct040w65g34-etched.step/hsct040w65g34-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hsct040w65g34.step/hsct040w65g34.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (8 pp, sha256
0021991bd771e888, retrieved 2026-11-04, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).