main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 19h ago
viewers himz120r030m1hxksa1: symbol repaired (body fitted to the names) · Ray 9h ago
himz120r030m1hxksa1-etched.glb Publish 0.1.0 · Ray 19h ago
himz120r030m1hxksa1-etched.step himz120r030m1hxksa1: factory component page (tier=lcsc) · Ray 19h ago
himz120r030m1hxksa1-hero.glb himz120r030m1hxksa1: hero GLB from the etched model (keeps the MPN mark) · Ray 19h ago
himz120r030m1hxksa1-hero.overlay.json Publish 0.1.0 · Ray 19h ago
himz120r030m1hxksa1.glb Publish 0.1.0 · Ray 19h ago
himz120r030m1hxksa1.kicad_mod Publish 0.1.0 · Ray 19h ago
himz120r030m1hxksa1.kicad_sym himz120r030m1hxksa1: symbol repaired (body fitted to the names) · Ray 9h ago
himz120r030m1hxksa1.lbr himz120r030m1hxksa1: symbol repaired (body fitted to the names) · Ray 9h ago
himz120r030m1hxksa1.step Publish 0.1.0 · Ray 19h ago
package.json Publish 0.1.0 · Ray 19h ago
page.json Set visibility: public · Ray 19h ago
README.md Publish 0.1.0 · Ray 19h ago
verification.json Verified: Published by the parts factory: tier lcsc, 4 pins · Ray 19h ago

