# HoLSX2512-6W-0.2mR-1%

**Milliohm** · Current Sense Resistors / Shunt Resistors · 2512

HoLSX2512-6W-0.2mR-1% from Milliohm, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised resistor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised resistor; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Milliohm |
| Package | 2512 |
| Category | Resistors |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Rated power |  |  |  | 6 | W |  | 3 |
| Rated current |  |  |  | 173.2 | A |  | 3 |
| Operating temperature range |  | -55 |  | 170 | ℃ |  | 3 |
| Resistance tolerance |  | -1 |  | 1 | % | 精度范围 ±1% (tolerance letter/code 1% in MPN) | 3 |
| Temperature coefficient of resistance (TCR) |  | -100 |  | 100 | ppm/°C |  | 3 |
| Solder coverage |  | 95 |  |  | % | solder 245±5℃, dwell 3±0.5 s, J-STD-002 | 5 |
| Short-time overload resistance change | △R | -0.5 |  | 0.5 | % | 2.5× rated power, 5 s, JIS-C-5201 | 5 |
| Bending strength resistance change | △R | -1 |  | 1 | % | 2 mm deflection, support time at least 60 s, AEC-Q200-005 | 5 |
| Solvent resistance resistance change | △R | -1 |  | 1 | % | isopropyl alcohol 20~25°C, immersed 60+5 s, AEC-Q200 TEST 12 | 5 |
| Resistance to soldering heat resistance change | △R | -1 |  | 1 | % | 260±5℃ solder bath, 10±1 s, AEC-Q200 TEST 15 | 5 |
| Temperature cycling resistance change | △R | -1 |  | 1 | % | -55~155℃, 1000 cycles, 30 min dwell, 15℃/min transition, AEC-Q200 TEST 4 | 5 |
| High temperature storage resistance change | △R | -1 |  | 1 | % | 155℃, 1000 h, unpowered, AEC-Q200 TEST 3 | 5 |
| Damp heat resistance change | △R | -1 |  | 1 | % | 85℃, 85% RH, 10% rated power loaded, 1000 h, AEC-Q200 TEST 7 | 5 |
| Load life resistance change | △R | -1 |  | 1 | % | rated current, Ta=125℃, 100% power, 0.5 h off / 1.5 h on, 1000 h, AEC-Q200 TEST 8 | 5 |
| Low temperature storage resistance change | △R | -1 |  | 1 | % | -55℃, 1000 h, IEC60115-1 4.23.4 | 5 |
| Mechanical shock resistance change | △R | -1 |  | 1 | % | X, Y, Z axes, half-sine pulse 0.5 ms, peak 100 g, AEC-Q200 TEST 13 | 5 |
| Vibration resistance change | △R | -1 |  | 1 | % | 10~2000 Hz in 20 min, 12 cycles in each of 3 perpendicular directions, AEC-Q200 TEST 14 | 5 |

## CAD (KiCad official)

- Symbol: `HoLSX2512-6W-0.2mR-1%`
- Footprint: `Resistor_SMD:R_2512_6332Metric`
- 3D model: 2512 (KiCad packages3D, STEP)
- 3D model files: `holsx2512-6w-0-2mr-1-etched.step` / `holsx2512-6w-0-2mr-1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `holsx2512-6w-0-2mr-1.step` / `holsx2512-6w-0-2mr-1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Milliohm datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757969843624513536) (7 pp, sha256 `29a16a11f742b6ab`, retrieved 2026-10-31, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/holsx2512-6w-0-2mr-1-datasheet.pdf)