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Contents

README

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HIN232ACBNZ-T

RENESAS · RS232 ICs · SOIC-16

HIN232ACBNZ-T from RENESAS, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 C1+ passive Positive terminal of charge-pump capacitor C1, which is part of the voltage doubler; the typical application uses 0.1F.
2 V+ power_out Internally generated positive supply, nominally +10V, produced by the voltage doubler.
3 C1- passive Negative terminal of charge-pump capacitor C1.
4 C2+ passive Positive terminal of charge-pump capacitor C2, which is part of the voltage inverter.
5 C2- passive Negative terminal of charge-pump capacitor C2.
6 V- power_out Internally generated negative supply, nominally -10V, produced by the voltage inverter.
7 T2OUT output RS-232 transmitter 2 output with a nominal 10V swing, current-limited and shorted-to-ground protected.
8 R2IN input RS-232 receiver 2 input that accepts up to 30V and presents a 3k to 7k input impedance, with an internal 5k pull-down to GND.
9 R2OUT output TTL/CMOS receiver 2 output that swings between 0V and VCC.
10 T2IN input TTL/CMOS transmitter 2 input with an internal 400k pull-up resistor to VCC.
11 T1IN input TTL/CMOS transmitter 1 input with an internal 400k pull-up resistor to VCC.
12 R1OUT output TTL/CMOS receiver 1 output that swings between 0V and VCC.
13 R1IN input RS-232 receiver 1 input that accepts up to 30V and presents a 3k to 7k input impedance, with an internal 5k pull-down to GND.
14 T1OUT output RS-232 transmitter 1 output with a nominal 10V swing, current-limited and shorted-to-ground protected.
15 GND power_in Ground lead, connect to 0V.
16 VCC power_in Power supply input, 5V ±10%.

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOIC-16
Category Communication Interface Chip/UART/485/232
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 4.5 5 5.5 V VCC = +5V 10% 3
Power Supply Current ICC 5 10 mA No Load, TA = 25oC 3
Input Logic Low VIL 0.8 V TIN 3
Input Logic High VIH 2 V TIN 3
Transmitter Input Pullup Current IP 15 200 µA TIN = 0V 3
TTL/CMOS Receiver Output Voltage Low VOL 0.1 0.4 V IOUT = 3.2mA 3
TTL/CMOS Receiver Output Voltage High VOH 3.5 4.6 V IOUT = -1mA 3
RS-232 Input Voltage Range VIN -30 30 V 3
Receiver Input Impedance RIN 3 5 7 kΩ VIN = 3V, TA = 25oC 3
Receiver Input Low Threshold VIN (H-L) 1.2 V VCC = 5V, TA = 25oC 3
Receiver Input High Threshold VIN (L-H) 1.7 2.4 V VCC = 5V, TA = 25oC 3
Receiver Input Hysteresis VHYST 0.2 0.5 1 V VCC = 5V 3
Transmitter, Receiver Propagation Delay tPD 0.5 10 µs 3
Transition Region Slew Rate SRT 3 20 45 V/µs RL = 3k, CL = 1000pF, +3V to -3V or -3V to +3V, 1 Transmitter Switching (Note 2) 3
Output Voltage Swing TOUT 5 9 10 V Transmitter Outputs, 3k to Ground 3
Output Resistance TOUT 300 Ω VCC = V+ = V- = 0V, VOUT = 2V 3
RS-232 Output Short Circuit Current ISC 10 mA TOUT Shorted to GND 3
VCC to Ground VCC -0.3 6 V (GND -0.3V) < VCC < 6V 3
V+ to Ground V+ 12 V (VCC -0.3V) < V+ < 12V 3
V- to Ground V- -12 0.3 V -12V < V- < (GND +0.3V) 3
RIN Input Voltage RIN 30 V RIN 30V 3
Maximum Junction Temperature (Plastic Package) 150 oC 3
Maximum Storage Temperature Range -65 150 oC 3
Maximum Lead Temperature (Soldering) 300 oC 10s, SOIC lead tips only 3
Operating Temperature Range 0 70 oC HIN232ACX 3
Thermal Resistance, Junction to Ambient JA 105 oC/W 16 Ld SOIC (N) Package, Note 1 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin C2- External capacitor (- terminal) is connected to this lead. TIN Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400k pull-up resistor to VCC is connected to each lead. 2

CAD (KiCad official)

  • Symbol: HIN232ACBNZ-T
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: hin232acbnz-t-etched.step / hin232acbnz-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hin232acbnz-t.step / hin232acbnz-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (10 pp, sha256 bcd020e86406c3a9, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF