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HQ6025LH5TP
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LITTELFUSE INC Global Sourcing Parts, TO-220AB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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HQ6025LH5TP
LITTELFUSE INC · Global Sourcing Parts · TO-220AB
HQ6025LH5TP from LITTELFUSE INC, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | MT1 | passive | Main terminal 1 of the bidirectional Alternistor triac, part of the 25 A RMS on-state current rating (TC = 95°C) and the 600 V VDRM/VRRM rating for the HQ6025LH5. |
| 2 | MT2 | passive | Main terminal 2 of the bidirectional Alternistor triac, shared with the 25 A RMS on-state current and 600 V VDRM/VRRM ratings; the mounting tab is isolated and is not a separate signal pin. |
| 3 | GATE | input | Gate lead used to trigger the triac, with a maximum IGT of 50 mA and maximum VGT of 1.3 V at VD = 12 V, RL = 60 Ω in quadrants I-III, and a peak gate current IGTM of 2 A and average gate power PG(AV) of 0.5 W at TJ = 150°C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | LITTELFUSE INC |
| Package | TO-220AB |
| Category | Global Sourcing Parts |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| On-state voltage | VTM | 1.4 | V | IT = 35.4A; tp = 380 μs | 2 | ||
| Repetitive peak off-state / reverse blocking current, TJ = 25°C | IDRM / IRRM | 5 | μA | VDRM / VRRM; TJ = 25°C | 2 | ||
| Repetitive peak off-state / reverse blocking current, TJ = 150°C | IDRM / IRRM | 6000 | μA | VDRM / VRRM; TJ = 150°C | 2 | ||
| Gate trigger current | IGT | 50 | mA | VD = 12V RL = 60 Ω; quadrants I, II, III | 2 | ||
| Gate trigger voltage | VGT | 1.3 | V | VD = 12V RL = 60 Ω; quadrants I, II, III | 2 | ||
| Gate non-trigger voltage | VGD | 0.2 | V | VD = VDRM RL = 3.3 kΩ TJ = 150°C; quadrants I, II, III | 2 | ||
| Holding current | IH | 80 | mA | IT = 400mA (initial) | 2 | ||
| Critical rate of rise of off-state voltage | dv/dt | 350 | V/μs | VD = VDRM; gate open; TJ = 150°C | 2 | ||
| Critical rate of rise of off-state voltage at commutation | (dv/dt)c | 20 | V/μs | (di/dt)c = 13.3 A/ms; TJ = 150°C | 2 | ||
| Gate-controlled turn-on time | tgt | 3 | μs | IG = 2 x IGT PW = 15µs IT = 35.4A | 2 | ||
| RMS on-state current | IT(RMS) | 25 | A | HQ6025LH5 TC = 95°C | 2 | ||
| Peak non-repetitive surge current | ITSM | 250 | A | full cycle; f = 50Hz; TJ (initial) = 25°C | 2 | ||
| Peak non-repetitive surge current | ITSM | 300 | A | full cycle; f = 60Hz; TJ (initial) = 25°C | 2 | ||
| I2t value for fusing | I2t | 373 | A2s | tp = 8.3ms | 2 | ||
| Critical rate of rise of on-state current | di/dt | 100 | A/μs | f = 60Hz; TJ = 150°C | 2 | ||
| Peak gate current | IGTM | 2 | A | TJ = 150°C | 2 | ||
| Average gate power dissipation | PG(AV) | 0.5 | W | TJ = 150°C | 2 | ||
| Storage temperature range | Tstg | -40 | 150 | °C | 2 | ||
| Operating junction temperature range | TJ | -40 | 150 | °C | 2 | ||
| Thermal resistance junction to case (AC) | Rθ(J-C) | 2 | °C/W | HQ6025LH5 junction to case (AC) | 2 | ||
| Thermal resistance junction to ambient | Rθ(J-A) | 50 | °C/W | HQ6025LH5 junction to ambient | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper Alloy | Lead Bend MIL-STD-750: Method 2036, Condition E Terminal Material Copper Alloy | 5 |
CAD (KiCad official)
- Symbol:
HQ6025LH5TP - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220AB (KiCad packages3D, STEP)
- 3D model files:
hq6025lh5tp-etched.step/hq6025lh5tp-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hq6025lh5tp.step/hq6025lh5tp.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: LITTELFUSE INC datasheet (8 pp, sha256
7b252d2e5e33e97c, retrieved 2026-10-29, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HQ6025LH5TP
**LITTELFUSE INC** · Global Sourcing Parts · TO-220AB
HQ6025LH5TP from LITTELFUSE INC, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | MT1 | passive | Main terminal 1 of the bidirectional Alternistor triac, part of the 25 A RMS on-state current rating (TC = 95°C) and the 600 V VDRM/VRRM rating for the HQ6025LH5. |
| 2 | MT2 | passive | Main terminal 2 of the bidirectional Alternistor triac, shared with the 25 A RMS on-state current and 600 V VDRM/VRRM ratings; the mounting tab is isolated and is not a separate signal pin. |
| 3 | GATE | input | Gate lead used to trigger the triac, with a maximum IGT of 50 mA and maximum VGT of 1.3 V at VD = 12 V, RL = 60 Ω in quadrants I-III, and a peak gate current IGTM of 2 A and average gate power PG(AV) of 0.5 W at TJ = 150°C. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | LITTELFUSE INC |
| Package | TO-220AB |
| Category | Global Sourcing Parts |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| On-state voltage | VTM | | | 1.4 | V | IT = 35.4A; tp = 380 μs | 2 |
| Repetitive peak off-state / reverse blocking current, TJ = 25°C | IDRM / IRRM | | | 5 | μA | VDRM / VRRM; TJ = 25°C | 2 |
| Repetitive peak off-state / reverse blocking current, TJ = 150°C | IDRM / IRRM | | | 6000 | μA | VDRM / VRRM; TJ = 150°C | 2 |
| Gate trigger current | IGT | | | 50 | mA | VD = 12V RL = 60 Ω; quadrants I, II, III | 2 |
| Gate trigger voltage | VGT | | | 1.3 | V | VD = 12V RL = 60 Ω; quadrants I, II, III | 2 |
| Gate non-trigger voltage | VGD | 0.2 | | | V | VD = VDRM RL = 3.3 kΩ TJ = 150°C; quadrants I, II, III | 2 |
| Holding current | IH | | | 80 | mA | IT = 400mA (initial) | 2 |
| Critical rate of rise of off-state voltage | dv/dt | 350 | | | V/μs | VD = VDRM; gate open; TJ = 150°C | 2 |
| Critical rate of rise of off-state voltage at commutation | (dv/dt)c | 20 | | | V/μs | (di/dt)c = 13.3 A/ms; TJ = 150°C | 2 |
| Gate-controlled turn-on time | tgt | | 3 | | μs | IG = 2 x IGT PW = 15µs IT = 35.4A | 2 |
| RMS on-state current | IT(RMS) | | | 25 | A | HQ6025LH5 TC = 95°C | 2 |
| Peak non-repetitive surge current | ITSM | | | 250 | A | full cycle; f = 50Hz; TJ (initial) = 25°C | 2 |
| Peak non-repetitive surge current | ITSM | | | 300 | A | full cycle; f = 60Hz; TJ (initial) = 25°C | 2 |
| I2t value for fusing | I2t | | | 373 | A2s | tp = 8.3ms | 2 |
| Critical rate of rise of on-state current | di/dt | | | 100 | A/μs | f = 60Hz; TJ = 150°C | 2 |
| Peak gate current | IGTM | | | 2 | A | TJ = 150°C | 2 |
| Average gate power dissipation | PG(AV) | | | 0.5 | W | TJ = 150°C | 2 |
| Storage temperature range | Tstg | -40 | | 150 | °C | | 2 |
| Operating junction temperature range | TJ | -40 | | 150 | °C | | 2 |
| Thermal resistance junction to case (AC) | Rθ(J-C) | | 2 | | °C/W | HQ6025LH5 junction to case (AC) | 2 |
| Thermal resistance junction to ambient | Rθ(J-A) | | 50 | | °C/W | HQ6025LH5 junction to ambient | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper Alloy | | Lead Bend MIL-STD-750: Method 2036, Condition E Terminal Material Copper Alloy | 5 |
## CAD (KiCad official)
- Symbol: `HQ6025LH5TP`
- Footprint: `Package_TO_SOT_THT:TO-220-3_Vertical`
- 3D model: TO-220AB (KiCad packages3D, STEP)
- 3D model files: `hq6025lh5tp-etched.step` / `hq6025lh5tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hq6025lh5tp.step` / `hq6025lh5tp.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [LITTELFUSE INC datasheet](docs/hq6025lh5tp-datasheet.pdf) (8 pp, sha256 `7b252d2e5e33e97c`, retrieved 2026-10-29, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hq6025lh5tp-datasheet.pdf)