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HIN232EIBNZ

RENESAS · Pre-ordered Chips · SOIC-16

HIN232EIBNZ from RENESAS, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 C1+ passive External charge-pump capacitor C1 positive terminal connects here (0.1µF or 1µF).
2 V+ power_out Internally generated positive supply (+10V nominal) from the voltage doubler, with a reservoir capacitor to ground.
3 C1- passive External charge-pump capacitor C1 negative terminal connects here.
4 C2+ passive External charge-pump capacitor C2 positive terminal connects here.
5 C2- passive External charge-pump capacitor C2 negative terminal connects here.
6 V- power_out Internally generated negative supply (-10V nominal) from the voltage inverter, with a reservoir capacitor to ground.
7 T2OUT output Transmitter 2 output at RS-232 levels (nominally ±10V), short-circuit protected.
8 R2IN input Receiver 2 input accepting RS-232 levels up to ±30V, with an internal 5k pull-down to GND.
9 R2OUT output Receiver 2 output at TTL/CMOS levels.
10 T2IN input Transmitter 2 input accepting TTL/CMOS levels, with an internal 400k pull-up to VCC.
11 T1IN input Transmitter 1 input accepting TTL/CMOS levels, with an internal 400k pull-up to VCC.
12 R1OUT output Receiver 1 output at TTL/CMOS levels.
13 R1IN input Receiver 1 input accepting RS-232 levels up to ±30V, with an internal 5k pull-down to GND.
14 T1OUT output Transmitter 1 output at RS-232 levels (nominally ±10V), short-circuit protected.
15 GND power_in Ground lead, connect to 0V.
16 VCC power_in Power supply input, 5V ±10%.

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOIC-16
Category Interface ICs
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power Supply Current (HIN232) ICC 5 10 mA No Load, TA = +25°C 9
Input Logic Low VIL 0.8 V TIN 9
Input Logic High VIH 2 V TIN 9
Transmitter Input Pull-up Current IP 15 200 µA TIN = 0V 9
Receiver Output Voltage Low VOL 0.1 0.4 V IOUT = 1.6mA 9
Receiver Output Voltage High VOH 3.5 4.6 V IOUT = -1.0mA 9
RS-232 Input Voltage Range VIN -30 30 V 9
Receiver Input Impedance RIN 3 5 7 kΩ VIN = ±3V 9
Receiver Input Low Threshold VIN (H-L) 0.8 1.2 V VCC = 5V, TA = +25°C 9
Receiver Input High Threshold VIN (L-H) 1.7 2.4 V VCC = 5V, TA = +25°C 9
Receiver Input Hysteresis VHYST 0.2 0.5 1 V 9
Baud Rate (1 Transmitter Switching) 120 kbps RL = 3k 10
Instantaneous Slew Rate SR 30 V/µs CL = 10pF, RL = 3k, TA = +25°C (Note 4) 10
Output Voltage Swing TOUT -5 -9 -10 V Transmitter Outputs, 3k to Ground; printed as ±5 / ±9 / ±10 10
Output Resistance TOUT 300 Ω VCC = V+ = V- = 0V, VOUT = 2V 10
Propagation Delay tPD 0.5 µs RS-232 to TTL 10
Transition Region Slew Rate SRT 3 V/µs RL = 3k, CL = 2500pF Measured from +3V to -3V or -3V to +3V, 1 Transmitter Switching 10
RS-232 Output Short Circuit Current ISC 10 mA TOUT shorted to GND; printed as ±10 10
Operating Temperature Range (HIN2xxIx) -40 85 °C 9
VCC to Ground VCC -0.3 6 V (GND -0.3V) < VCC < 6V 9
V- to Ground V- -12 0.3 V -12V < V- < (GND +0.3V) 9
V+ to V- 24 V 9
Receiver Input Voltage RIN 30 V 9
Maximum Junction Temperature (Plastic Package) 150 °C 9
Storage Temperature Range -65 150 °C 9
Thermal Resistance, 16 Ld SOIC θ 100 °C/W Typical, Note 3 9
Shutdown Supply Current ICC(SD) 1 10 µA TA = +25°C; applies to shutdown-capable parts, not HIN232 9

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin C2- External capacitor (- terminal) is connected to this lead. TIN Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kpull-up resistor to VCC is connected to each lead. 2

CAD (KiCad official)

  • Symbol: HIN232EIBNZ
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: hin232eibnz-etched.step / hin232eibnz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hin232eibnz.step / hin232eibnz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (22 pp, sha256 d4773763df765fad, retrieved 2026-10-31, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF