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HGX3232AEIN
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HGSEMI RS232 ICs, DIP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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HGX3232AEIN
HGSEMI · RS232 ICs · DIP-16
HGX3232AEIN from HGSEMI, in a DIP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | C1+ | passive | Positive terminal of the boost charge-pump capacitor. |
| 2 | V+ | power_out | Charge-pump generated +5.4 V output. |
| 3 | C1- | passive | Negative terminal of the boost charge-pump capacitor. |
| 4 | C2+ | passive | Positive terminal of the inverting charge-pump capacitor. |
| 5 | C2- | passive | Negative terminal of the inverting charge-pump capacitor. |
| 6 | V- | power_out | Charge-pump generated -5.4 V output. |
| 7 | T2OUT | output | Second RS-232 driver output. |
| 8 | R2IN | input | Second RS-232 receiver input. |
| 9 | R2OUT | output | Second TTL/CMOS receiver output. |
| 10 | T2IN | input | Second TTL/CMOS driver input. |
| 11 | T1IN | input | First TTL/CMOS driver input. |
| 12 | R1OUT | output | First TTL/CMOS receiver output. |
| 13 | R1IN | input | First RS-232 receiver input. |
| 14 | T1OUT | output | First RS-232 driver output. |
| 15 | GND | power_in | Ground reference. |
| 16 | VCC | power_in | Supply voltage input, +3 V to +5.5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | DIP-16 |
| Category | Interface |
| Pins | 16 |
CAD (KiCad official)
- Symbol:
HGX3232AEIN - Footprint:
Package_DIP:DIP-16_W7.62mm - 3D model: DIP-16 (KiCad packages3D, STEP)
- 3D model files:
hgx3232aein-etched.step/hgx3232aein-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hgx3232aein.step/hgx3232aein.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (20 pp, sha256
49030f2360ade78f, retrieved 2026-10-16, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HGX3232AEIN
**HGSEMI** · RS232 ICs · DIP-16
HGX3232AEIN from HGSEMI, in a DIP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | C1+ | passive | Positive terminal of the boost charge-pump capacitor. |
| 2 | V+ | power_out | Charge-pump generated +5.4 V output. |
| 3 | C1- | passive | Negative terminal of the boost charge-pump capacitor. |
| 4 | C2+ | passive | Positive terminal of the inverting charge-pump capacitor. |
| 5 | C2- | passive | Negative terminal of the inverting charge-pump capacitor. |
| 6 | V- | power_out | Charge-pump generated -5.4 V output. |
| 7 | T2OUT | output | Second RS-232 driver output. |
| 8 | R2IN | input | Second RS-232 receiver input. |
| 9 | R2OUT | output | Second TTL/CMOS receiver output. |
| 10 | T2IN | input | Second TTL/CMOS driver input. |
| 11 | T1IN | input | First TTL/CMOS driver input. |
| 12 | R1OUT | output | First TTL/CMOS receiver output. |
| 13 | R1IN | input | First RS-232 receiver input. |
| 14 | T1OUT | output | First RS-232 driver output. |
| 15 | GND | power_in | Ground reference. |
| 16 | VCC | power_in | Supply voltage input, +3 V to +5.5 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | DIP-16 |
| Category | Interface |
| Pins | 16 |
## CAD (KiCad official)
- Symbol: `HGX3232AEIN`
- Footprint: `Package_DIP:DIP-16_W7.62mm`
- 3D model: DIP-16 (KiCad packages3D, STEP)
- 3D model files: `hgx3232aein-etched.step` / `hgx3232aein-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hgx3232aein.step` / `hgx3232aein.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HGSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603074568898686976) (20 pp, sha256 `49030f2360ade78f`, retrieved 2026-10-16, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hgx3232aein-datasheet.pdf)