main
History Download
Ray Publish 0.1.0 003d7e4 8h ago

HGX3232ECMT

HGSEMI · RS232 ICs · TSSOP-16

HGX3232ECMT from HGSEMI, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 C1+ passive Positive terminal for the first charge pump capacitor, which uses a 0.1 µF capacitor for 3.3V operation.
2 V+ power_out Doubled voltage terminal generated by the charge pump; V+ may have a maximum magnitude of +7V and V+ +
3 C1- passive Negative terminal for the first charge pump capacitor.
4 C2+ passive Positive terminal for the second charge pump capacitor.
5 C2- passive Negative terminal for the second charge pump capacitor.
6 V- power_out Inverted voltage terminal generated by the charge pump; V- may have a maximum magnitude of 7V and its absolute addition with V+ must not exceed 13 V.
7 T2OUT output Second RS-232 transmitter output, with a transmitter output voltage range of ±13.2 V.
8 R2IN input Second RS-232 receiver input, with a receiver input voltage operating range of -25 V to 25 V.
9 R2OUT output Second receiver TTL/CMOS output, referenced to VCC.
10 T2IN input Second transmitter logic input, with a transmitter input voltage range of -0.3 V to 6 V.
11 T1IN input First transmitter logic input, with a transmitter input voltage range of -0.3 V to 6 V.
12 R1OUT output First receiver TTL/CMOS output, referenced to VCC.
13 R1IN input First RS-232 receiver input, with a receiver input voltage operating range of -25 V to 25 V.
14 T1OUT output First RS-232 transmitter output, with a transmitter output voltage range of ±13.2 V.
15 GND power_in Ground reference for the device.
16 VCC power_in Supply voltage, 3.3 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package TSSOP-16
Category Interface
Pins 16

CAD (KiCad official)

  • Symbol: HGX3232ECMT
  • Footprint: Package_SO:TSSOP-16_4.4x5mm_P0.65mm
  • 3D model: TSSOP-16 (KiCad packages3D, STEP)
  • 3D model files: hgx3232ecmt-etched.step / hgx3232ecmt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hgx3232ecmt.step / hgx3232ecmt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (12 pp, sha256 9a64105cb514876a, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF