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Ray Publish 0.1.0 9a36932

HoXGS2512-0.5mR-1%

Milliohm · Current Sense Resistors / Shunt Resistors · 2512

HoXGS2512-0.5mR-1% from Milliohm, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised resistor; either orientation.
2 2 passive Terminal 2 of an unpolarised resistor; either orientation.

Key specifications

Parameter Value
Manufacturer Milliohm
Package 2512
Category Resistors
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Resistance (nominal) R 0.5 mR HoXGS2512-0.5mR-1% (选型示例, page 3) 3
Resistance tolerance -1 1 % 精度 ±1% (page 3) 3
Temperature coefficient of resistance (TCR) TCR -50 50 ppm 电阻温度系数 ±50ppm (page 3); measured curve on page 5 not numeric 3
Rated power P 3 W 额定功率 3W; long-term use power should be ≤ rated power (page 7) 3
Rated current I 77.45 A 额定电流 77.45A (选型示例) 3
Operating temperature range Top -55 170 ℃ 工作温度范围 -55℃~170℃ 3
Storage ambient temperature Tstg 5 35 ℃ 产品储存环境温度 (storage, page 7) 7
Storage relative humidity RH 65 %RH 湿度<65%RH, keep as low as possible (storage, page 7) 7
Short-time overload resistance change ΔR -0.5 0.5 % 施加5倍额定功率、时间5秒 (JIS-C-5201) 5
Bending strength resistance change ΔR -1 1 % 2mm判定规格,至少60秒的支撑时间 (AEC-Q200-005) 5
Solvent resistance resistance change ΔR -1 1 % 异丙醇 20~25°C 60+5秒 (AEC-Q200 TEST 12) 5
Resistance to soldering heat resistance change ΔR -1 1 % 260±5℃ 锡炉, 10±1秒 (AEC-Q200 TEST 15) 5
Temperature cycling resistance change ΔR -1 1 % 1000个循环 (-55~155℃), 30min dwell (AEC-Q200 TEST 4) 5
High temperature storage resistance change ΔR -1 1 % 155℃, 1000h, unpowered (AEC-Q200 TEST 3) 5
Damp heat resistance change ΔR -1 1 % 1000h, 85℃, 85%RH, 10% rated power (AEC-Q200 TEST 7) 5
Load life resistance change ΔR -1 1 % Ta=125℃, 100% power, 0.5h off/1.5h on, 1000h (AEC-Q200 TEST 8) 5
Low temperature storage resistance change ΔR -1 1 % -55℃, 1000H (IEC60115-1 4.23.4) 5
Mechanical shock resistance change ΔR -1 1 % 100g's peak, 0.5ms half-sine, X/Y/Z (AEC-Q200 TEST 13) 5
Vibration resistance change ΔR -1 1 % 10~2000Hz, 12 cycles per axis (AEC-Q200 TEST 14) 5

CAD (KiCad official)

  • Symbol: HoXGS2512-0.5mR-1%
  • Footprint: Resistor_SMD:R_2512_6332Metric
  • 3D model: 2512 (KiCad packages3D, STEP)
  • 3D model files: hoxgs2512-0-5mr-1-etched.step / hoxgs2512-0-5mr-1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hoxgs2512-0-5mr-1.step / hoxgs2512-0-5mr-1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Milliohm datasheet (7 pp, sha256 9f1279e4383209ac, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF