# HPTVSUC3D5VB

**HXY MOSFET** · ESD And Surge Protection (TVS/ESD) · SOD-323

HPTVSUC3D5VB from HXY MOSFET, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised bidirectional ESD/TVS diode; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised bidirectional ESD/TVS diode; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Working Voltage | VRWM |  |  | 5 | V |  | 2 |
| Reverse Breakdown Voltage | VBR | 6 |  |  | V | IT = 1mA | 2 |
| Reverse Leakage Current | IR |  |  | 0.1 | μA | VRWM = 5V | 2 |
| Clamping Voltage | VC |  |  | 13 | V | IRWM = 1A, tp = 8/20μs | 2 |
| Clamping Voltage | VC |  |  | 25 | V | IRWM = 4A, tp = 8/20μs | 2 |
| Junction Capacitance | CJ |  | 1 | 1.2 | pF | VR = 0V, f = 1MHz | 2 |
| Maximum lead temperature for soldering | TL |  |  | 260 | °C | during 10s | 1 |
| Storage Temperature Range | Tstg | -55 |  | 155 | °C |  | 1 |
| Operating Temperature Range | Top | -40 |  | 125 | °C |  | 1 |
| Maximum junction temperature | Tj |  |  | 150 | °C |  | 1 |
| ESD air discharge |  | -15 |  | 15 | KV | IEC61000-4-2 | 1 |
| ESD contact discharge |  | -8 |  | 8 | KV | IEC61000-4-2 | 1 |
| EFT |  |  |  | 40 | A | IEC61000-4-4, 5/50 ns | 1 |
| Peak Pulse Power | PPP |  |  | 100 | W | tp = 8/20us | 1 |

## CAD (KiCad official)

- Symbol: `HPTVSUC3D5VB`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `hptvsuc3d5vb-etched.step` / `hptvsuc3d5vb-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hptvsuc3d5vb.step` / `hptvsuc3d5vb.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HXY MOSFET datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603009108799082496) (5 pp, sha256 `d56295b66679ef0c`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hptvsuc3d5vb-datasheet.pdf)