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HK32F103RBT6

Public Made by Adom

by adom

HK Microcontrollers (MCU/MPU/SOC), LQFP-64(10x10). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentembedded processors & controllershk32f103rbt6factory-2.0.0extractor-text
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3D Model

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Symbol & Footprint

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Contents

README

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HK32F103RBT6

HK · Microcontrollers (MCU/MPU/SOC) · LQFP-64(10x10)

HK32F103RBT6 from HK, in a LQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBAT power_in Backup-domain supply of 1.8 V to 5.5 V that powers the RTC, the external 32 kHz oscillator and backup registers when VDD is off.
2 PC13 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN13) with alternate functions TAMPERIN and RTCO.
3 PC14 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN14) with alternate function OSC32_IN for the 32.768 kHz LSE oscillator input.
4 PC15 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN15) with alternate function OSC32_OUT for the 32.768 kHz LSE oscillator output.
5 PD0 bidirectional Pin listed with main function OSC_IN for the external HSE oscillator (4 to 16 MHz crystal) and GPIO name PD0.
6 PD1 bidirectional Pin listed with main function OSC_OUT for the external HSE oscillator output and GPIO name PD1.
7 NRST bidirectional External active reset pin, typed I/O in the datasheet; an NRST reset signal exits Standby mode.
8 PC0 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN0) with analog input ADC12_IN10.
9 PC1 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN1) with analog input ADC12_IN11.
10 PC2 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN2) with analog input ADC12_IN12.
11 PC3 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN3) with analog input ADC12_IN13.
12 VSSA power_in Analog ground for the ADC and temperature sensor, shown in the datasheet as double-bonded with VREFN.
13 VDDA power_in Analog supply of 2.0 V to 5.5 V for the ADC and temperature sensor, shown in the datasheet as double-bonded with VREFP.
14 PA0 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN0) with alternate functions ADC12_IN0, TIM2_CH1_ETR, USART2_CTS and WKUP.
15 PA1 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN1) with alternate functions ADC12_IN1, TIM2_CH2 and USART2_RTS.
16 PA2 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN2) with alternate functions ADC12_IN2, TIM2_CH3 and USART2_TX.
17 PA3 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN3) with alternate functions ADC12_IN3, TIM2_CH4 and USART2_RX.
18 VSS_4 power_in Ground pin for the digital I/O and core supply domain.
19 VDD_4 power_in Digital supply of 2.0 V to 5.5 V for the I/O pins and internal LDO.
20 PA4 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN4) with alternate functions ADC12_IN4, SPI_NSS and USART2_CK.
21 PA5 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN5) with alternate functions ADC12_IN5 and SPI_SCK.
22 PA6 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN6) with alternate functions ADC12_IN6, SPI_MISO, TIM3_CH1 and TIM1_BKIN.
23 PA7 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN7) with alternate functions ADC12_IN7, SPI_MOSI, TIM3_CH2 and TIM1_CH1N.
24 PC4 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN4) with analog input ADC12_IN14.
25 PC5 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN5) with analog input ADC12_IN15.
26 PB0 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN0) with alternate functions ADC12_IN8, TIM3_CH3 and TIM1_CH2N.
27 PB1 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN1) with alternate functions ADC12_IN9, TIM3_CH4 and TIM1_CH3N.
28 PB2/BOOT1 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN2) that also carries the BOOT1 boot-mode function.
29 PB10 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN10) with alternate functions I2C2_SCL, USART3_TX and TIM2_CH3.
30 PB11 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN11) with alternate functions I2C2_SDA, USART3_RX and TIM2_CH4.
31 VSS_1 power_in Ground pin for the digital I/O and core supply domain.
32 VDD_1 power_in Digital supply of 2.0 V to 5.5 V for the I/O pins and internal LDO.
33 PB12 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN12) with alternate functions TIM1_BKIN, SPI2_NSS, USART2_CK and I2C2_SMBA.
34 PB13 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN13) with alternate functions TIM1_CH1N, SPI2_SCK and USART2_CTS.
35 PB14 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN14) with alternate functions TIM1_CH2N, SPI2_MISO and USART2_RTS.
36 PB15 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN15) with alternate functions TIM1_CH3N and SPI2_MOSI.
37 PC6 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN6) with alternate function TIM3_CH1.
38 PC7 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN7) with alternate function TIM3_CH2.
39 PC8 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN8) with alternate function TIM3_CH3.
40 PC9 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN9) with alternate function TIM3_CH4.
41 PA8 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN8) with alternate functions TIM1_CH1, USART1_CK and MCO.
42 PA9 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN9) with alternate functions TIM1_CH2 and USART1_TX.
43 PA10 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN10) with alternate functions TIM1_CH3 and USART1_RX.
44 PA11 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN11) with alternate functions TIM1_CH4, USART1_CTS, USBDM and CANRX.
45 PA12 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN12) with alternate functions TIM1_ETR, USART1_RTS, USBDP and CANTX.
46 PA13 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN13) with alternate function JTMS/SWDIO for serial-wire debug data.
47 VSS_2 power_in Ground pin for the digital I/O and core supply domain.
48 VDD_2 power_in Digital supply of 2.0 V to 5.5 V for the I/O pins and internal LDO.
49 PA14 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN14) with alternate function JTCK/SWCLK for serial-wire debug clock.
50 PA15 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN15) with alternate functions JTDI, TIM2_CH1_ETR and SPI1_NSS.
51 PC10 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN10) with alternate function USART3_TX.
52 PC11 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN11) with alternate function USART3_RX.
53 PC12 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN12) with alternate function USART3_CK.
54 PD2 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN2) with alternate function TIM3_ETR.
55 PB3 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN3) with alternate functions JTDO, TRACESWO, TIM2_CH2 and SPI1_SCK.
56 PB4 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN4) with alternate functions NJTRST, TIM3_CH1 and SPI1_MISO.
57 PB5 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN5) with alternate functions I2C1_SMBA, TIM3_CH2 and SPI1_MOSI.
58 PB6 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN6) with alternate functions I2C1_SCL, TIM4_CH1 and USART1_TX.
59 PB7 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN7) with alternate functions I2C1_SDA, TIM4_CH2 and USART1_RX.
60 BOOT0 input Boot-mode selection pin sampled at startup to choose user flash, system memory or internal SRAM boot.
61 PB8 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN8) with alternate functions TIM4_CH3, I2C1_SCL and CANRX.
62 PB9 bidirectional GPIO (up to 20 mA drive, external interrupt EXTIN9) with alternate functions TIM4_CH4, I2C1_SDA and CANTX.
63 VSS_3 power_in Ground pin for the digital I/O and core supply domain.
64 VDD_3 power_in Digital supply of 2.0 V to 5.5 V for the I/O pins and internal LDO.

Key specifications

Parameter Value
Manufacturer HK
Package LQFP-64(10x10)
Category Embedded Processors & Controllers
Pins 64

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
External main supply voltage (VDD and VDDA, relative to VSS) VDD-VSS -0.5 6 V 18
Voltage difference between different supply pins /ΔVDDx/ 50 mV 18
Voltage difference between different ground pins /VSSX −VSS/ 50 mV 18
Total current through VDD/VDDA supply line (supply current) IVDD 150 mA 18
Total current through VSS ground line (outflow current) IVSS 150 mA 18
Output sink current on any I/O and control pin IIO 25 mA 18
Output source current on any I/O and control pin IIO -25 mA 18
Injection current on a pin IINJ(PIN) -5 5 mA 18
Total injection current on all I/O and control pins ΣIINJ(PIN) -25 25 mA 18
Storage temperature range TSTG -45 150 °C 18
Maximum junction temperature TJ 125 °C 18
Internal AHB clock frequency fHCLK 0 96 MHz 19
Internal APB1 clock frequency fPCLK1 0 48 MHz 19
Internal APB2 clock frequency fPCLK2 0 96 MHz 19
Standard operating voltage VDD 2 5.5 V 19
Analog operating voltage VDDA 2 5.5 V 19
Backup section operating voltage VBAT 1.8 5.5 V 19
Operating temperature T -40 105 °C 19
Power-on reset establishment time (reset delay) Tdelay rstn 40 us 19
Reset threshold VThreshold 1.75 V 19
Input high-level voltage VIH 5.5 V VDD>2V 24
Input high-level voltage VIH 5.2 V VDD≤2V 24
Input low-level voltage VIL -0.3 V 24
Input leakage current Ilkg 3 uA VIN =5V 24
Weak pull-up equivalent resistor RPU 30 40 50 KΩ VIN=VSS 24
Weak pull-down equivalent resistor RPD 30 40 50 KΩ VIN=VDD 24
Single byte programming time TPROG 6 7.5 µs 23
Page erase time TERASE 4 5 ms 23
Full chip erase time TERASE 30 40 ms 23
Single byte programming current IDDPROG 5 mA 23
Page/chip erase current IDDERASE 2 mA 23
Read current IDDREAD 2 3 mA 读电流@24MHz 23
Read current IDDREAD 0.25 0.4 mA 读电流@1MHz 23
HSI duty cycle DuCy(HSI) 45 55 % 22
HSI oscillator accuracy after RCC_CR register calibration ACCHSI 1 % RCC_CR 寄存器校准后 22
HSI factory-calibrated oscillator accuracy ACCHSI -2 2.5 % TA= -40 to 105 °C 22
HSI factory-calibrated oscillator accuracy ACCHSI -1.5 2.2 % TA= -40 to 85 °C 22
HSI factory-calibrated oscillator accuracy ACCHSI -1.3 2 % TA = 0 to 70 °C 22
HSI factory-calibrated oscillator accuracy ACCHSI -1.1 1.8 % TA = 25 °C 22
HSI oscillator startup time Tsu(HSI) 1 2 us VSS≤VIN≤VDD 22
HSI oscillator power consumption IDD(HSI) 80 100 uA 22
LSI clock frequency fLSI 30 40 60 kHz 22
LSI oscillator startup time tsu(LSI) 85 us 22
PLL input clock frequency fPLL_IN 1 8 25 MHz 22
PLL input clock duty cycle 40 60 % 22
PLL output clock frequency fPLL_OUT 16 96 MHz 22
PLL lock time tLOCK 200 us 22
PLL cycle jitter Jitter 300 ps 22
External high-speed clock (HSE) frequency fHSE_ext 1 8 25 MHz 21
HSE high/low level time Tw(HSE) 5 ns 21
HSE rise/fall time Tr(HSE)/Tf(HSE) 20 ns 21
HSE duty cycle DuCy(HSE) 45 55 % 21
LSE high/low level time Tw(LSE) 450 ns 21
LSE rise/fall time Tr(LSE)/Tf(LSE) 50 ns 21
LSE duty cycle DuCy(LSE) 30 70 % 21
Temperature sensor output voltage at 25 °C 1.34 1.43 1.52 V 27
Temperature sensor gain 4 4.3 4.6 mV/℃ 27
Temperature sensor output current -40 40 uA 27
Temperature sensor power-up time tSTART 4 10 us 27

CAD (KiCad official)

  • Symbol: HK32F103RBT6
  • Footprint: Package_QFP:LQFP-64_10x10mm_P0.5mm
  • 3D model: LQFP-64(10x10) (KiCad packages3D, STEP)
  • 3D model files: hk32f103rbt6-etched.step / hk32f103rbt6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hk32f103rbt6.step / hk32f103rbt6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HK datasheet (37 pp, sha256 d4f341ea3cc128ae, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF