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HP6018D4-33

HYPWR · Linear Voltage Regulators (LDO) · DFN-4-EP(1x1)

HP6018D4-33 from HYPWR, in a DFN-4-EP(1x1). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT power_out Regulated output pin, recommended 1μF ceramic output capacitor, 300mA output current capability (350mA absolute maximum).
2 GND power_in Ground pin; the thermal pad is also connected to GND.
3 EN input Enable input, active high (VENH min 1.2V, VENL max 0.4V), must not be left floating.
4 VIN power_in Power input, operating range 2.5V to 6.5V (absolute maximum -0.3 to 8V), recommended 1μF input capacitor.
5 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer HYPWR
Package DFN-4-EP(1x1)
Category Power Management ICs
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage VOUT -2 2 % IOUT=1mA 3
Quiescent Current IQ 1 2 µA VOUT=3.3V, IOUT=0 3
Shut-down Current ISHDN 0.1 1 µA VEN=0V 3
EN Logic High Voltage VENH 1.2 V VIN=5.5V, IOUT=1mA 3
EN Logic Low Voltage VENL 0.4 V VIN=5.5V, VOUT=0V 3
EN Input Current IEN 1 µA VEN= 0 to 5.5V 3
Input Voltage VIN 6.5 V 3
Current Limit ILIMIT 350 mA VIN-VOUT=0.5V 3
Dropout Voltage VDROP 110 mV VOUT=3.3V, IOUT=100mA 3
Dropout Voltage VDROP 230 mV VOUT=3.3V, IOUT=200mA 3
Line Regulation ΔVLINE 0.01 %/V VIN=2.7~5.5V, IOUT=1mA 3
Load Regulation ΔVLOAD 100 mV VOUT=3.3V, IOUT=1~300mA 3
Short Current ISHORT 90 mA VEN=VIN, VOUT Short to GND with 1Ω 3
Supply Voltage VIN 2.5 6.5 V 3
Operating Temperature TOPT -40 85 ℃ 3
Input Voltage VIN -0.3 8 V 2
Output Current IOUT 350 mA 2
Power Dissipation PDMAX 0.6 W DFN1x1_4L 2
Junction Temperature TJ -40 125 ℃ 2
Ambient Temperature TA -40 85 ℃ 2
Storage Temperature TSTG -55 150 ℃ 2
Package Lead Soldering Temperature TSOLDER 260 ℃ 10s 2
Thermal Resistance RθJA 250 ℃/W DFN1x1_4L 2

CAD (KiCad official)

  • Symbol: HP6018D4-33
  • Footprint: Package_DFN_QFN:UDFN-4-1EP_1x1mm_P0.65mm_EP0.48x0.48mm
  • 3D model: DFN-4-EP(1x1) (KiCad packages3D, STEP)
  • 3D model files: hp6018d4-33-etched.step / hp6018d4-33-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hp6018d4-33.step / hp6018d4-33.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HYPWR datasheet (8 pp, sha256 f28c1d3b12d82de7, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF