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HK32F031C4T6

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HK Microcontrollers (MCU/MPU/SOC), LQFP-48(7x7). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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HK32F031C4T6

HK · Microcontrollers (MCU/MPU/SOC) · LQFP-48(7x7)

HK32F031C4T6 from HK, in a LQFP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBAT power_in Backup power supply input (1.8 V to 5.5 V) that powers the RTC, the external 32.768 kHz oscillator and the backup registers when VDD is off.
2 PC13 bidirectional General-purpose I/O (floating input during and after reset) with additional functions RTC_TAMP1, RTC_TS, RTC_OUT and WKUP2.
3 PC14 bidirectional General-purpose I/O (floating input during and after reset) with additional function OSC32_IN for the 32.768 kHz LSE oscillator.
4 PC15 bidirectional General-purpose I/O (floating input during and after reset) with additional function OSC32_OUT for the 32.768 kHz LSE oscillator.
5 PF0 bidirectional General-purpose I/O (floating input during and after reset) with alternate function I2C1_SDA and additional function OSC_IN for the HSE oscillator.
6 PF1 bidirectional General-purpose I/O (floating input during and after reset) with alternate function I2C1_SCL and additional function OSC_OUT for the HSE oscillator.
7 NRST bidirectional Reset input and internal reset output, active low.
8 VSSA power_in Analog ground.
9 VDDA power_in Analog power supply, 2.0 V to 5.5 V, for the ADC and the temperature sensor analog parts.
10 PA0 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions TIM2_CH1, TIM2_ETR, USART1_CTS and ADC_IN0, and additional functions RTC_TAMP2, WKUP1 and CKI_4.
11 PA1 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions TIM2_CH2, EVENTOUT, USART1_RTS and ADC_IN1.
12 PA2 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions TIM2_CH3, USART1_TX and ADC_IN2.
13 PA3 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions TIM2_CH4, USART1_RX and ADC_IN3.
14 PA4 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions SPI1_NSS/I2S1_WS, TIM14_CH1, USART1_CK and ADC_IN4, and additional function CKI_1.
15 PA5 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions SPI1_SCK/I2S1_CK, TIM2_CH1, TIM2_ETR and ADC_IN5.
16 PA6 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions SPI1_MISO/I2S1_MCK, TIM3_CH1, TIM1_BKIN, TIM16_CH1, EVENTOUT and ADC_IN6, and additional function WKUP10.
17 PA7 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions SPI1_MOSI/I2S1_SD, TIM3_CH2, TIM14_CH1, TIM1_CH1N, TIM17_CH1, EVENTOUT, MCO and ADC_IN7, and additional function WKUP11.
18 PB0 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions TIM3_CH3, TIM1_CH2N, EVENTOUT and ADC_IN8.
19 PB1 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions TIM3_CH4, TIM14_CH1, TIM1_CH3N and ADC_IN9.
20 PB2 bidirectional General-purpose I/O (floating input during and after reset) with alternate function I2C1_SMBA.
21 PB10 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions TIM2_CH3 and I2C1_SCL.
22 PB11 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions TIM2_CH4, EVENTOUT and I2C1_SDA.
23 VSS power_in Digital ground.
24 VDD power_in Digital power supply, 2.0 V to 5.5 V standard operating voltage.
25 PB12 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions TIM1_BKIN, EVENTOUT and SPI1_NSS/I2S1_WS.
26 PB13 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions TIM1_CH1N and SPI1_SCK/I2S1_CK.
27 PB14 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions TIM1_CH2N and SPI1_MISO/I2S1_MCK.
28 PB15 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions TIM1_CH3N, SPI1_MOSI/I2S1_SD and RTC_REFIN.
29 PA8 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions USART1_CK, TIM1_CH1, EVENTOUT and MCO.
30 PA9 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions USART1_TX, TIM1_CH2, I2C1_SCL and MCO, and additional function WKUP12.
31 PA10 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions USART1_RX, TIM1_CH3, TIM17_BKIN and I2C1_SDA, and additional function WKUP13.
32 PA11 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions USART1_CTS, TIM1_CH4 and EVENTOUT.
33 PA12 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions USART1_RTS, TIM1_ETR and EVENTOUT.
34 PA13 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions IR_OUT and SWDIO, and additional function CKI_2.
35 PF6 bidirectional General-purpose I/O (floating input during and after reset) with alternate function I2C1_SCL.
36 PF7 bidirectional General-purpose I/O (floating input during and after reset) with alternate function I2C1_SDA.
37 PA14 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions USART1_TX and SWCLK, and additional function CKI_3.
38 PA15 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions SPI1_NSS/I2S1_WS, TIM2_CH1, TIM2_ETR, EVENTOUT and USART1_RX.
39 PB3 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions SPI1_SCK/I2S1_CK, TIM2_CH2 and EVENTOUT.
40 PB4 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions SPI1_MISO/I2S1_MCK, TIM3_CH1, EVENTOUT and TIM17_BKIN.
41 PB5 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions SPI1_MOSI/I2S1_SD, I2C1_SMBA, TIM16_BKIN and TIM3_CH2.
42 PB6 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions I2C1_SCL, USART1_TX and TIM16_CH1N.
43 PB7 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions I2C1_SDA, USART1_RX and TIM17_CH1N.
44 Boot0 input Boot memory selection input, used at startup to select user flash, system memory or internal SRAM boot.
45 PB8 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions I2C1_SCL and TIM16_CH1.
46 PB9 bidirectional General-purpose I/O (floating input during and after reset) with alternate functions I2C1_SDA, IR_OUT, TIM17_CH1 and EVENTOUT.
47 VSS power_in Digital ground.
48 VDD power_in Digital power supply, 2.0 V to 5.5 V standard operating voltage.

Key specifications

Parameter Value
Manufacturer HK
Package LQFP-48(7x7)
Category Embedded Processors & Controllers
Pins 48

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
External main supply voltage (VDD, VDDA) VDD-VSS -0.5 6 V 26
Voltage difference between different supply pins /ΔVDDx/ 50 mV 26
Voltage difference between different ground pins /VSSX −VSS/ 50 mV 26
Total current through VDD/VDDA supply line IVDD 150 mA 26
Total current through VSS ground line IVSS 150 mA 26
Output sink current on any I/O and control pin IIO 25 mA 26
Output source current on any I/O and control pin IIO -25 mA 26
Injected current on a pin IINJ(PIN) -5 5 mA 26
Total injected current on all I/O and control pins ΣIINJ(PIN) -25 25 mA 26
Storage temperature range TSTG -45 150 °C 26
Maximum junction temperature TJ 125 °C 26
Internal AHB clock frequency fHCLK 0 72 MHz 27
Internal APB1 clock frequency fPCLK1 0 72 MHz 27
Internal APB2 clock frequency fPCLK2 0 72 MHz 27
Standard operating voltage VDD 2 5.5 V 27
Analog operating voltage VDDA 2 5.5 V 27
Backup domain operating voltage VBAT 1.8 5.5 V 27
Operating temperature T -40 105 °C 27
Reset temporization (rstn setup time) Tdelay rstn 40 us 28
External HSE clock frequency fHSE_ext 1 8 25 MHz 28
HSE input high/low level time Tw(HSE) 5 ns 28
HSE rise/fall time Tr(HSE)/Tf(HSE) 20 ns 28
HSE input capacitance Cin(HSE) 5 pF 28
HSE duty cycle DuCy(HSE) 45 55 % 28
LSE input high/low level time Tw(LSE) 450 ns 29
LSE rise/fall time Tr/Tf(LSE) 50 ns 29
LSE duty cycle DuCy(LSE) 30 70 % 29
HSI duty cycle DuCy(HSI) 45 55 % 29
HSI oscillator accuracy after RCC_CR calibration ACCHSI -1 1 % RCC_CR register calibrated 29
HSI oscillator accuracy, factory calibrated ACCHSI -2 2.5 % TA= -40 to 105 °C 29
HSI oscillator accuracy, factory calibrated ACCHSI -1.5 2.2 % TA= -40 to 85 °C 29
HSI oscillator accuracy, factory calibrated ACCHSI -1.3 2 % TA = 0 to 70 °C 29
HSI oscillator accuracy, factory calibrated ACCHSI -1.1 1.8 % TA = 25 °C 29
HSI oscillator startup time Tsu(HSI) 1 2 us VSS≤VIN≤VDD 29
HSI oscillator power consumption IDD(HSI) 80 100 uA 29
LSI clock frequency fLSI 30 40 60 kHz 29
LSI oscillator startup time tsu(LSI) 85 us 29
PLL input clock frequency fPLL_IN 1 8 25 MHz 29
PLL input clock duty cycle 40 60 % 29
PLL output clock frequency fPLL_OUT 16 72 MHz 29
PLL lock time tLOCK 200 us 29
PLL cycle jitter Jitter 300 ps 29
Single byte program time TPROG 6 7.5 us 30
Page erase time TERASE 4 5 ms 页擦除时间 30
Full chip erase time TERASE 30 40 ms 整片擦除时间 30
Single byte write current IDDPROG 5 mA 30
Page/chip erase current IDDERASE 2 mA 30
Read current IDDREAD 2 3 mA 读电流@24MHz 30
Read current IDDREAD 0.25 0.4 mA 读电流@1MHz 30
I/O input leakage current Ilkg 3 uA VIN =5V 30
Weak pull-up equivalent resistor RPU 30 40 50 KΩ VIN=VSS 30
Weak pull-down equivalent resistor RPD 30 40 50 KΩ VIN=VDD 30
Temperature sensor output voltage at 25 °C 1.34 1.43 1.52 V 32
Temperature sensor gain 4 4.3 4.6 mV/℃ 32
Temperature sensor output load capacitor 20 pF 32
Temperature sensor output current -40 40 uA 32
Temperature sensor power-up time tSTART 4 10 us 32
Temperature sensor analog supply voltage 2.2 3.3 5 V 32
Temperature sensor power-down leakage current 1 uA en='0' 32

CAD (KiCad official)

  • Symbol: HK32F031C4T6
  • Footprint: Package_QFP:LQFP-48_7x7mm_P0.5mm
  • 3D model: LQFP-48(7x7) (KiCad packages3D, STEP)
  • 3D model files: hk32f031c4t6-etched.step / hk32f031c4t6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hk32f031c4t6.step / hk32f031c4t6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HK datasheet (55 pp, sha256 e942f8805062c89a, retrieved 2026-10-21, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF