# HoLSX2512-3W-3mR-1%

**Milliohm** · Current Sense Resistors / Shunt Resistors · 2512

HoLSX2512-3W-3mR-1% from Milliohm, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised resistor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised resistor; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Milliohm |
| Package | 2512 |
| Category | Resistors |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Resistance tolerance |  | -1 |  | 1 | % |  | 3 |
| Temperature coefficient of resistance | TCR | -50 |  | 50 | ppm |  | 3 |
| Rated power |  |  |  | 3 | W |  | 3 |
| Rated current |  |  |  | 31.62 | A |  | 3 |
| Nominal resistance | R |  | 3 |  | mR |  | 3 |
| Operating temperature range |  | -55 |  | 170 | ℃ |  | 3 |
| Short-time overload resistance change | ΔR | -0.5 |  | 0.5 | % | 5x rated power, 5 s; JIS-C-5201 | 5 |
| Bending strength resistance change | ΔR | -1 |  | 1 | % | 2 mm deflection, hold at least 60 s; AEC-Q200-005 | 5 |
| Solder coverage |  | 95 |  |  | % | solder 245±5℃, dip 3±0.5 s; J-STD-002 | 5 |
| Solvent resistance resistance change | ΔR | -1 |  | 1 | % | isopropanol 20~25℃, 60+5 s; AEC-Q200 TEST 12 | 5 |
| Resistance to soldering heat resistance change | ΔR | -1 |  | 1 | % | 260±5℃ solder bath, 10±1 s; AEC-Q200 TEST 15 | 5 |
| Temperature cycling resistance change | ΔR | -1 |  | 1 | % | -55~155℃, 1000 cycles, 30 min dwell; AEC-Q200 TEST 4 | 5 |
| High temperature storage resistance change | ΔR | -1 |  | 1 | % | 155℃, 1000 h, unpowered; AEC-Q200 TEST 3 | 5 |
| Moisture resistance resistance change | ΔR | -1 |  | 1 | % | 85℃, 85%RH, 10% rated power, 1000 h; AEC-Q200 TEST 7 | 5 |
| Load life resistance change | ΔR | -1 |  | 1 | % | Ta=125℃, 100% power, 0.5 h off/1.5 h on, 1000 h; AEC-Q200 TEST 8 | 5 |
| Low temperature storage resistance change | ΔR | -1 |  | 1 | % | -55℃, 1000 h; IEC60115-1 4.23.4 | 5 |
| Mechanical shock resistance change | ΔR | -1 |  | 1 | % | 100g peak, 0.5 ms half-sine, X/Y/Z; AEC-Q200 TEST 13 | 5 |
| Vibration resistance change | ΔR | -1 |  | 1 | % | 10~2000 Hz, 20 min, 3 directions x 12 cycles; AEC-Q200 TEST 14 | 5 |
| Storage temperature (unused product) |  | 5 |  | 35 | ℃ | storage, unused product in original packaging | 7 |
| Storage relative humidity (unused product) |  |  |  | 65 | %RH | storage, unused product; keep as low as possible | 7 |

## CAD (KiCad official)

- Symbol: `HoLSX2512-3W-3mR-1%`
- Footprint: `Resistor_SMD:R_2512_6332Metric`
- 3D model: 2512 (KiCad packages3D, STEP)
- 3D model files: `holsx2512-3w-3mr-1-etched.step` / `holsx2512-3w-3mr-1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `holsx2512-3w-3mr-1.step` / `holsx2512-3w-3mr-1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Milliohm datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757969904291061760) (7 pp, sha256 `33e4759ffedf4b73`, retrieved 2026-10-17, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/holsx2512-3w-3mr-1-datasheet.pdf)