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Contents

README

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HSCT040W120G34

HXY MOSFET · Silicon Carbide Field Effect Transistor (MOSFET) · TO-247-4L

HSCT040W120G34 from HXY MOSFET, in a TO-247-4L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Drain passive Drain terminal, also connected to the metal TAB; the device is rated VDS max 1200 V (VGS = 0 V, ID = 100 μA) with continuous ID of 78 A at VGS = 15 V, TC = 25 °C.
2 Power Source passive Power source terminal carrying the main drain current return, kept separate from the driver source pin to reduce gate ringing and switching losses.
3 Driver Source passive Separate driver source pin for the gate drive return, provided as the optimized package feature that minimizes gate ringing.
4 Gate input Gate input with stated limits of -10/+25 V dynamic (AC, f > 1 Hz) and -5/+20 V static (VGSop).

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package TO-247-4L
Category Silicon Carbide (SiC) Devices
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain - Source Voltage VDSmax 1200 V VGS = 0 V, ID = 100 μA 1
Gate - Source Voltage (dynamic) VGSmax -10 25 V AC (f >1 Hz) 1
Gate - Source Voltage (static) VGSop -5 20 V Static 1
Continuous Drain Current ID 78 A VGS = 15 V, TC = 25˚C 1
Continuous Drain Current ID 57 A VGS = 15 V, TC = 100˚C 1
Power Dissipation PD 405 W TC =25˚C, TJ = 175 ˚C 1
Operating Junction and Storage Temperature TJ, Tstg -40 175 ˚C 1
Solder Temperature TL 260 ˚C 1.6mm (0.063”) from case for 10s 1
Gate Threshold Voltage VGS(th) 2 2.5 4 V VDS = VGS, ID = 10 mA 2
Zero Gate Voltage Drain Current IDSS 1 50 μA VDS = 1200 V, VGS = 0 V 2
Gate-Source Leakage Current IGSS 10 200 nA VGS = 20 V, V DS = 0 V 2
Gate-Source Leakage Current (negative bias) IGSS -200 -10 nA VGS = -10 V, VDS = 0 V 2
Drain-Source On-State Resistance RDS(on) 40 50 mΩ VGS = 20 V, ID = 40 A 2
Junction to Case Thermal Resistance RθJC 0.25 °C/W Fig. 21 2
Junction to Ambient Thermal Resistance RθJA 40 °C/W 2

CAD (KiCad official)

  • Symbol: HSCT040W120G34
  • Footprint: Package_TO_SOT_THT:TO-247-4_Vertical
  • 3D model: TO-247-4L (KiCad packages3D, STEP)
  • 3D model files: hsct040w120g34-etched.step / hsct040w120g34-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hsct040w120g34.step / hsct040w120g34.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (9 pp, sha256 053444aef4651ea1, retrieved 2026-11-04, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF