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HGX3088EIM

Public Made by Adom

by adom

HGSEMI RS-485/RS-422 ICs, SOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Generated by kicad-footprint-generator · KiCad file format 20260206
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docs hgx3088eim: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 5d ago
viewers hgx3088eim: viewers · Ray 29d ago
hgx3088eim-etched.fit.json hgx3088eim: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 5d ago
hgx3088eim-etched.glb hgx3088eim: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 5d ago
hgx3088eim-etched.step hgx3088eim: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 5d ago
hgx3088eim.glb Publish 0.1.0 · Ray 29d ago
hgx3088eim.kicad_mod Publish 0.1.0 · Ray 29d ago
hgx3088eim.kicad_sym Publish 0.1.0 · Ray 29d ago
hgx3088eim.lbr Publish 0.1.0 · Ray 29d ago
hgx3088eim.step Publish 0.1.0 · Ray 29d ago
package.json Publish 0.1.0 · Ray 29d ago
page.json hgx3088eim: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding) · Ray 16h ago
README.md hgx3088eim: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray 19d ago

HGX3088EIM

HGSEMI · RS-485/RS-422 ICs · SOP-8

HGX3088EIM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output. When RE is low and (A-B) ≥ -50mV, RO is driven high; when (A-B) ≤ -200mV, RO is driven low. High-Z when receiver is disabled.
2 RE input Receiver output enable, active-low. RO is enabled when RE is low; RO is high-impedance when RE is high. When RE is high AND DE is low the device enters low-power shutdown mode. Hot-swap input structure.
3 DE input Driver output enable, active-high. Driver outputs A/B are enabled when DE is high and high-impedance when DE is low. When RE is high AND DE is low the device enters low-power shutdown mode. Hot-swap input structure.
4 DI input Driver input. When DE is high, DI low drives A low and B high; DI high drives A high and B low. VIH = 2V min, VIL = 0.8V max.
5 GND power_in Ground reference.
6 A bidirectional Non-inverting receiver input AND non-inverting driver output (half-duplex bus pin). Tie through the RS-485 termination network to the differential bus. Absolute max: -7V to +12V. ±16kV IEC 61000-4-2 contact ESD protected.
7 B bidirectional Inverting receiver input AND inverting driver output (half-duplex bus pin). Tie through the RS-485 termination network to the differential bus. Absolute max: -7V to +12V. ±16kV IEC 61000-4-2 contact ESD protected.
8 VCC power_in Positive supply, 4.5V ≤ VCC ≤ 5.5V. Bypass to GND with a 0.1µF ceramic capacitor. Absolute max 6V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Comm/UART
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • HGX3088EIM/TR
  • HGX3088ECM/TR
  • HGX3088EIN
  • HGX3088ECN
  • HGX3088EIMM/TR
  • HGX3088ECMM/TR
  • HGX3088EIM8/TR
  • HGX3088ECM8/TR

CAD (KiCad official)

  • Symbol: HGX3088EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hgx3088eim-etched.step / hgx3088eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hgx3088eim.step / hgx3088eim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (28 pp, sha256 f6d3ad97a8f240e8, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF