# HS3GB

**RUILON(Shenzhen Ruilongyuan Elec)** · High Effic Rectifier · SMB

HS3GB from RUILON(Shenzhen Ruilongyuan Elec), in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode terminal, marked by the cathode line on the package; the HS3GB is rated for VRRM 400 V and 3 A average forward current. |
| 2 | A | passive | Anode terminal at the end opposite the cathode line; peak forward voltage is 1.3 V at IFM = 3.0 A for the GB grade. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | RUILON(Shenzhen Ruilongyuan Elec) |
| Package | SMB |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive Peak Reverse Voltage | VRRM |  |  | 400 | V | GB column | 1 |
| Average Forward Current | IF(AV) |  |  | 3 | A | 60HZ Half-sine wave, Resistance load, TL=110℃ | 1 |
| Surge (Nonrepetitive) Forward Current | IFSM |  |  | 100 | A | 60HZ Half-sine wave, 1 cycle, Ta=25℃ | 1 |
| Storage Temperature | Tstg | -55 |  | 150 | ℃ |  | 1 |
| Junction Temperature | Tj | -55 |  | 150 | ℃ |  | 1 |
| Peak Reverse Current | IRRM1 |  |  | 10 | μA | VRM=VRRM, Ta=25℃ | 1 |
| Peak Reverse Current | IRRM2 |  |  | 200 | μA | VRM=VRRM, Ta=100℃ | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | ● Terminals: Tin plated leads, solderable per J-STD-002 and JESD22-B102 | 1 |

## CAD (KiCad official)

- Symbol: `HS3GB`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB (KiCad packages3D, STEP)
- 3D model files: `hs3gb-etched.step` / `hs3gb-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hs3gb.step` / `hs3gb.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [RUILON(Shenzhen Ruilongyuan Elec) datasheet](docs/hs3gb-datasheet.pdf) (3 pp, sha256 `3022e9b243a3624e`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hs3gb-datasheet.pdf)