HIMZ120R030M1HXKSA1

HXY MOSFET · Silicon Carbide Field Effect Transistor (MOSFET) · TO-247-4L

HIMZ120R030M1HXKSA1 from HXY MOSFET, in a TO-247-4L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Drain passive Drain terminal, electrically connected to the TAB, with a maximum drain-source voltage of 1200 V at VGS = 0 V and ID = 100 μA.
2 Power Source passive Power source terminal for the main drain current path, kept separate from the driver source pin in this package.
3 Driver Source passive Separate source terminal provided in the optimized package so the gate driver return is not shared with the power source pin.
4 Gate input Gate input with static limits of -4 V/+15 V (safe operation also at 0/+15 V) and dynamic limits of -8 V/+19 V AC (f > 1 Hz), where VGSmax is -4 V/+19 V when the body diode is used.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package TO-247-4L
Category Silicon Carbide (SiC) Devices
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain - Source Voltage VDSmax 1200 V VGS = 0 V, ID = 100 μA 1
Gate - Source Voltage (dynamic) VGSmax -8 19 V AC (f >1 Hz) Note 1 1
Gate - Source Voltage (static) VGSop -4 15 V Static Note 2 1
Continuous Drain Current ID 63 A VGS = 15 V, TC = 25˚C 1
Continuous Drain Current ID 48 A VGS = 15 V, TC = 100˚C 1
Pulsed Drain Current ID(pulse) 120 A Pulse width tP limited by Tjmax 1
Power Dissipation PD 283 W TC=25˚C, TJ = 175 ˚C 1
Operating Junction and Storage Temperature TJ, Tstg -40 175 ˚C 1
Solder Temperature TL 260 ˚C 1.6mm (0.063”) from case for 10s 1
Drain-Source Breakdown Voltage V(BR)DSS 1200 V VGS = 0 V, ID = 100 μA 2
Gate Threshold Voltage VGS(th) 1.8 2.5 3.6 V VDS = VGS, ID = 11.5 mA 2
Gate Threshold Voltage VGS(th) 2 V VDS = VGS, ID = 11.5 mA, TJ = 175ºC 2
Zero Gate Voltage Drain Current IDSS 1 50 μA VDS = 1200 V, VGS = 0 V 2
Gate-Source Leakage Current IGSS 10 250 nA VGS = 15 V, VDS = 0 V 2
Drain-Source On-State Resistance RDS(on) 23 32 43 mΩ VGS = 15 V, ID = 40 A 2
Drain-Source On-State Resistance RDS(on) 57.6 mΩ VGS = 15 V, ID = 40 A, TJ = 175ºC 2
Continuous Diode Forward Current IS 62 A VGS = -4 V, TC = 25˚C 2
Diode pulse Current IS, pulse 120 A VGS = -4 V, pulse width tP limited by Tjmax 2
Transconductance gfs 27 S VDS= 20 V, IDS= 40 A 2
Transconductance gfs 22 S VDS= 20 V, IDS= 40 A, TJ = 175ºC 2
Input Capacitance Ciss 3357 pF VGS = 0 V, VDS = 1000 V, f = 100 kHz, VAC = 25 mV 2
Output Capacitance Coss 129 pF VGS = 0 V, VDS = 1000 V, f = 100 kHz, VAC = 25 mV 2
Reverse Transfer Capacitance Crss 8 pF VGS = 0 V, VDS = 1000 V, f = 100 kHz, VAC = 25 mV 2
Coss Stored Energy Eoss 76 μJ Fig. 16 2
Turn-On Switching Energy (SiC Diode FWD) EON 367 μJ VDS = 800 V, VGS = -4 V/+15 V, ID = 40 A, RG(ext) = 2.5Ω, L= 65.7 μH, Tj = 175ºC Fig. 26 2
Turn Off Switching Energy (SiC Diode FWD) EOFF 123 μJ VDS = 800 V, VGS = -4 V/+15 V, ID = 40 A, RG(ext) = 2.5Ω, L= 65.7 μH, Tj = 175ºC Fig. 26 2
Turn-On Switching Energy (Body Diode FWD) EON 955 μJ VDS = 800 V, VGS = -4 V/+15 V, ID = 40 A, RG(ext) = 2.5Ω, L= 65.7 μH, Tj = 175ºC Fig. 26 2
Turn Off Switching Energy (Body Diode FWD) EOFF 107 μJ VDS = 800 V, VGS = -4 V/+15 V, ID = 40 A, RG(ext) = 2.5Ω, L= 65.7 μH, Tj = 175ºC Fig. 26 2
Turn-On Delay Time td(on) 25 ns VDD = 800 V, VGS = -4 V/15 V, RG(ext) = 2.5 Ω, ID = 40 A, L= 65.7, Timing relative to VDS, Inductive load Fig. 27 2
Rise Time tr 18 ns VDD = 800 V, VGS = -4 V/15 V, RG(ext) = 2.5 Ω, ID = 40 A, L= 65.7, Timing relative to VDS, Inductive load Fig. 27 2
Turn-Off Delay Time td(off) 32 ns VDD = 800 V, VGS = -4 V/15 V, RG(ext) = 2.5 Ω, ID = 40 A, L= 65.7, Timing relative to VDS, Inductive load Fig. 27 2
Fall Time tf 9 ns VDD = 800 V, VGS = -4 V/15 V, RG(ext) = 2.5 Ω, ID = 40 A, L= 65.7, Timing relative to VDS, Inductive load Fig. 27 2
Internal Gate Resistance RG(int) 1.7 Ω f = 1 MHz, VAC = 25 mV 2
Gate to Source Charge Qgs 40 nC VDS = 800 V, VGS = -4 V/15 V, ID = 40 A 2
Gate to Drain Charge Qgd 34 nC VDS = 800 V, VGS = -4 V/15 V, ID = 40 A 2
Total Gate Charge Qg 118 nC VDS = 800 V, VGS = -4 V/15 V, ID = 40 A 2
Diode Forward Voltage VSD 4.6 V VGS = -4 V, ISD = 20 A, TJ = 25 °C 2
Diode Forward Voltage VSD 4.2 V VGS = -4 V, ISD = 20 A, TJ = 175 °C 2
Reverse Recover time trr 27 ns VGS = -4 V, ISD = 40 A, VR = 800 V, dif/dt = 2250 A/µs, TJ = 175 °C 2
Reverse Recovery Charge Qrr 478 nC VGS = -4 V, ISD = 40 A, VR = 800 V, dif/dt = 2250 A/µs, TJ = 175 °C 2
Peak Reverse Recovery Current Irrm 27 A VGS = -4 V, ISD = 40 A, VR = 800 V, dif/dt = 2250 A/µs, TJ = 175 °C 2
Thermal Resistance from Junction to Case RθJC 0.45 °C/W Fig. 21 2
Thermal Resistance From Junction to Ambient RθJA 40 °C/W 2

CAD (KiCad official)

  • Symbol: HIMZ120R030M1HXKSA1
  • Footprint: Package_TO_SOT_THT:TO-247-4_Vertical
  • 3D model: TO-247-4L (KiCad packages3D, STEP)
  • 3D model files: himz120r030m1hxksa1-etched.step / himz120r030m1hxksa1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); himz120r030m1hxksa1.step / himz120r030m1hxksa1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (11 pp, sha256 d5de460440cbe893, retrieved 2026-11-04, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF