# HPJSD12W-AU_R1_000A1

**HXY MOSFET** · Electrostatic And Surge Protection (TVS/ESD) · SOD-323

HPJSD12W-AU_R1_000A1 from HXY MOSFET, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Pulse Power (tp = 8/20 μs) | PPP |  |  | 240 | W | tp = 8/20 μs | 1 |
| Storage Temperature Range | Tstg | -55 |  | 155 | °C |  | 1 |
| Operating Temperature Range | Top | -40 |  | 125 | °C |  | 1 |
| Maximum junction temperature | Tj |  |  | 150 | °C |  | 1 |
| Maximum lead temperature for soldering | TL |  |  | 260 | °C | during 10s | 1 |
| ESD withstand, IEC61000-4-2 air discharge |  | -30 |  | 30 | kV | IEC61000-4-2 air discharge | 1 |
| ESD withstand, IEC61000-4-2 contact discharge |  | -30 |  | 30 | kV | IEC61000-4-2 contact discharge | 1 |
| EFT withstand, IEC61000-4-4 |  |  |  | 40 | A |  | 1 |
| Reverse Working Voltage | VRWM |  |  | 12 | V |  | 2 |
| Reverse Breakdown Voltage | VBR | 14.1 |  |  | V | IT = 1mA | 2 |
| Reverse Leakage Current | IR |  |  | 0.02 | μA | VRWM = 12V | 2 |
| Clamping Voltage | VC |  |  | 23 | V | IPP = 5A, tp = 8/20μs | 2 |
| Clamping Voltage | VC |  |  | 29 | V | IPP = 9.6A, tp = 8/20μs | 2 |
| Junction Capacitance | CJ |  | 55 |  | pF | VR = 0V, f = 1MHz | 2 |

## CAD (KiCad official)

- Symbol: `HPJSD12W-AU_R1_000A1`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `hpjsd12w-au-r1-000a1-etched.step` / `hpjsd12w-au-r1-000a1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hpjsd12w-au-r1-000a1.step` / `hpjsd12w-au-r1-000a1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HXY MOSFET datasheet](docs/hpjsd12w-au-r1-000a1-datasheet.pdf) (4 pp, sha256 `e1b53fdfff641428`, retrieved 2026-11-05, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hpjsd12w-au-r1-000a1-datasheet.pdf)