Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

HGX3485EIM

HGSEMI · RS-485 / RS-422 ICs · SOP-8

HGX3485EIM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with /RE low, RO goes high when A-B is at or above +200 mV and goes low when A-B is at or below -200 mV.
2 /RE input Active-low receiver output enable: a high level puts RO in high impedance, and /RE high with DE low puts the device into low-power shutdown.
3 DE input Driver output enable: a high level enables the driver outputs and a low level puts them in high impedance; with /RE high and DE low the device enters shutdown.
4 DI input Driver input: while DE is high, a low on DI drives A low and B high, and a high on DI drives A high and B low.
5 GND power_in Ground reference for the device; all voltages are referenced to this pin.
6 A bidirectional Non-inverting receiver input and non-inverting driver output on the RS-485 bus.
7 B bidirectional Inverting receiver input and inverting driver output on the RS-485 bus; bus-side input voltage is rated -7 V to +13 V.
8 VCC power_in Supply pin; the device operates from 3.0 V to 3.6 V (3.3 V ±10%), with an absolute maximum supply of +7 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Interface
Pins 8

CAD (KiCad official)

  • Symbol: HGX3485EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hgx3485eim-etched.step / hgx3485eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hgx3485eim.step / hgx3485eim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (11 pp, sha256 3177a1be30293a81, retrieved 2026-10-09, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF