# HS3M

**Yangzhou Yangjie Elec Tech** · Diodes - General Purpose · SMC(DO-214AB)

HS3M from Yangzhou Yangjie Elec Tech, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode terminal, identified by the color band on the package; HS3M is rated for VRRM 1000 V, IO 3.0 A and IFSM 100 A. |
| 2 | A | passive | Anode terminal, the lead opposite the color-banded cathode end; HS3M has VF 1.7 V at IFM=3.0A and IR 5 µA at 25℃. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Yangzhou Yangjie Elec Tech |
| Package | SMC(DO-214AB) |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive Peak Reverse Voltage | VRRM |  |  | 1000 | V | Ta=25℃ | 1 |
| Average Rectified Output Current | IO |  |  | 3 | A | @60Hz sine wave, Resistance load, TL (FIG.1) | 1 |
| Forward Surge Current (Non-repetitive) | IFSM |  |  | 100 | A | @60Hz Half-sine wave, 1 cycle, Ta=25℃ | 1 |
| Storage Temperature | Tstg | -55 |  | 150 | ℃ |  | 1 |
| Junction Temperature | Tj | -55 |  | 150 | ℃ |  | 1 |
| Maximum instantaneous forward voltage drop per diode | VF |  |  | 1.7 | V | IFM=3.0A | 1 |
| Maximum reverse recovery time | TRR |  |  | 75 | ns | IF=0.5A, IR=1.0A, Irr=0.25A | 1 |
| Maximum DC reverse current at rated DC blocking voltage (Ta=25℃) | IR |  |  | 5 | μA | Ta=25℃ | 1 |
| Maximum DC reverse current at rated DC blocking voltage (Ta=125℃) | IR |  |  | 100 | μA | Ta=125℃ | 1 |
| Typical junction capacitance | Cj |  | 30 |  | pF | Measured at 1MHZ and Applied Reverse Voltage of 4.0 V.D.C. | 1 |
| Thermal Resistance Junction to lead | RθJ-L |  |  | 13 | ℃/W | Mounted on P.C.B. with 0.6" x 0.6" (16 mm x 16 mm) copper pad areas | 2 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | ● Terminals: Tin plated leads, solderable per J-STD￾002 and JESD22-B102 ● Polarity:Color band denotes cathode end | 1 |

## CAD (KiCad official)

- Symbol: `HS3M`
- Footprint: `Diode_SMD:D_SMC`
- 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
- 3D model files: `hs3m-etched.step` / `hs3m-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hs3m.step` / `hs3m.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Yangzhou Yangjie Elec Tech datasheet](docs/hs3m-datasheet.pdf) (4 pp, sha256 `6983b9319f64d53c`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hs3m-datasheet.pdf)