component
HSCT040W120G34
Public Made by Adomby adom
HXY MOSFET Silicon Carbide Field Effect Transistor (MOSFET), TO-247-4L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHSCT040W120G34
HXY MOSFET · Silicon Carbide Field Effect Transistor (MOSFET) · TO-247-4L
HSCT040W120G34 from HXY MOSFET, in a TO-247-4L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Drain | passive | Drain terminal, also connected to the metal TAB; the device is rated VDS max 1200 V (VGS = 0 V, ID = 100 μA) with continuous ID of 78 A at VGS = 15 V, TC = 25 °C. |
| 2 | Power Source | passive | Power source terminal carrying the main drain current return, kept separate from the driver source pin to reduce gate ringing and switching losses. |
| 3 | Driver Source | passive | Separate driver source pin for the gate drive return, provided as the optimized package feature that minimizes gate ringing. |
| 4 | Gate | input | Gate input with stated limits of -10/+25 V dynamic (AC, f > 1 Hz) and -5/+20 V static (VGSop). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | TO-247-4L |
| Category | Silicon Carbide (SiC) Devices |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain - Source Voltage | VDSmax | 1200 | V | VGS = 0 V, ID = 100 μA | 1 | ||
| Gate - Source Voltage (dynamic) | VGSmax | -10 | 25 | V | AC (f >1 Hz) | 1 | |
| Gate - Source Voltage (static) | VGSop | -5 | 20 | V | Static | 1 | |
| Continuous Drain Current | ID | 78 | A | VGS = 15 V, TC = 25˚C | 1 | ||
| Continuous Drain Current | ID | 57 | A | VGS = 15 V, TC = 100˚C | 1 | ||
| Power Dissipation | PD | 405 | W | TC =25˚C, TJ = 175 ˚C | 1 | ||
| Operating Junction and Storage Temperature | TJ, Tstg | -40 | 175 | ˚C | 1 | ||
| Solder Temperature | TL | 260 | ˚C | 1.6mm (0.063”) from case for 10s | 1 | ||
| Gate Threshold Voltage | VGS(th) | 2 | 2.5 | 4 | V | VDS = VGS, ID = 10 mA | 2 |
| Zero Gate Voltage Drain Current | IDSS | 1 | 50 | μA | VDS = 1200 V, VGS = 0 V | 2 | |
| Gate-Source Leakage Current | IGSS | 10 | 200 | nA | VGS = 20 V, V DS = 0 V | 2 | |
| Gate-Source Leakage Current (negative bias) | IGSS | -200 | -10 | nA | VGS = -10 V, VDS = 0 V | 2 | |
| Drain-Source On-State Resistance | RDS(on) | 40 | 50 | mΩ | VGS = 20 V, ID = 40 A | 2 | |
| Junction to Case Thermal Resistance | RθJC | 0.25 | °C/W | Fig. 21 | 2 | ||
| Junction to Ambient Thermal Resistance | RθJA | 40 | °C/W | 2 |
CAD (KiCad official)
- Symbol:
HSCT040W120G34 - Footprint:
Package_TO_SOT_THT:TO-247-4_Vertical - 3D model: TO-247-4L (KiCad packages3D, STEP)
- 3D model files:
hsct040w120g34-etched.step/hsct040w120g34-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hsct040w120g34.step/hsct040w120g34.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (9 pp, sha256
053444aef4651ea1, retrieved 2026-11-04, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).