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Ray Publish 0.1.0 6935c4c 17d ago

Hi1246

Hichips · LED Drivers · SOT-23-6

Hi1246 from Hichips, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Chip supply input with an internal high-voltage LDO, operating from 3.0 V to 40 V (absolute maximum -0.3 to 40 V); a series R0 (1 kΩ above 12 V) and a 20-30 V zener are recommended for surge and over-voltage protection above 36 V.
2 TEST unconnected Test pin that must be left floating (not connected) in the application.
3 CS input Output current sense pin; the LED current is set by the external CS resistor as I_OUT = 0.143 V / R_CS, with a CS pin voltage rating of -0.3 to 6.0 V.
4 D output Drain of the internal MOSFET that sinks the constant LED current, rated for a drain voltage of -0.3 to 60 V for the Hi1246 variant.
5 DIM input PWM dimming input with an internal 100 µA pull-up (default high when floating), supporting 1000:1 dimming at 20 kHz and above, with a PWM input voltage rating of -0.3 to 6.0 V; the chip enters sleep mode if PWM is held low for more than 120 ms.
6 GND power_in Chip ground reference pin.

Key specifications

Parameter Value
Manufacturer Hichips
Package SOT-23-6
Category Nixie Tube Driver/LED Driver
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VIN supply voltage range VIN 3 40 V 4
Output current IOUT 300 mA 4
VIN supply voltage (absolute maximum) VIN -0.3 40 V 3
Constant-current output port withstand voltage (Hi1246) VD -0.3 60 V 3
PWM input voltage VDim -0.3 6 V 3
CS port withstand voltage VCS -0.3 6 V 3
Maximum allowable power dissipation PD 0.35 W see note 2: limited by TJMAX, RθJA and TA 3
Storage temperature TSTG -40 150 ℃ 3
Operating junction temperature TJ -40 125 ℃ 3
ESD HBM rating VESD 2 KV HBM; datasheet prints '>2 KV' 3
Junction-to-ambient thermal resistance RθJA 210 ℃/W 3

CAD (KiCad official)

  • Symbol: Hi1246
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: hi1246-etched.step / hi1246-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hi1246.step / hi1246.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Hichips datasheet (8 pp, sha256 27aca28cedfa19ec, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF