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HGX485EIMM
Public Made by Adomby adom
HGSEMI RS-485/RS-422 ICs, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHGX485EIMM
HGSEMI · RS-485/RS-422 ICs · MSOP-8
HGX485EIMM from HGSEMI, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver output: when RE is low, RO is high if (A-B) is at least +200mV and low if (A-B) is at most -200mV; high-impedance when RE is high. |
| 2 | RE | input | Active-low receiver output enable (hot-swap input): RO is active when RE is low and high-impedance when RE is high; RE high with DE low enters low-power shutdown. |
| 3 | DE | input | Driver output enable (hot-swap input): driver outputs are active when DE is high and high-impedance when DE is low; DE low with RE high enters low-power shutdown. |
| 4 | DI | input | Driver input: with DE high, a low on DI drives A low and B high, and a high on DI drives A high and B low. |
| 5 | GND | power_in | Ground. |
| 6 | A | bidirectional | Non-inverting receiver input and non-inverting driver output; ESD protected to ±16kV (IEC 61000-4-2 air-gap), bus voltage range -7V to +12V. |
| 7 | B | bidirectional | Inverting receiver input and inverting driver output; ESD protected to ±16kV (IEC 61000-4-2 air-gap), bus voltage range -7V to +12V. |
| 8 | VCC | power_in | Positive supply, 4.5V ≤ VCC ≤ 5.5V, bypass to ground with a 0.1µF capacitor. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | MSOP-8 |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 4.5 | 5.5 | V | 4 | ||
| Differential driver output | VOD | 2.7 | V | Fig 1, RL=100Ω (RS-422) | 4 | ||
| Differential driver output | VOD | 2.1 | V | Fig 1, RL=54Ω (RS-485) | 4 | ||
| Change in magnitude of VOD | ΔVOD | 0.2 | V | Fig 1, RL=100Ω or RL=54Ω | 4 | ||
| Driver common-mode output voltage | VOC | 3 | V | Fig 1, RL=100Ω or RL=54Ω | 4 | ||
| Change in magnitude of VOC | ΔVOC | 0.2 | V | Fig 1, RL=100Ω or RL=54Ω | 4 | ||
| Input high voltage | VIH | 2 | V | DE, DI, RE | 4 | ||
| Input low voltage | VIL | 0.8 | V | DE, DI, RE | 4 | ||
| Input hysteresis | VHYS | 100 | mV | DE, DI, RE | 4 | ||
| Input current | IIN | -1 | 1 | μA | DE, DI, RE | 4 | |
| Driver short-circuit output current | IOSD | 250 | mA | 0≦VOUT≦12V | 4 | ||
| Driver short-circuit output current | IOSD | -250 | mA | -7≦VOUT≦Vcc | 4 | ||
| Driver short-circuit foldback output current | IOSDF | 20 | mA | Vcc-1V≦VOUT≦Vcc+0.5V | 4 | ||
| Driver short-circuit foldback output current | IOSDF | -20 | mA | -0.5V≦VOUT≦+1V | 4 | ||
| Thermal shutdown temperature | TTS | 165 | ℃ | 4 | |||
| Thermal shutdown hysteresis | TTSH | 15 | ℃ | 4 | |||
| Receiver differential threshold voltage | VTH | -200 | 200 | mV | -7V≦VCM≦12V | 4 | |
| Receiver input hysteresis | ΔVTH | 15 | mV | VA+VB=0 | 4 | ||
| Receiver output low voltage | VOL | 0.4 | V | IO=4mA, VID=-200mV | 4 | ||
| Receiver three-state output current | IOZR | -1 | 1 | μA | 0≦VO≦VCC | 4 | |
| Receiver input resistance | RIN | 96 | kΩ | -7V≦VCM≦12V | 4 | ||
| Receiver output short-circuit current | IOSR | 7 | 95 | mA | 0V≦VRO≦VCC | 4 | |
| Supply current | ICC | 530 | 900 | μA | No load, RE=VCC, DI=GND or VCC, DE=VCC | 5 | |
| Supply current | ICC | 475 | 600 | μA | No load, RE=VCC, DI=GND or VCC, DE=GND | 5 | |
| Supply current | ICC | 530 | 1000 | μA | No load, RE=GND, DI=GND or VCC, DE=VCC | 5 | |
| Supply current | ICC | 475 | 800 | μA | No load, RE=GND, DI=GND or VCC, DE=GND | 5 | |
| Supply current in shutdown mode | ISHDN | 0.05 | 10 | μA | DE=GND, RE=VCC | 5 | |
| ESD protection A, B, IEC61000-4-2 air-gap | 16 | kV | IEC61000-4-2 air-gap model (printed ±16) | 5 | |||
| ESD protection A, B, IEC61000-4-2 contact | 8 | kV | IEC61000-4-2 contact model (printed ±8) | 5 | |||
| ESD protection HBM, all pins | 4 | kV | HBM (printed ±4) | 5 | |||
| Driver propagation delay | tDPLH, tDPHL | 50 | ns | Fig 2 and 5, RL=54Ω, CL=50pF | 5 | ||
| Driver output skew | tDSKEW | 10 | ns | Fig 2 and 5, RL=54Ω, CL=50pF | 5 | ||
| Driver rise or fall time | tDR, tDF | 20 | ns | Fig 2 and 5, RL=54Ω, CL=50pF | 5 | ||
| Maximum data rate | fMAX | 2.5 | Mbps | 5 | |||
| Driver enable to output high | tDZH | 150 | ns | Fig 3 and 6, CL=100pF, S3 closed | 5 | ||
| Driver enable to output low | tDZL | 150 | ns | Fig 3 and 6, CL=100pF, S2 closed | 5 | ||
| Driver disable time from low | tDLZ | 100 | ns | Fig 3 and 6, CL=15pF, S2 closed | 5 | ||
| Driver disable time from high | tDHZ | 100 | ns | Fig 3 and 6, CL=15pF, S3 closed | 5 | ||
| Driver enable from shutdown to output high | tDZH(SHDN) | 2200 | ns | Fig 3 and 6, CL=15pF, S3 closed | 5 | ||
| Driver enable from shutdown to output low | tDZL(SHDN) | 2200 | ns | Fig 3 and 6, CL=15pF, S2 closed | 5 | ||
| Time to shutdown (driver) | tSHDN | 50 | 350 | 700 | ns | 5 | |
| Receiver propagation delay | tRPLH, tRPHL | 50 | ns | Fig 7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns | 6 | ||
| Receiver output skew | tRSKEW | 20 | ns | Fig 7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns | 6 | ||
| Receiver enable to output low | tRZL | 50 | ns | Fig 4 and 9, S1=-1.5V, S2 to VCC | 6 | ||
| Receiver enable to output high | tRZH | 50 | ns | Fig 4 and 9, S1=+1.5V, S2 to GND | 6 | ||
| Receiver disable time from low | tRLZ | 50 | ns | Fig 4 and 9, S1=-1.5V, S2 to VCC | 6 | ||
| Receiver disable time from high | tRHZ | 50 | ns | Fig 4 and 9, S1=+1.5V, S2 to GND | 6 | ||
| Receiver enable from shutdown to output high | tRZH(SHDN) | 2200 | ns | Fig 4 and 9, S1=-1.5V, S2 to VCC | 6 | ||
| Receiver enable from shutdown to output low | tRZL(SHDN) | 2200 | ns | Fig 4 and 9, S1=+1.5V, S2 to GND | 6 | ||
| Time to shutdown (receiver) | tSHDN | 50 | 350 | 700 | ns | 6 | |
| Supply voltage | VCC | 6 | V | 3 | |||
| Control input voltage | RE, DE | -0.3 | 6 | V | 3 | ||
| Driver input voltage | DI | -0.3 | 6 | V | 3 | ||
| Driver output voltage | A, B | -7 | 12 | V | 3 | ||
| Receiver input voltage | A, B | -7 | 12 | V | 3 | ||
| Receiver output voltage | RO | -0.3 | V | upper limit printed as VCC+0.3 | 3 | ||
| Operating temperature range | -40 | 85 | ℃ | HGX485EI | 3 | ||
| Storage temperature | -65 | 150 | ℃ | 3 | |||
| Lead temperature | TLEAD | 260 | ℃ | soldering 10s | 3 |
CAD (KiCad official)
- Symbol:
HGX485EIMM - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files:
hgx485eimm-etched.step/hgx485eimm-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hgx485eimm.step/hgx485eimm.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (17 pp, sha256
d939f6bd855e4a9f, retrieved 2026-10-22, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).