component
HoXGS2512-2mR-1%
Public Made by Adomby adom
Milliohm Current Sense Resistors / Shunt Resistors, 2512. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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HoXGS2512-2mR-1%
Milliohm · Current Sense Resistors / Shunt Resistors · 2512
HoXGS2512-2mR-1% from Milliohm, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised resistor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised resistor; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Milliohm |
| Package | 2512 |
| Category | Resistors |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Resistance tolerance | -1 | 1 | % | Tolerance letter/code 1% in MPN; spec '精度范围 ±1%' | 3 | ||
| Temperature coefficient of resistance (TCR) | TCR | -50 | 50 | ppm/°C | R1 at room temperature, R2 at 85°C (TCR formula, page 5) | 3 | |
| Resistance change after short-time overload | -0.5 | 0.5 | % | 5x rated power, 5 s, JIS-C-5201 | 5 | ||
| Resistance change after bending strength test | -1 | 1 | % | 2 mm deflection criterion, support time at least 60 s, AEC-Q200-005 | 5 | ||
| Resistance change after solvent resistance | -1 | 1 | % | Immersed in 20~25°C isopropanol 60+5 s, then rested 24 h; AEC-Q200 TEST 12 | 5 | ||
| Resistance change after solder heat resistance | -1 | 1 | % | Immersed in 260±5°C solder bath 10±1 s, rested at least 60 min; AEC-Q200 TEST 15 | 5 | ||
| Resistance change after temperature cycling | -1 | 1 | % | 1000 cycles, -55~155°C, 30 min dwell each temperature, 15°C/min transition; AEC-Q200 TEST 4 | 5 | ||
| Resistance change after high temperature storage | -1 | 1 | % | 155°C, 1000 h, unpowered; AEC-Q200 TEST 3 | 5 | ||
| Resistance change after damp heat | -1 | 1 | % | 1000 h, 85°C, 85% RH, 10% rated power loaded; AEC-Q200 TEST 7 | 5 | ||
| Resistance change after load life | -1 | 1 | % | Rated current, Ta=125°C, 100% power, 0.5 h off/1.5 h on, 1000 h; AEC-Q200 TEST 8 | 5 | ||
| Resistance change after low temperature storage | -1 | 1 | % | -55°C, 1000 h; IEC60115-1 4.23.4 | 5 | ||
| Resistance change after mechanical shock | -1 | 1 | % | X, Y, Z directions, half-sine pulse 0.5 ms, peak 100 g; AEC-Q200 TEST 13 | 5 | ||
| Resistance change after vibration | -1 | 1 | % | 10~2000 Hz sweep within 20 min, 12 cycles in each of 3 perpendicular axes; AEC-Q200 TEST 14 | 5 | ||
| Operating temperature range | -55 | 170 | ℃ | 工作温度范围 as printed in product spec | 3 | ||
| Storage temperature | 5 | 35 | ℃ | Storage, humidity <65%RH, shelf life 1 year | 7 | ||
| Nominal resistance | R | 2 | mR | Resistance value 2mR as printed in MPN | 3 | ||
| Rated power | 3 | W | 额定功率 (rated power) | 3 | |||
| Rated current | 38.72 | A | 额定电流 (rated current) | 3 |
CAD (KiCad official)
- Symbol:
HoXGS2512-2mR-1% - Footprint:
Resistor_SMD:R_2512_6332Metric - 3D model: 2512 (KiCad packages3D, STEP)
- 3D model files:
hoxgs2512-2mr-1-etched.step/hoxgs2512-2mr-1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hoxgs2512-2mr-1.step/hoxgs2512-2mr-1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Milliohm datasheet (7 pp, sha256
9e4547500e217d3d, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HoXGS2512-2mR-1%
**Milliohm** · Current Sense Resistors / Shunt Resistors · 2512
HoXGS2512-2mR-1% from Milliohm, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised resistor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised resistor; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Milliohm |
| Package | 2512 |
| Category | Resistors |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Resistance tolerance | | -1 | | 1 | % | Tolerance letter/code 1% in MPN; spec '精度范围 ±1%' | 3 |
| Temperature coefficient of resistance (TCR) | TCR | -50 | | 50 | ppm/°C | R1 at room temperature, R2 at 85°C (TCR formula, page 5) | 3 |
| Resistance change after short-time overload | | -0.5 | | 0.5 | % | 5x rated power, 5 s, JIS-C-5201 | 5 |
| Resistance change after bending strength test | | -1 | | 1 | % | 2 mm deflection criterion, support time at least 60 s, AEC-Q200-005 | 5 |
| Resistance change after solvent resistance | | -1 | | 1 | % | Immersed in 20~25°C isopropanol 60+5 s, then rested 24 h; AEC-Q200 TEST 12 | 5 |
| Resistance change after solder heat resistance | | -1 | | 1 | % | Immersed in 260±5°C solder bath 10±1 s, rested at least 60 min; AEC-Q200 TEST 15 | 5 |
| Resistance change after temperature cycling | | -1 | | 1 | % | 1000 cycles, -55~155°C, 30 min dwell each temperature, 15°C/min transition; AEC-Q200 TEST 4 | 5 |
| Resistance change after high temperature storage | | -1 | | 1 | % | 155°C, 1000 h, unpowered; AEC-Q200 TEST 3 | 5 |
| Resistance change after damp heat | | -1 | | 1 | % | 1000 h, 85°C, 85% RH, 10% rated power loaded; AEC-Q200 TEST 7 | 5 |
| Resistance change after load life | | -1 | | 1 | % | Rated current, Ta=125°C, 100% power, 0.5 h off/1.5 h on, 1000 h; AEC-Q200 TEST 8 | 5 |
| Resistance change after low temperature storage | | -1 | | 1 | % | -55°C, 1000 h; IEC60115-1 4.23.4 | 5 |
| Resistance change after mechanical shock | | -1 | | 1 | % | X, Y, Z directions, half-sine pulse 0.5 ms, peak 100 g; AEC-Q200 TEST 13 | 5 |
| Resistance change after vibration | | -1 | | 1 | % | 10~2000 Hz sweep within 20 min, 12 cycles in each of 3 perpendicular axes; AEC-Q200 TEST 14 | 5 |
| Operating temperature range | | -55 | | 170 | ℃ | 工作温度范围 as printed in product spec | 3 |
| Storage temperature | | 5 | | 35 | ℃ | Storage, humidity <65%RH, shelf life 1 year | 7 |
| Nominal resistance | R | | 2 | | mR | Resistance value 2mR as printed in MPN | 3 |
| Rated power | | | 3 | | W | 额定功率 (rated power) | 3 |
| Rated current | | | 38.72 | | A | 额定电流 (rated current) | 3 |
## CAD (KiCad official)
- Symbol: `HoXGS2512-2mR-1%`
- Footprint: `Resistor_SMD:R_2512_6332Metric`
- 3D model: 2512 (KiCad packages3D, STEP)
- 3D model files: `hoxgs2512-2mr-1-etched.step` / `hoxgs2512-2mr-1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hoxgs2512-2mr-1.step` / `hoxgs2512-2mr-1.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Milliohm datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757969353323229184) (7 pp, sha256 `9e4547500e217d3d`, retrieved 2026-10-18, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hoxgs2512-2mr-1-datasheet.pdf)