component
HS1B
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Yangzhou Yangjie Elec Tech Diodes - General Purpose, SMA(DO-214AC). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownHS1B
Yangzhou Yangjie Elec Tech · Diodes - General Purpose · SMA(DO-214AC)
HS1B from Yangzhou Yangjie Elec Tech, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, the end marked by the cathode line; HS1B blocks up to VRRM = 100 V and passes 1.0 A average rectified current. |
| 2 | A | passive | Anode terminal of the rectifier diode; HS1B has a maximum forward voltage of 1.0 V at IFM = 1.0 A and a peak surge current of 30 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Yangzhou Yangjie Elec Tech |
| Package | SMA(DO-214AC) |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive peak reverse voltage | VRRM | 100 | V | Ta=25℃ | 1 | ||
| Average rectified output current | IO | 1 | A | @60Hz sine wave, Resistance load | 1 | ||
| Surge (non-repetitive) forward current | IFSM | 30 | A | @ 60Hz Half-sine wave, 1 cycle, Ta=25℃ | 1 | ||
| Storage temperature | Tstg | -55 | 150 | ℃ | 1 | ||
| Junction temperature | Tj | -55 | 150 | ℃ | 1 | ||
| Maximum instantaneous forward voltage drop per diode | VF | 1 | V | IFM=1.0A | 1 | ||
| Maximum reverse recovery time | TRR | 50 | ns | IF=0.5A,IR=1.0A,Irr=0.25A | 1 | ||
| Maximum DC reverse current at rated DC blocking voltage | IRRM | 5 | μA | VRM=VRRM, Ta=25℃ | 1 | ||
| Maximum DC reverse current at rated DC blocking voltage | IRRM | 100 | μA | VRM=VRRM, Ta=100℃ | 1 | ||
| Thermal resistance junction to lead | RθJ-L | 23 | ℃/W | P.C.B. with 0.2" x 0.2" (5.0 mm x 5.0 mm) copper pad areas | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | ● Terminals: Tin plated leads, solderable per J-STD-002 and JESD22-B102 | 1 |
CAD (KiCad official)
- Symbol:
HS1B - Footprint:
Diode_SMD:D_SMA - 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files:
hs1b-etched.step/hs1b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hs1b.step/hs1b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Yangzhou Yangjie Elec Tech datasheet (4 pp, sha256
120b597e1cb36189, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).