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Contents

README

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HRCLAMP3321P

HXY MOSFET · ESD And Surge Protection (TVS/ESD) · DFN1006-2L

HRCLAMP3321P from HXY MOSFET, in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive The datasheet's page 1 circuit diagram shows pin 1 on the DFN1006-2L package, and the device protects one bi-directional data or control line across its two terminals, with a working voltage of 3.3V. No individual pin name or polarity is stated.
2 2 passive The datasheet's page 1 circuit diagram shows pin 2 on the DFN1006-2L package, and the device protects one bi-directional data or control line across its two terminals, with a working voltage of 3.3V. No individual pin name or polarity is stated.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package DFN1006-2L
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Pulse Power (tp = 8/20 µs) PPP 100 W tp = 8/20 µs 1
Maximum lead temperature for soldering TL 260 °C during 10 s 1
Storage Temperature Range Tstg -55 150 °C 1
Maximum junction temperature Tj 150 °C 1
Operating Temperature Range Top -55 150 °C 1
ESD contact discharge (IEC 61000-4-2) -8 8 kV IEC61000-4-2 contact discharge 1
ESD air discharge (IEC 61000-4-2) -15 15 kV IEC61000-4-2 air discharge 1
EFT current (IEC 61000-4-4) 40 A 5/50 ns 1
Reverse Leakage Current IR 100 nA VRWM = 3.3 V 2
Reverse Breakdown Voltage VBR 4.2 V IT = 1 mA 2
Clamping Voltage VC 12 25 V IRWM = 4 A, tp = 8/20 µs 2
Junction Capacitance CJ 0.3 0.45 pF VR = 0 V, f = 1 MHz 2
Reverse Working Voltage VRWM 3.3 V 2

CAD (KiCad official)

  • Symbol: HRCLAMP3321P
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2L (KiCad packages3D, STEP)
  • 3D model files: hrclamp3321p-etched.step / hrclamp3321p-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hrclamp3321p.step / hrclamp3321p.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (5 pp, sha256 7d704d26a07d0586, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF